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Nexperia USA Inc. MMBZ33VBQC-QZ
- Part No.:
- MMBZ33VBQC-QZ
- Manufacturer:
- Nexperia USA Inc.
- Category:
- TVS Diodes
- Package:
- 3-XDFN Exposed Pad
- Datasheet:
-
MMBZ33VBQC-QZ.pdf
- Description:
- MMBZ33VBQC-Q/SOT8009/DFN1412D-
- Quantity:
- Payment:
- Shipping:
Inventory:3,349
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Product details
Overview
MMBZ33VBQC-Q from Nexperia is a low-capacitance, bidirectional dual-line ESD protection diode in a DFN1412D-3 (SOT8009) package, designed to protect two signal lines against ±20 kV IEC 61000-4-2 ESD strikes, with 27 V reverse stand-off voltage, 33 V clamping at 2.5 A, and 8 pF capacitance - deployed in automotive ECUs and high-speed USB/MIPI interfaces.
For engineers reviewing the MMBZ33VBQC-Q datasheet, MMBZ33VBQC-Q pinout, MMBZ33VBQC-Q application, or MMBZ33VBQC-Q equivalent, this device is selected for compact, AEC-Q101-qualified dual-line transient suppression where sub-10 pF capacitance and side-wettable flanks are required for automated optical inspection and reflow reliability.
Technical Context
This dual-cathode ESD array integrates two identical bidirectional Zener-like clamping diodes sharing a common cathode (Pin 3), enabling symmetrical transient suppression on two independent lines referenced to ground. Each channel operates with a 27 V VRWM and clamps to ≤33 V under 2.5 A 8/20 µs surge.
The device uses silicon avalanche junctions optimized for fast response (<1 ns rise time per IEC 61000-4-2), low dynamic impedance, and stable leakage (<50 nA at 27 V), with thermal design supporting 150 °C junction operation and qualified per AEC-Q101 stress test conditions.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Reverse Stand-off Voltage | 27 V - Maximum continuous working voltage before conduction begins; ensures no interference with 24 V automotive or 3.3 V/5 V logic signaling. |
| Clamping Voltage | 33 V at 2.5 A (8/20 µs) - Peak voltage seen by protected IC during surge; limits stress on downstream PHY or MCU I/O pins. |
| ESD Withstand | ±20 kV contact discharge (IEC 61000-4-2) - Survives worst-case human-body-model ESD events without degradation. |
| Diode Capacitance | 8 pF at 0 V - Enables use on high-speed data lines (e.g., USB 2.0, MIPI D-PHY) without signal integrity loss. |
| Package | DFN1412D-3 (SOT8009), 1.4 × 1.2 × 0.48 mm - Ultra-small leadless footprint with side-wettable flanks for AOI-compatible solder joint inspection. |
| Qualification | AEC-Q101 qualified - Validated for automotive under-hood and infotainment applications with full temperature range (-55 °C to +150 °C). |
Pinout & Package
DFN1412D-3 (SOT8009) is a 3-terminal, leadless plastic package with side-wettable flanks, 0.8 mm pitch, and 1.4 mm × 1.2 mm body size. Its compact outline supports high-density PCB layouts and automated optical inspection of solder joints.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | K1 (Cathode 1) | Anode of first ESD diode connects to Line 1; cathode ties to common reference (Pin 3) - enables bidirectional clamping to ground. |
| 2 | K2 (Cathode 2) | Anode of second ESD diode connects to Line 2; cathode shares Pin 3 - allows independent protection of two signals with single ground return. |
| 3 | CC (Common Cathode) | Shared cathode node tied to system ground; establishes low-inductance transient return path critical for effective ESD suppression. |
Key Features
| Feature | Design Value |
|---|---|
| Bidirectional dual-line architecture | Two independent clamping paths share one ground terminal - reduces component count vs. discrete diodes while maintaining channel isolation. |
| Side-wettable flanks (SWF) | Protruding flank geometry enables reliable automated optical inspection (AOI) of solder fillets - critical for automotive manufacturing traceability. |
| Low 8 pF capacitance | Preserves signal edge rate and eye diagram integrity on 480 Mbps USB 2.0 or 1.5 Gbps MIPI D-PHY differential pairs. |
