Taiwan Semiconductor Corporation MMBD3004 RFG
- Part No.:
- MMBD3004 RFG
- Manufacturer:
- Taiwan Semiconductor Corporation
- Category:
- Single Diodes
- Package:
- TO-236-3, SC-59, SOT-23-3
- Datasheet:
-
MMBD3004 RFG.pdf
- Description:
- DIODE GEN PURP 350V 225MA SOT23
- Quantity:
- Payment:

- Shipping:

Inventory:5,870
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
MMBD3004 RFG from Taiwan Semiconductor is a fast-switching SOT-23 surface-mount silicon switching diode rated for 225 mA forward current and 350 V repetitive peak reverse voltage, with 4 A non-repetitive surge capability and 1.25 V forward voltage at 200 mA - used in high-efficiency SMPS secondary-side snubbing and flyback clamp circuits.
For engineers reviewing the MMBD3004 RFG datasheet, MMBD3004 RFG pinout, MMBD3004 RFG application, or MMBD3004 RFG equivalent, key selection criteria include reverse recovery time (≤50 ns), junction capacitance (≤5 pF), thermal resistance (357 °C/W), RoHS/halogen-free compliance, and J-STD-020 Level 1 moisture sensitivity.
Technical Context
This discrete switching diode employs planar epitaxial construction to achieve fast reverse recovery (trr ≤ 50 ns) and low junction capacitance (CJ ≤ 5 pF at 1 V), enabling efficient high-frequency switching in DC-DC converters and flyback topologies. Its 350 V VRRM rating supports operation across universal-input AC/DC adapters and industrial power supplies.
The device operates over –65 °C to +150 °C junction temperature range and features matte tin-plated leads compliant with J-STD-002 solderability and JESD201 Class 1A whisker resistance. Thermal performance is defined by RθJA = 357 °C/W in standard SOT-23 mounting conditions.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| IF (Continuous Forward Current) | 225 mA - defines maximum steady-state conduction capability without derating at TA = 25°C |
| VRRM (Repetitive Peak Reverse Voltage) | 350 V - sets maximum allowable reverse bias before breakdown in repetitive switching applications |
| IFSM (Non-repetitive Surge Current) | 4 A (1 μs pulse) - supports transient energy absorption during power-up or fault events |
| VF at IF = 200 mA | 1.25 V - determines forward conduction loss and associated heat generation at typical operating point |
| trr (Reverse Recovery Time) | ≤50 ns - limits switching losses and EMI generation in >100 kHz SMPS designs |
| CJ (Junction Capacitance) | ≤5 pF @ 1 MHz, 1 V - minimizes capacitive loading on high-speed switching nodes |
| RθJA | 357 °C/W - quantifies thermal bottleneck from junction to ambient in standard SOT-23 PCB layout |
Pinout & Package
Package: SOT-23 - three-terminal plastic surface-mount package with gull-wing leads, UL 94 V-0 rated molding compound, and 8 ± 0.5 mg mass.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Anode (Pin 1) | Forward current entry node | Connected to higher-potential side in forward-biased operation; requires trace routing for thermal relief in high-current paths |
| Cathode (Pin 2) | Forward current exit node / reverse voltage reference | Typically tied to ground or low-side switch node; serves as return path and reverse-blocking terminal |
| Collector / NC (Pin 3) | No-connect (internal die attach flag) | Electrically isolated; must not be soldered or connected to avoid mechanical stress or parasitic coupling |
Key Features
| Feature | Design Value |
|---|---|
| Fast switching speed | trr ≤ 50 ns enables use in 300–500 kHz SMPS without excessive switching loss or ringing |
| High surge current capability | 4 A IFSM withstands inrush and fault transients common in offline power supplies |
| J-STD-020 Level 1 moisture sensitivity | Zero bake requirement prior to reflow - reduces manufacturing overhead and handling risk |
| RoHS & halogen-free compliance | Meets IEC 61249-2-21 and EU RoHS directives for environmentally constrained end equipment |
| SOT-23 automated placement compatibility | Standard footprint and lead geometry support high-yield pick-and-place assembly at >20,000 UPH |
Applications
| AC/DC Adapter Secondary Clamp | Flyback Converter Snubber Diode |
|---|---|
