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Monolithic Power Systems Inc. MP5505GL-Z

Part No.:
MP5505GL-Z
Manufacturer:
Monolithic Power Systems Inc.
Category:
Power Management - Specialized
Package:
20-PowerTFQFN
Datasheet:
AetrixMP5505GL-Z.pdf
Description:
POWER MANAGEMENT SPECIALIZED - P
Quantity:
Payment:
Payment
Shipping:
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Inventory:2,546

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Product details

Overview

MP5505GL-Z from Monolithic Power Systems is a 7V-input, 4A-lossless energy storage and management unit in a 20-pin QFN (3mm×4mm) package. It integrates input-current limiting with dv/dt control, programmable bus voltage slew rate, Power-On-Reset, and bidirectional Buck/Boost energy transfer for solid-state and hard-disk drive power-backup applications. It pumps VIN to up to 30V storage voltage and releases energy at up to 4.5A during input outage.

For engineers reviewing the MP5505GL-Z datasheet, MP5505GL-Z pinout, MP5505GL-Z application, or MP5505GL-Z equivalent, this device supports precise hold-up timing via programmable VSTORAGE/VRELEASE feedback dividers, thermal shutdown at 150°C, reverse-current protection, and dual enable control (EN/ENCH) for safe charge-release sequencing.

Technical Context

The MP5505GL-Z implements a patented bidirectional Buck/Boost architecture: during normal operation, its boost converter charges an external capacitor to a user-set storage voltage (VIN to 30V); upon input loss, it switches to buck mode to discharge stored energy into the bus at up to 4.5A. The internal 60mΩ input FET limits inrush current, while dv/dt control on the DVDT pin programs bus voltage ramp time.

It features two independent feedback loops - FBS sets storage voltage (0.79V reference), FBB sets release threshold (0.79V reference) - enabling independent configuration of charge and hold-up profiles. The device uses constant-on-time (COT) control in buck release mode for fast transient response and supports 100% duty cycle operation to fully deplete stored energy.

Key Specifications

Parameter Value and Actual Design Meaning
Input Voltage Range 2.7V to 7V - supports 3.3V/5V system rails with 8V absolute max rating
Continuous Input Current Limit Up to 4.6A - set by ILIM resistor (e.g., 1.07kΩ → 4.6A), enforced by integrated 60mΩ MOSFET
Storage Voltage Range VIN to 30V - programmable via FBS feedback divider; enables high-ratio energy storage to minimize capacitance
Buck Release Current Up to 4.5A - delivers sustained hold-up power during input outage without external switch
Bus Clamping Voltage 6V - internal clamp protects downstream 5V bus from overvoltage during surge events
Thermal Shutdown Threshold 150°C with 30°C hysteresis - ensures self-protection under overload or poor PCB thermal design
Power-On Reset Delay Programmable 0.4ms (default) to >500ms via TPOR capacitor - prevents premature energy release during startup

Pinout & Package

MP5505GL-Z is housed in a thermally enhanced 20-pin QFN package (3mm × 4mm, 0.5mm pitch) with exposed thermal pad. Pin mapping is validated per MPS Rev. 1.01 datasheet and functional block diagram.

Pin/Terminal Circuit Role Design Meaning
1 DVDT Slew-rate programming input Connects to GND via capacitor to set VB rise time (0.5–1.5ms); open = ~0.9ms default soft-start
2 TPOR Power-on-reset delay input Capacitor-to-GND sets delay before VB charging begins; open = 0.4ms default
3 ILIM Input current limit setting Resistor-to-GND sets ILIM (e.g., 1.2kΩ → 4.1A); must not be left floating
4 PGIN Bus voltage power-good indicator Open-drain output; HIGH when FBB > 0.813V (charging), LOW when FBB < 0.79V (releasing)
5 PGS Storage voltage power-good indicator Open-drain output; HIGH when FBS > 0.75V, LOW when FBS < 0.71V - signals storage readiness
6 EN Global enable/disable control Pull low to disable all functions (input limiter + charge/release); must be HIGH during release
7 ENCH Charge/release circuitry enable Pull low to disable storage charge & release; keep HIGH to allow energy transfer
8 PGND Power ground return High-current return path for VIN, VB, STRG, SW - must connect to thermal pad and low-impedance plane
9 SW Switch node output Drives external inductor (L1); connects to VBO and BST; carries peak currents up to 4.5A in buck mode
10 STRG Storage voltage output High-voltage node (up to 30V); connects to bulk storage capacitor; requires local 22μF ceramic decoupling
11 BST Bootstrap supply for high-side driver Connects 100nF capacitor to SW to generate gate drive voltage for internal HS switch in buck mode
12 CST High-side switch driver voltage storage Supports energy transfer even when VSTORAGE ≈ VB; improves efficiency near voltage crossover
14 AGND Analog ground reference Low-noise reference for feedback pins (FBB/FBS), EN/ENCH, ILIM, TPOR, DVDT - separate from PGND
15 FBB Bus voltage feedback input Sets release threshold (VRELEASE = VFBB × (1 + R3/R4)); 0.79V internal reference
16 FBS Storage voltage feedback input Sets VSTORAGE (VFBS = 0.79V); determines energy storage level and required capacitor size
17 ICH Boost-mode current limit adjustment Resistor-to-GND sets pre-charge (130mA) and boost charge current (e.g., 500mA default)
18 VBO Boost output / isolation FET drain Internal node between input FET and boost inductor; connects to SW and L1
19 VB Regulated bus voltage output Delivers stable 2.7–6V bus rail; requires 22–47μF ceramic capacitor placed adjacent to pin
20 VIN Main input supply Accepts 2.7–7V unregulated input; requires 10–22μF ceramic decoupling close to pin