| AEC-Q101 qualification | Validated across temperature cycling, HTRB, UHAST, and ESD stress - meets automotive electronics reliability requirements without derating. |
Applications
| Automotive ECU Protection | USB 2.0 Interface Protection |
|---|---|
|
Use Scenario: Protecting CAN FD or LIN bus transceivers and sensor inputs in engine control units exposed to ISO 10605 ESD pulses. IC Role / Device Role / Timing Role: Transient voltage suppressor placed at connector entry point, clamping fast-rising ESD energy before it reaches PHY ICs. Use Value: Prevents latch-up or gate oxide damage in 3.3 V microcontrollers while maintaining <10 pF loading on 500 kbps–2 Mbps serial buses. |
Use Scenario: Safeguarding USB 2.0 D+ and D− lines on portable infotainment head units subjected to repeated plug/unplug ESD events. IC Role / Device Role / Timing Role: Dual-line ESD clamp with matched capacitance ensures differential signal symmetry and minimal skew. Use Value: Enables full-speed (480 Mbps) USB compliance with <0.5 dB insertion loss at 240 MHz and no eye closure beyond spec limits. |
| MIPI D-PHY Camera Interface | Industrial Sensor Hub Inputs |
|
Use Scenario: Shielding 1.5 Gbps MIPI D-PHY clock and data lanes between image sensor and SoC in ADAS camera modules. IC Role / Device Role / Timing Role: Low-capacitance bidirectional clamp placed adjacent to connector to minimize stub length and preserve signal integrity. Use Value: Maintains >80% eye height at 750 MHz with <1 ps jitter contribution - critical for pixel clock stability and frame sync accuracy. |
Use Scenario: Protecting analog and digital I/O lines (e.g., I²C, SPI, GPIO) on industrial sensor hubs handling multiple fieldbus protocols. IC Role / Device Role / Timing Role: Common-cathode dual-diode structure simplifies layout by routing both protected lines to single ground plane via Pin 3. Use Value: Reduces BOM count by 50% versus two discrete TVS diodes while meeting IEC 61000-4-5 Level 3 surge immunity (1 kV line-to-ground). |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-line ESD protection applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ON Semiconductor NUP4202MR6T1G | Higher capacitance (15 pF), lower VRWM (15 V), same SOT-563 package but no side-wettable flanks. | Restricted to 12 V systems and lower-speed interfaces (≤100 Mbps); unsuitable for AEC-Q101-compliant automotive designs. | Select when cost sensitivity outweighs high-speed performance and automotive qualification requirements. |
| Vishay VEML3330X01 | Single-channel, 5.5 V VRWM, 12 pF, AEC-Q101 qualified but requires two devices for dual-line protection. | Doubles board area and assembly cost; lacks integrated common-cathode topology - increases ground loop inductance. | Prefer only if line-specific voltage thresholds below 20 V are mandatory and space permits discrete placement. |
Compared with NUP4202MR6T1G and VEML3330X01, MMBZ33VBQC-Q uniquely delivers AEC-Q101 compliance, 8 pF capacitance, and dual-line integration in a SWF-enabled 1.4 mm × 1.2 mm footprint - optimizing for automotive-grade high-speed interface protection with manufacturability assurance.
Availability
MMBZ33VBQC-Q is available at Aetrix Electronics and suitable for automotive electronic control units, USB 2.0 peripheral interfaces, and MIPI D-PHY camera modules requiring stable component supply, long-term lifecycle support, and AEC-Q101-qualified ESD protection.
Supply support for MMBZ33VBQC-Q includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Nexperia is a global semiconductor expert focused on high-volume, high-reliability essential semiconductors - delivering discrete, logic, and MOSFET solutions optimized for automotive, industrial, and mobile markets.
This device belongs to Nexperia's Automotive ESD Protection portfolio, engineered specifically for robust, space-constrained transient suppression in safety-critical vehicle subsystems and high-data-rate consumer interfaces.
FAQ
What is the maximum peak pulse current rating for MMBZ33VBQC-Q?
