Monolithic Power Systems Inc. MP201DS-LF-P
- Part No.:
- MP201DS-LF-P
- Manufacturer:
- Monolithic Power Systems Inc.
- Category:
- Power Management - Specialized
- Package:
- 8-SOIC (0.154", 3.90mm Width)
- Datasheet:
-
MP201DS-LF-P.pdf
- Description:
- NRFND
- Quantity:
- Payment:

- Shipping:

Inventory:4,519
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
MP201DS-LF-P from Monolithic Power Systems is a dying gasp storage and release control IC designed for backup power hold-up in broadband access equipment. It charges an external storage capacitor to a user-programmable voltage (up to 32 V) during normal operation, then dumps up to 2.5 A into the input rail when VIN drops below a programmable release threshold (e.g., 10.2 V), sustaining regulated input voltage for critical system response during AC loss. Used in DSL/PON modems and home gateways.
For engineers reviewing the MP201DS-LF-P datasheet, MP201DS-LF-P pinout, MP201DS-LF-P application, or MP201DS-LF-P equivalent, key selection factors include programmable storage/release voltages via resistor dividers, 2.5 A dump current capability, integrated 260 mA charge current limit, open-drain GASP flag signaling, and SOIC-8 thermal performance (θJA = 90°C/W).
Technical Context
The MP201 implements dual feedback regulation: FB1 monitors and maintains storage capacitor voltage (VSTRG) at a precise 1.00 V reference, while FB2 senses VIN to trigger release when it falls below its 1.00 V threshold. Its internal boost/charge/release circuitry uses the BST pin connected to a DC/DC switch node to enable high-voltage storage charging beyond VIN.
Operation includes three distinct phases: pre-charge (inrush-limited to 260 mA), regulated storage refresh (maintaining VSTRG within ±3% of target), and controlled energy release (dumping up to 2.5 A into VIN with tight regulation near VRELEASE). Thermal shutdown activates at 150°C with 30°C hysteresis.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Input Voltage Range | 4.5 V to 18 V - supports standard 12 V/15 V telecom rails with 2.5 V UVLO hysteresis |
| Storage Voltage Range | VIN to 2×VIN–0.8 V (max 32 V) - enables high-energy density storage using cost-effective electrolytic capacitors |
| Dump Current Limit | 2.0 A (typ), 2.5 A (max) - sustains >1 A load for ~20 ms with 22 V storage and 10.2 V release |
| Charge Current Limit | 260 mA (typ) - prevents inrush damage to storage capacitor and input supply during startup |
| Feedback Reference Voltage | 1.00 V (±3%) on FB1/FB2 - sets storage/release thresholds via external resistor dividers with <50 mV hysteresis |
| GASP Output | Open-drain, 4 mA sink @ 0.3 V - provides TTL-compatible power-fail indicator with 73 μs rise delay |
| Thermal Shutdown | 150°C activation, 30°C hysteresis - protects die under sustained dump or ambient overload conditions |
Pinout & Package
MP201DS-LF-P is housed in a standard SOIC-8 package (5.0 mm × 6.2 mm, 1.27 mm pitch) with exposed pad not present; θJA = 90°C/W on 4-layer PCB per JESD51-7.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| BST | Bootstrap driver | Connects via RC network to DC/DC switch node to enable charge-pump boosting of storage capacitor above VIN |
| VIN | Main input supply | 4.5–18 V rail powering IC core and serving as dump target; requires local decoupling |
| FB2 | Release voltage sense | Inputs divided VIN to set release threshold; 1.00 V reference triggers dump when actual FB2 < 1.00 V |
| GND | System ground reference | Low-impedance return for all analog and power paths; must be tied directly to PCB ground plane |
| FB1 | Storage voltage sense | Inputs divided VSTRG to regulate storage capacitor at precise voltage; 1.00 V reference enables stable refresh |
| GASP | Dying gasp status flag | Open-drain output pulled low when FB2 < 1.00 V - signals imminent power loss to host controller |
| STRG | Storage capacitor interface | High-current path to external storage capacitor; requires short, wide PCB trace to minimize ESR impact |
| VMAX | Internal LDO supply | Requires 2.2 nF ceramic decoupling; powers internal logic and protection circuits independently of VIN |
Key Features
| Feature | Design Value |
|---|---|
| User-programmable storage voltage | Set via R1/R2 divider on FB1 - enables optimal capacitor utilization (e.g., 23 V on 25 V-rated cap) |
| Programmable release voltage | Set via R3/R4 divider on FB2 - allows precise hold-up timing alignment with downstream DC/DC UVLO |
