Monolithic Power Systems Inc. MP5512GV-P

Overview

MP5512GV-P from Monolithic Power Systems is a 18V, 4.5A high-efficiency energy storage and management unit designed for solid-state drive (SSD) power-backup systems. It integrates input-current limiting, dv/dt-controlled bus start-up, programmable storage voltage up to 40V, and bi-directional buck/boost energy transfer with internal 14mΩ hot-swap FET, 140mΩ/110mΩ power switches, and ±3% current limit accuracy at 2A.

For engineers reviewing the MP5512GV-P datasheet, MP5512GV-P pinout, MP5512GV-P application, or MP5512GV-P equivalent, this device serves as a compact, single-chip solution for SSD hold-up time extension, input-failure detection, and controlled energy release-requiring no external gate drivers, minimal passive components, and precise programmability of storage/release thresholds and slew rates.

Technical Context

The MP5512GV-P implements a patented bi-directional buck/boost architecture: in boost mode, it charges a storage capacitor (STRG) to a user-programmed voltage (up to 40V) using an internal 140mΩ HS and 110mΩ LS switch; in buck-release mode, it transfers stored energy to the bus (VB) with fixed-frequency constant-on-time (COT) control and 5A peak-current limiting. Its dv/dt-controlled VB ramp (via DVDT pin) and TPOR-configurable power-on reset ensure safe hot-swap sequencing.

It features three independent open-drain status indicators-PFI (power-failure), WARN (early VIN drop warning), and PGB (VB power-good)-each with defined hysteresis and threshold referencing internal 0.8V references (±2% over temperature). Input reverse-current protection activates at ~150mA, and thermal shutdown triggers at 150°C with 30°C hysteresis.

Key Specifications

Pinout & Package

MP5512GV-P is housed in a thermally optimized 28-pin QFN package (4mm × 5mm, 0.5mm pitch) with exposed thermal pad. Pin functions are validated per MPS MP5512 Rev. 1.1 datasheet (pp. 9–11).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar energy storage and management applications.

Compared with TPS43060 and LTC4041, MP5512GV-P delivers fully integrated, SSD-optimized power-fail response-including sub-microsecond PFI assertion, programmable dv/dt, and dual-enable (EN/ENCH) control-reducing design cycle time and validation effort for enterprise and industrial storage applications.

Availability

MP5512GV-P is available at Aetrix Electronics and suitable for solid-state drive data backup, industrial hard-disk drive hold-up, and server NVMe power-fail protection requiring stable component supply, long-term lifecycle support, and RoHS-compliant packaging.

Supply support for MP5512GV-P includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Monolithic Power Systems (MPS) is a fabless semiconductor company specializing in high-performance analog and power ICs, with over two decades of leadership in DC-DC conversion, motor drivers, and power management solutions.

The MP5512 product line targets high-reliability storage subsystems, delivering integrated energy storage, intelligent power sequencing, and deterministic power-fail signaling specifically for SSD, HDD, and NVMe applications.

FAQ

What is the maximum recommended storage capacitor value for MP5512GV-P?

The MP5512GV-P does not specify an absolute maximum STRG capacitance, but design guidelines recommend limiting total STRG capacitance to ≤1000µF for stable boost-loop control and predictable release timing. Larger values increase charge time and reduce buck-release efficiency due to higher ESR-related losses; typical designs use 220–470µF low-ESR polymer or aluminum electrolytic capacitors rated ≥45V.

Can MP5512GV-P operate with a 5V input supply?

Yes, MP5512GV-P supports 4V–18V input range, making 5V operation fully valid. At 5V input, the device regulates VB to 5V (via FBB feedback), charges STRG to programmed voltage (e.g., 12V or 24V), and delivers buck-release current up to 3A. Input-current limit must be reconfigured via ILIM resistor to maintain accuracy, as the 4.5A max rating applies across the full VIN range.

How does the WARN pin differ from the PFI pin in system-level response?

WARN asserts low when DET falls below 1.06×VDET-REF (≈0.848V), providing ~500μs advance warning before PFI triggers at 0.99×VDET-REF (≈0.792V). This enables firmware to initiate non-critical tasks-such as cache flushing or status logging-before committing to emergency data save, improving overall system responsiveness and reducing latency-critical path pressure.

Is external bootstrap capacitor required for MP5512GV-P?

Yes, a bootstrap capacitor (typically 0.1µF X7R ceramic) must be placed between BST and SW pins. It supplies gate-drive voltage for the internal high-side switch during boost operation. Failure to install this capacitor results in incomplete STRG charging and potential thermal stress on the LS switch due to prolonged conduction.

Does MP5512GV-P support automatic recharging after input recovery?

Yes, if VIN recovers before VB drops below its 2.3V UVLO threshold, MP5512GV-P automatically re-enables the hot-swap FET (when VIN > VB + 190mV), disables buck release, and resumes boost-mode charging of STRG after a 1.8ms delay-verified in Figure 4 of the datasheet. No external reset or EN toggling is required.

What is the purpose of the RTEST pin?

RTEST provides a controlled discharge path for residual STRG voltage after shutdown. When connected via a current-limited resistor (e.g., 100Ω) to STRG, it safely bleeds stored energy below 500mA, preventing hazardous spark or shock during handling or maintenance-critical for evaluation and field-service scenarios.

How is thermal performance affected by PCB layout?

Thermal resistance θ_JA is 38°C/W on a 4-layer JEDEC PCB; inadequate copper pour or missing thermal vias under the exposed pad increases junction temperature by >20°C at full 4.5A load. MPS recommends ≥8 thermal vias (0.3mm diameter) connecting the pad to inner ground planes and ≥200mm² of 2oz copper on top/bottom layers for continuous 3A operation.