Key Features

Feature Design Value
Lossless energy storage architecture Eliminates series resistive losses via bidirectional Buck/Boost topology - enables >90% release efficiency
Programmable input inrush control DVDT pin + capacitor sets VB slew rate; ILIM pin + resistor sets steady-state current limit (4.1–4.6A)
Dual enable control (EN/ENCH) EN disables entire IC; ENCH independently gates charge/release - enables safe sequencing and fault isolation
Independent storage & release voltage setting FBS and FBB pins accept separate resistor dividers - allows VSTORAGE = 12V and VRELEASE = 4.2V simultaneously
Integrated thermal and overvoltage protection 150°C shutdown with 30°C hysteresis; 6V bus clamp; reverse-current blocking prevents backfeed during release

Applications

Solid-State Drive (SSD) Power Hold-up Hard-Disk Drive (HDD) Crash Protection

Use Scenario: Sudden 5V input loss during write operations triggers immediate data flush and safe park.

IC Role / Device Role / Timing Role: MP5505GL-Z stores energy during normal operation and releases up to 4.5A at 4.2V for ≥20ms to sustain controller and actuator power.

Use Value: Enables full firmware-controlled shutdown without data corruption or mechanical damage - eliminates need for discrete backup capacitors and controllers.

Use Scenario: AC power interruption during HDD spin-down causes head crash risk if motor stops abruptly.

IC Role / Device Role / Timing Role: Acts as autonomous hold-up supply: monitors VB, detects drop below 4.2V, and discharges stored 12V energy into bus at regulated current.

Use Value: Provides deterministic 15–25ms hold-up window - sufficient for controlled spindle brake and head retraction per ATA/SCSI specs.

Industrial PLC I/O Module Backup Embedded Network Appliance Dying-Gasp

Use Scenario: Fieldbus-powered I/O module loses 24VDC input during maintenance or cable disconnect.

IC Role / Device Role / Timing Role: Maintains 5V logic rail using pre-charged 12V storage capacitor; releases energy until safe state is saved to nonvolatile memory.

Use Value: Guarantees ≥10ms clean shutdown of CAN/RS-485 transceivers and FPGA configuration - prevents bus lockup or spurious commands.

Use Scenario: PoE-powered network switch loses upstream power; must send "dying-gasp" SNMP trap before shutdown.

IC Role / Device Role / Timing Role: Supplies 5V/3.3V rails to SoC and PHY during 5–15ms grace period after PoE detection loss.

Use Value: Delivers stable 4.5A peak current to sustain full Ethernet link activity - meets IEEE 802.3af/at dying-gasp timing requirements.

Equivalent & Alternatives

The following parts are listed as comparable options for similar energy storage and management applications.

Alternative Part Technical Difference Application Difference Selection Advice
TI TPS43060 Single-channel synchronous Boost-only controller; no integrated buck release or bus clamping Requires external buck converter + OR-ing FET + supervision IC to replicate MP5505GL-Z functionality Choose only if existing design already includes discrete buck stage and needs only boost charge control
Analog Devices LTC4425 Hot-swap controller with charge pump; max 2.5A release current; no programmable storage voltage or COT buck control Limited to ≤12V storage and ≤2.5A hold-up - insufficient for 4A SSD/HDD use cases Select when lower current (<2.5A) and fixed 5V/12V storage are acceptable; avoids complex layout of bidirectional topology

Compared with TPS43060 and LTC4425, MP5505GL-Z uniquely integrates bidirectional power conversion, programmable storage/release voltages, and 4.5A release capability in one QFN20 package - reducing BOM count by ≥5 components and eliminating inter-stage timing coordination.