| Integrated 260 mA charge current limiter | Eliminates need for external inrush resistors - reduces BOM count and board space in high-volume modems |
| 2.5 A regulated dump current | Maintains VIN within ±5% of release voltage during discharge - ensures uninterrupted operation of 3.3 V/5 V systems |
| Open-drain GASP flag with 73 μs delay | Provides deterministic early warning of input collapse - enables firmware-controlled graceful shutdown or state save |
Applications
| Cable Modem Power Hold-Up | DSL Gateway Backup |
|---|---|
Use Scenario: AC mains interruption during DOCSIS firmware update or upstream data transmission. IC Role / Device Role / Timing Role: Dying gasp controller maintaining 12 V input rail for >15 ms to complete packet acknowledgment and session teardown. Use Value: Prevents network disconnection alerts and service degradation by sustaining PHY/MAC layer operation through brief outages. | Use Scenario: Brownout event in residential DSLAM-powered gateway causing premature router reset. IC Role / Device Role / Timing Role: Storage/release regulator holding VIN at 10.2 V while downstream buck converter delivers stable 3.3 V to CPU and Ethernet PHY. Use Value: Enables 20+ ms hold-up time with 2200 μF storage cap - sufficient for orderly reboot or alarm reporting before full shutdown. |
| PON ONU Power Fail Response | Home Wi-Fi Access Point Continuity |
Use Scenario: GPON optical signal loss triggering emergency registration reattempt before fiber restoration. IC Role / Device Role / Timing Role: Energy management IC releasing stored charge to maintain 5 V rail for EPON MAC and flash memory write cycles. Use Value: Guarantees 100% successful configuration save and OAM message transmission using 2.5 A dump current into low-ESR input caps. | Use Scenario: Momentary UPS switchover delay in enterprise-grade Wi-Fi AP causing client deauthentication. IC Role / Device Role / Timing Role: Backup supervisor monitoring 12 V PoE input and activating GASP flag to trigger AP's fast-suspend protocol. Use Value: Reduces perceived outage to <100 ms via coordinated hardware/software response - preserves VoIP call continuity and TCP sessions. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dying gasp control applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TPS61094IRTER | Integrates 2.2 F supercapacitor charger + buck-boost; no external storage cap required; 1.8 A max discharge | Targets ultra-low-power IoT nodes; lacks programmable release voltage and GASP flag | Select when board space is constrained and hold-up time ≤5 ms suffices |
| LT4363IMS-1#PBF | Hot-swap controller with surge protection; no storage charging; 3.5 A current limit; no voltage regulation during fault | Designed for inrush limiting and overvoltage protection - not a dying gasp solution | Choose only for primary input protection; requires separate backup circuitry |
Compared with TPS61094IRTER and LT4363IMS-1#PBF, MP201DS-LF-P uniquely combines programmable dual-voltage regulation, 2.5 A dump current, and dedicated GASP signaling - making it the only fit for telecom-grade hold-up requiring precise timing, high energy delivery, and host coordination.
Availability
MP201DS-LF-P is available at Aetrix Electronics and suitable for cable modem design, DSL gateway production, and PON ONU manufacturing requiring stable component supply across multi-year product lifecycles.
Supply support for MP201DS-LF-P includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Monolithic Power Systems (MPS) is a fabless semiconductor company specializing in high-performance analog and power ICs, with design centers in the US, China, and Taiwan.
The MP201 belongs to MPS's Telecom Power Management product line, engineered specifically for broadband access infrastructure where reliable, programmable power fail response is mandatory for service continuity.
FAQ
What is the maximum storage voltage supported by MP201DS-LF-P?
The MP201DS-LF-P supports storage voltages up to 32 V, limited by its absolute maximum STRG pin rating. In practice, the usable range is VIN to (2 × VIN – 0.8 V), allowing 23 V storage on a 12 V input rail. This enables use of standard 25 V electrolytic capacitors at 90% derating, improving size and cost efficiency.
How does the GASP pin function during normal and failing input conditions?