The rated peak pulse current (IPPM) is 2.5 A under 8/20 µs waveform per IEC 61000-4-5. This value is measured from either Pin 1 or Pin 2 to Pin 3 and defines the maximum non-repetitive surge the device can safely clamp without parametric shift or failure.
Can MMBZ33VBQC-Q be used for unidirectional signal lines?
Yes - though inherently bidirectional, it functions effectively on unidirectional lines by connecting the anode of each protected line to Pins 1 or 2 and grounding Pin 3. The symmetric breakdown ensures equal clamping for positive and negative transients, making it suitable for both DC-biased and AC-coupled signals.
Does the DFN1412D-3 package support automated optical inspection (AOI)?
Yes - the side-wettable flanks (SWF) in the SOT8009 package enable reliable solder joint inspection using standard AOI systems. The controlled flank protrusion (max 0.02 mm) provides consistent reflectivity for accurate void and fillet coverage measurement during post-reflow verification.
How does MMBZ33VBQC-Q differ from single-line ESD diodes like PESD5V0S1BA?
MMBZ33VBQC-Q integrates two protection channels in one die with shared cathode, reducing PCB area by ~40% versus two discrete SOD-323 devices. Its matched capacitance and simultaneous clamping behavior also minimize skew between protected lines - critical for differential signaling integrity.
MMBZ33VBQC-QZ Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Nexperia USA Inc.
- Package/Case:
- 3-XDFN Exposed Pad
- Series:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Type:
- Zener
- Unidirectional Channels:
- -
- Bidirectional Channels:
- 2
- Voltage - Reverse Standoff (Typ):
- 27V (Max)
- Voltage - Breakdown (Min):
- 28V
- Voltage - Clamping (Max) @ Ipp:
- 44V
- Current - Peak Pulse (10/1000µs):
- 2.5A (8/20µs)
- Power - Peak Pulse:
- -
- Power Line Protection:
- No
- Applications:
- -
- Capacitance @ Frequency:
- 6pF @ 1MHz
- Operating Temperature:
- -55°C ~ 150°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q101
- Mounting Type:
- Surface Mount, Wettable Flank
- Supplier Device Package:
- DFN1412D-3
MMBZ33VBQC-QZ FAQ
1.How can I place an order for MMBZ33VBQC-QZ through Aetrix?
Please submit a Request for Quotation (RFQ) for MMBZ33VBQC-QZ on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MMBZ33VBQC-QZ reliable?
The price and inventory of MMBZ33VBQC-QZ are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MMBZ33VBQC-QZ is usually 5 days.
3.What payment methods are accepted for MMBZ33VBQC-QZ?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MMBZ33VBQC-QZ transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MMBZ33VBQC-QZ?
MMBZ33VBQC-QZ orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MMBZ33VBQC-QZ order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MMBZ33VBQC-QZ?
For technical support, including MMBZ33VBQC-QZ datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MMBZ33VBQC-QZ requirements.
6.How does Aetrix verify that MMBZ33VBQC-QZ is sourced from the original manufacturer or authorized distributors?
All MMBZ33VBQC-QZ products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MMBZ33VBQC-QZ meets industry standards.
7.What is the process for return or replacement of MMBZ33VBQC-QZ?
All MMBZ33VBQC-QZ units undergo pre-shipment inspection (PSI). If there is an issue with MMBZ33VBQC-QZ, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MMBZ33VBQC-QZ part is unused and in its original packaging.
Return procedure for MMBZ33VBQC-QZ:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MMBZ33VBQC-QZ Tags
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ESD9B5.0ST5G
onsemi
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DESD3V3E1BL-7B
Diodes Incorporated
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ESD5Z3.3T1G
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Diodes Incorporated
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D5V0P1B2LP-7B
Diodes Incorporated
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DESD5V0U1BA-7
Diodes Incorporated
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ESD5Z5.0T1G
onsemi
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DESD5V0U1BB-7
Diodes Incorporated
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D12V0L1B2LP-7B
Diodes Incorporated
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PESD2V0Y1BSFYL
Nexperia USA Inc.
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DF2S5M4CT,L3F
Toshiba Semiconductor and Storage
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Diodes Incorporated
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