Availability

MP5505GL-Z is available at Aetrix Electronics and suitable for solid-state drive power hold-up, hard-disk drive crash protection, and industrial PLC I/O module backup requiring stable component supply, long-term lifecycle support, and RoHS-compliant packaging.

Supply support for MP5505GL-Z includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Monolithic Power Systems (MPS) is a fabless semiconductor company specializing in high-performance analog and power ICs, with core expertise in DC/DC conversion, motor drivers, and energy management solutions.

The MP5505 product line targets compact, high-efficiency power-backup systems for storage-class devices - designed to replace bulky capacitor banks and discrete supervisory circuits with a single integrated energy storage and release unit.

FAQ

What is the maximum storage voltage supported by MP5505GL-Z?

The MP5505GL-Z supports storage voltages from VIN up to 30V, as confirmed in the Recommended Operating Conditions table (Rev. 1.01, p.3). This range enables efficient energy density scaling - e.g., storing energy at 12V instead of 5V reduces required capacitance by ~5.7× for the same hold-up energy.

How does the MP5505GL-Z prevent reverse current flow during energy release?

It uses integrated reverse-current protection via the input hot-swap MOSFET, which turns off when VIN falls below VB during release. This blocks energy backfeed from STRG/VB to VIN, as specified in the Operation section (p.10) and Absolute Maximum Ratings (VSTRG to -0.3V).

Can MP5505GL-Z operate with a 3.3V input supply?

Yes - its 2.7V–7V input range includes 3.3V operation. However, minimum storage voltage becomes 3.3V, limiting hold-up energy; for optimal performance, use VIN ≥ 5V to enable higher VSTORAGE (e.g., 12V) and maximize capacitor utilization per the Application Information section (p.11).

What is the purpose of the ENCH pin, and why is sequencing with EN critical?

ENCH enables only the charge/release circuitry, while EN controls the entire IC. Sequencing ENCH after VB settles (per Figure 3) prevents false release triggering caused by VB droop during boost-mode charging - a documented design requirement in the Operation section (p.9) to avoid premature hold-up activation.

Does MP5505GL-Z require an external diode in the boost path?

Yes - an external diode (D1 in Typical Application schematic, p.1) is strongly recommended across the boost inductor to prevent reverse conduction and ensure reliable pre-charge mode operation, as stated in the Application Information section (p.12).

How is thermal performance affected by PCB layout?

θJA is specified at 48°C/W on a 4-layer JEDEC board (p.2). Layout directly impacts this: the exposed thermal pad must be soldered to a ≥250mm² copper pour with ≥4 thermal vias (0.3mm diameter) to inner ground planes - failure to do so risks thermal shutdown above 2.5W dissipation.

What happens if the ILIM pin is left unconnected?

The ILIM pin must not be left floating - it requires a resistor to GND to set the input current limit. An open ILIM pin results in undefined current-limit behavior and potential overcurrent damage, as explicitly warned in the PIN FUNCTIONS table (p.7).

MP5505GL-Z Specifications

Product attributes
Attribute value
Manufacturer:
Monolithic Power Systems Inc.
Series:
-
Package/Case:
20-PowerTFQFN
Packaging:
Tape & Reel (TR)
Product Status:
Not For New Designs
Applications:
Hard-Disk Drives, Solid State Drives (SSD)
Current - Supply:
2mA (Max)
Voltage - Supply:
2.7V ~ 7V
Operating Temperature:
-40°C ~ 125°C
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
20-QFN (3x4)

MP5505GL-Z FAQ

1.How can I place an order for MP5505GL-Z through Aetrix?

Please submit a Request for Quotation (RFQ) for MP5505GL-Z on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MP5505GL-Z reliable?

The price and inventory of MP5505GL-Z are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MP5505GL-Z is usually 5 days.

3.What payment methods are accepted for MP5505GL-Z?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MP5505GL-Z transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MP5505GL-Z?

MP5505GL-Z orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MP5505GL-Z order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MP5505GL-Z?

For technical support, including MP5505GL-Z datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MP5505GL-Z requirements.

6.How does Aetrix verify that MP5505GL-Z is sourced from the original manufacturer or authorized distributors?

All MP5505GL-Z products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MP5505GL-Z meets industry standards.

7.What is the process for return or replacement of MP5505GL-Z?

All MP5505GL-Z units undergo pre-shipment inspection (PSI). If there is an issue with MP5505GL-Z, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MP5505GL-Z part is unused and in its original packaging.

Return procedure for MP5505GL-Z:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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