The GASP pin is an open-drain output that remains high-impedance until FB2 voltage drops below 1.00 V (i.e., VIN falls below programmed release threshold). At that point, GASP is actively pulled low with 4 mA sink capability and 0.3 V saturation. Its 73 μs rising delay ensures noise immunity, while sub-microsecond falling edge gives immediate power-loss notification to the host processor.
Can MP201DS-LF-P operate without a DC/DC converter in the system?
No - the BST pin requires connection to a switching node (SW) of an external DC/DC converter to generate the boosted gate drive needed for storage capacitor charging above VIN. Without this, the MP201 can only pre-charge to VIN level (≤18 V) using its internal 260 mA current limit, losing its key high-voltage storage advantage.
What is the recommended layout practice for the STRG pin connection?
The STRG pin must connect to the storage capacitor using the shortest possible, widest copper trace - ideally ≥2 mm wide with multiple vias to inner ground planes. This minimizes parasitic inductance and resistance, ensuring full 2.5 A dump current delivery without voltage droop or oscillation during release. Avoid routing near noisy digital traces or switching nodes.
How is thermal performance affected during sustained dump operation?
During 2.5 A dump at 10.2 V release into a 12 V rail, power dissipation peaks at ~4.5 W in the IC. With θJA = 90°C/W, junction temperature rise exceeds safe limits within milliseconds without heatsinking. Therefore, MP201DS-LF-P relies on short-duration hold-up (typically <30 ms); continuous dump is prevented by thermal shutdown at 150°C with 30°C hysteresis.
Does MP201DS-LF-P require external compensation components?
No external compensation is required for basic operation. The internal control loop is factory-tuned for stability with recommended external components: 2.2 nF on VMAX, 15 pF across R4 in the FB2 divider, and proper placement of R1/R2 close to FB1. Layout adherence - especially short FB trace lengths and solid ground return - is more critical than added compensation.
MP201DS-LF-P Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Monolithic Power Systems Inc.
- Series:
- MP
- Package/Case:
- 8-SOIC (0.154", 3.90mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Not For New Designs
- Applications:
- Energy Storage Device
- Current - Supply:
- 250µA
- Voltage - Supply:
- 4.5V ~ 18V
- Operating Temperature:
- -40°C ~ 125°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-SOIC
MP201DS-LF-P FAQ
1.How can I place an order for MP201DS-LF-P through Aetrix?
Please submit a Request for Quotation (RFQ) for MP201DS-LF-P on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MP201DS-LF-P reliable?
The price and inventory of MP201DS-LF-P are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MP201DS-LF-P is usually 5 days.
3.What payment methods are accepted for MP201DS-LF-P?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MP201DS-LF-P transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MP201DS-LF-P?
MP201DS-LF-P orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MP201DS-LF-P order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MP201DS-LF-P?
For technical support, including MP201DS-LF-P datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MP201DS-LF-P requirements.
6.How does Aetrix verify that MP201DS-LF-P is sourced from the original manufacturer or authorized distributors?
All MP201DS-LF-P products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MP201DS-LF-P meets industry standards.
7.What is the process for return or replacement of MP201DS-LF-P?
All MP201DS-LF-P units undergo pre-shipment inspection (PSI). If there is an issue with MP201DS-LF-P, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MP201DS-LF-P part is unused and in its original packaging.
Return procedure for MP201DS-LF-P:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MP201DS-LF-P Tags

-
TPS2511DGNR
Texas Instruments

-
UTC2000/MG
Microchip Technology

-
TUSB320HAIRWBR
Texas Instruments

-
TPS61252DSGR
Texas Instruments

-
PI5USB30216CXUAEX
Diodes Incorporated
-
SN6501DBVR
Texas Instruments

-
CYPD3177-24LQXQT
Infineon Technologies
-
SN6501QDBVRQ1
Texas Instruments

-
STUSB1600AQTR
STMicroelectronics

-
SN6505BDBVR
Texas Instruments
-
SN6501DBVT
Texas Instruments

-
TPS65150PWPR
Texas Instruments
Tech Hub
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…