Use Scenario: Clamping voltage spikes across transformer secondary windings during MOSFET turn-off in universal-input 5–24 W AC/DC adapters. IC Role / Device Role / Timing Role: Fast-recovery clamping diode absorbing leakage inductance energy and limiting voltage overshoot on secondary rectifier. Use Value: 350 V VRRM and ≤50 ns trr prevent secondary-side overvoltage failure while minimizing conduction loss via 1.25 V VF at 200 mA. | Use Scenario: Placed across RCD snubber network in discontinuous conduction mode (DCM) flyback converters for consumer electronics. IC Role / Device Role / Timing Role: Rapidly conducts snubber capacitor discharge current during each switching cycle to dissipate stored energy. Use Value: Low CJ (≤5 pF) avoids slowing snubber timing; 4 A IFSM handles repetitive 1–2 μs current pulses without degradation. |
| Industrial DC-DC Isolated Bias Supply | LED Driver Flyback Auxiliary Winding Rectifier |
Use Scenario: Rectifying auxiliary winding output in isolated 12–24 V bias supplies for gate drivers and controllers in motor drives. IC Role / Device Role / Timing Role: High-voltage rectifier delivering stable low-power supply independent of main output regulation. Use Value: –65 °C to +150 °C TJ range ensures reliability under extended industrial ambient conditions; 357 °C/W RθJA allows operation without heatsink at <100 mW dissipation. | Use Scenario: Converting auxiliary winding AC into DC for LED string current sensing and feedback circuitry in smart lighting modules. IC Role / Device Role / Timing Role: Low-loss, high-reliability rectifier in space-constrained LED driver PCBs where thermal margin is limited. Use Value: Matte tin plating ensures robust solder joint integrity after multiple reflow cycles; Level 1 MSL eliminates floor-life tracking overhead. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar switching diode applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ON Semiconductor MMBD3004LT1G | VRRM = 350 V, trr = 50 ns, VF = 1.25 V @ 200 mA - identical electrical specs; same SOT-23 package but different marking (HC vs. 3004) | Qualified per AEC-Q101; suitable for automotive-grade auxiliary supplies where qualification is mandatory | Select when automotive qualification or alternate logistics chain is required |
| Diodes Incorporated BAV99W-7-F | Dual-series configuration; VRRM = 350 V per diode, trr = 4 ns (faster), VF = 1.25 V @ 200 mA - lower trr but dual-die structure occupies same footprint | Enables dual-path clamping or level-shifting in compact layouts; not drop-in due to internal series connection | Choose when faster recovery or dual-diode functionality is needed - requires schematic and layout review |
Compared with MMBD3004 RFG, MMBD3004LT1G offers identical parametric performance with automotive qualification, while BAV99W-7-F provides significantly faster recovery (4 ns) in a dual-diode configuration - neither is pin-compatible without verification of internal topology and marking alignment.
Availability
MMBD3004 RFG is available at Aetrix Electronics and suitable for switching mode power supply (SMPS), flyback converter snubbers, and industrial DC-DC bias supplies requiring stable component supply, full RoHS/halogen-free compliance, and J-STD-020 Level 1 handling.
Supply support for MMBD3004 RFG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Taiwan Semiconductor Corporation (TSC) is a vertically integrated analog and discrete semiconductor manufacturer headquartered in Hsinchu, Taiwan, serving global power management and signal conditioning markets since 1979.
The MMBD3004 RFG belongs to TSC's high-voltage switching diode product line, engineered specifically for efficiency-critical, high-frequency SMPS applications where low trr, controlled VF, and robust surge tolerance are essential.
FAQ
What is the maximum junction temperature rating for the MMBD3004 RFG?
The MMBD3004 RFG has a specified junction temperature range of –65 °C to +150 °C. This wide operating range allows reliable deployment in industrial environments and enclosed power supplies where ambient temperatures exceed 85 °C. Derating curves in the datasheet define safe power dissipation versus ambient temperature, with 350 mW maximum at 25 °C ambient.
Is the MMBD3004 RFG suitable for use in automotive applications?
The MMBD3004 RFG is not AEC-Q101 qualified and is not recommended for automotive safety-critical systems. While its electrical specs (350 V VRRM, 150 °C TJ max) meet some automotive voltage/temperature requirements, Taiwan Semiconductor does not certify this variant for automotive use. For such applications, consider the AEC-Q101-qualified MMBD3004LT1G instead.
What does the 'RFG' suffix indicate in MMBD3004 RFG?
The 'RFG' suffix in MMBD3004 RFG denotes tape-and-reel packaging: 3,000 units per 7-inch reel, with RoHS-compliant, halogen-free construction and J-STD-020 Level 1 moisture sensitivity. It distinguishes this version from bulk (RF) or other packaging variants, and confirms full compliance with IEC 61249-2-21 and EU RoHS directives.
How does the MMBD3004 RFG compare to general-purpose rectifiers like 1N4148?
The MMBD3004 RFG offers higher VRRM (350 V vs. 100 V), higher IFSM (4 A vs. 2 A), and tighter trr control (≤50 ns vs. typically 4 ns but less consistent) than 1N4148. Its SOT-23 package also supports automated assembly better than DO-35. However, 1N4148 remains preferable for low-voltage, low-energy signal switching due to lower VF and wider availability.
Can the MMBD3004 RFG replace the MMBD3004CA or MMBD3004CC in existing designs?
Yes - MMBD3004 RFG, MMBD3004CA, and MMBD3004CC share identical electrical specifications, thermal performance, and SOT-23 mechanical dimensions. The only differences are marking codes (HC/RA/PZ) and packaging format. No layout or schematic changes are needed when substituting MMBD3004 RFG for CA or CC versions in production.
MMBD3004 RFG Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Taiwan Semiconductor Corporation
- Series:
- -
- Package/Case:
- TO-236-3, SC-59, SOT-23-3
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Technology:
- Standard
- Voltage - DC Reverse (Vr) (Max):
- 350 V
- Current - Average Rectified (Io):
- 225mA
- Voltage - Forward (Vf) (Max) @ If:
- 1.25 V @ 200 mA
- Speed:
- Fast Recovery =< 500ns, > 200mA (Io)
- Reverse Recovery Time (trr):
- 50 ns
- Current - Reverse Leakage @ Vr:
- 100 nA @ 240 V
- Capacitance @ Vr, F:
- 5pF @ 1V, 1MHz
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- SOT-23
- Operating Temperature - Junction:
- -65°C ~ 150°C
MMBD3004 RFG FAQ
1.How can I place an order for MMBD3004 RFG through Aetrix?
Please submit a Request for Quotation (RFQ) for MMBD3004 RFG on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MMBD3004 RFG reliable?
The price and inventory of MMBD3004 RFG are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MMBD3004 RFG is usually 5 days.
3.What payment methods are accepted for MMBD3004 RFG?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MMBD3004 RFG transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MMBD3004 RFG?
MMBD3004 RFG orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MMBD3004 RFG order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MMBD3004 RFG?
For technical support, including MMBD3004 RFG datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MMBD3004 RFG requirements.
6.How does Aetrix verify that MMBD3004 RFG is sourced from the original manufacturer or authorized distributors?
All MMBD3004 RFG products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MMBD3004 RFG meets industry standards.
7.What is the process for return or replacement of MMBD3004 RFG?
All MMBD3004 RFG units undergo pre-shipment inspection (PSI). If there is an issue with MMBD3004 RFG, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MMBD3004 RFG part is unused and in its original packaging.
Return procedure for MMBD3004 RFG:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MMBD3004 RFG Tags

-
1N4448X-TP
Micro Commercial Co

-
1N4148WX-TP
Micro Commercial Co

-
1N4148TR
onsemi

-
MMSD4148T1G
onsemi

-
MMBD914LT3G
onsemi

-
BAS16HT1G
onsemi

-
1N914BWT
onsemi

-
BAS21LT1G
onsemi

-
LL4148
onsemi

-
BAS16LT1G
onsemi

-
MMSD914T1G
onsemi

-
BAV21W-7-F
Diodes Incorporated
Tech Hub
Counterfeit components can hide behind convincing markings and passing basic function tests. This engineering reference covers source traceability, external inspection, X-ray, XRF, electrical testing, …
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…

