Monolithic Power Systems Inc. MP6539BGF-P
- Part No.:
- MP6539BGF-P
- Manufacturer:
- Monolithic Power Systems Inc.
- Category:
- Gate Drivers
- Package:
- 28-TSSOP (0.173", 4.40mm Width) Exposed Pad
- Datasheet:
-
MP6539BGF-P.pdf
- Description:
- IC GATE DRVR HALF-BRIDGE 28TSSOP
- Quantity:
- Payment:

- Shipping:

Inventory:2,272
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
MP6539BGF-P from Monolithic Power Systems is a 100V three-phase BLDC motor pre-driver IC designed to control six N-channel MOSFETs in half-bridge configurations. It delivers 0.8A source / 1A sink gate drive, integrates a current-sense amplifier (20× gain), supports adjustable dead-time control (77ns–6µs), and operates with VDD = 8.5–14V for use in e-bike motor controllers.
For engineers reviewing the MP6539BGF-P datasheet, MP6539BGF-P pinout, MP6539BGF-P application, or MP6539BGF-P equivalent, key selection criteria include bootstrap charge management without auto-precharge, absence of over-current protection, VBST UVLO monitoring at 6.2V, thermal shutdown at 150°C, and compatibility with 100V motor bus systems requiring discrete gate drive timing control.
Technical Context
The MP6539BGF-P implements independent high-side/low-side logic decoding per phase with shoot-through prevention via programmable dead-time resistor (DT pin). Its internal charge pump sustains BST voltage during extended high-side conduction, while VBST UVLO disables individual HS outputs-without asserting nFAULT-if bootstrap voltage drops below 6.2V.
It lacks VIN and LDO circuitry, drawing power solely from VDD; sleep mode reduces quiescent current to 2µA via nSLEEP pin with 70µs wake-up latency. The integrated current-sense amplifier references LSS to GND, outputting scaled analog voltage on CSO, requiring ≥1nF capacitor to ground for stability and external RC filtering for PWM-current hold.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VMOTOR Max | 100V - Supports full-bridge motor drives up to 100V DC bus without external level-shifting. |
| VBST Max | 120V - Enables reliable high-side gate drive for 100V MOSFETs with margin for transient spikes. |
| IOUT Source/Sink | 0.8A / 1A - Sufficient to rapidly charge/discharge typical 50nC–100nC gate charges at 30kHz PWM. |
| Dead-Time Range | 77ns to 6µs - Adjustable via single DT-to-GND resistor; prevents shoot-through across all three phases simultaneously. |
| CSO Gain & Output | 20×, rail-to-rail capable - Converts low-side shunt voltage (LSS–GND) into buffered analog current sense signal. |
| UVLO Thresholds | VDD rising: 7.5V; VBST: 6.2V - Ensures gate drive remains functional only within safe supply and bootstrap voltage windows. |
| TJ Shutdown | 150°C - Thermal shutdown disables all outputs and asserts nFAULT; automatic recovery upon die cooling. |
Pinout & Package
MP6539BGF-P is packaged in thermally enhanced TSSOP-28 EP (9.7mm × 6.4mm) with exposed thermal pad soldered to PCB ground plane for improved power dissipation (θJA = 32°C/W).
| Pin | Circuit Role | Design Meaning |
|---|---|---|
| GND (Pin 11) | Power and signal reference | Primary ground return for gate drivers, logic, and current sense; connects to exposed pad. |
| VDD (Pin 15) | Gate driver supply input | Sole power source (8.5–14V); powers all internal circuits-no VIN or LDO present. |
| HSA/HSB/HSC (Pins 24,23,22) | High-side logic inputs | CMOS-compatible inputs controlling respective high-side gate drivers; internally pulled down. |
| LSA/LSB/LSC (Pins 21,20,19) | Low-side logic inputs | CMOS-compatible inputs controlling respective low-side gate drivers; internally pulled down. |
| BSTA/BSTB/BSTC (Pins 16,10,14) | Bootstrap node outputs | Drive external bootstrap capacitors; each connects to SHx and feeds high-side gate driver supply. |
| GHA/GHB/GHC (Pins 8,12,16) | High-side gate drive outputs | Active pull-up/pull-down drivers for N-MOSFET gates; rated for 120V BST swing. |
| GLA/GLB/GLC (Pins 9,13,17) | Low-side gate drive outputs | Active pull-up/pull-down drivers referenced to LSS; sink/source capability enables fast turn-off. |
| nSLEEP (Pin 26) | Low-power enable control | Logic-low entry into 2µA sleep mode; 70µs wake-up delay required before valid PWM commands. |
| nFAULT (Pin 25) | Fault status indicator | Open-drain output asserted low during thermal shutdown or VDD UVLO; requires external pull-up. |
| CSO (Pin 3) | Current sense amplifier output | Analog output (20× LSS–GND voltage); must be decoupled with ≥1nF capacitor to ground. |
| DT (Pin 28) | Dead-time programming | Resistor-to-ground sets dead time (tDEAD = 0.044 × RDT + 0.1 µs); open = 6µs, grounded = 77ns. |
| LSS (Pin 18) | Low-side current sense reference | Common-source node for shunt resistor; referenced to GND for single-point current measurement. |
Key Features
| Feature | Design Value |
|---|---|
| 100V motor bus support | Enables direct interface with high-voltage BLDC motors in e-bikes and power tools without external level shifters. |
| Integrated current-sense amplifier | 20× gain, LSS-referenced output eliminates need for external op-amp in shunt-based phase current sensing. |
| Adjustable per-phase dead-time | Single-resistor tuning ensures robust shoot-through prevention across varying MOSFET gate charge and layout parasitics. |
| Charge pump-assisted bootstrap | Maintains BST voltage during sustained high-side conduction, eliminating reliance on PWM duty cycle for recharge. |
| Thermal shutdown with fault reporting | 150°C junction limit with automatic nFAULT assertion and recovery-critical for unattended motor operation. |
| Low-power sleep mode | Reduces supply current to 2µA; ideal for battery-powered applications where idle current directly impacts runtime. |
Applications
| E-Bike Motor Controller | Power Drill Driver |
|---|---|
Use Scenario: 36–48V hub or mid-drive BLDC motor with field-oriented control (FOC) using external MCU. IC Role / Device Role / Timing Role: Pre-driver translating MCU PWM signals into high-current, shoot-through-protected gate pulses for six N-MOSFETs. Use Value: Eliminates need for discrete level shifters and external dead-time generators; 100V rating supports future 52V battery upgrades. |
Use Scenario: Cordless drill with variable-speed trigger and electronic braking. IC Role / Device Role / Timing Role: Gate driver enabling rapid commutation and regenerative braking via synchronous rectification. Use Value: Integrated CSO simplifies current limiting and torque control; thermal shutdown prevents MOSFET failure during stall conditions. |
| Electric Scooter Controller | Industrial Fan Drive |
Use Scenario: 60V scooter motor with hall sensor feedback and soft-start ramping. IC Role / Device Role / Timing Role: Three-phase gate driver managing startup sequencing, brake control, and fault-safe shutdown. Use Value: nFAULT output interfaces directly with MCU safety monitor; sleep mode extends standby battery life between rides. |
Use Scenario: HVAC blower with constant-torque demand and temperature-sensitive operation. IC Role / Device Role / Timing Role: High-efficiency pre-driver supporting continuous 100% duty cycle with charge-pump-boosted bootstrap. Use Value: VBST UVLO detection prevents high-side dropout during long on-times; exposed pad ensures stable thermal performance at 40°C ambient. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar three-phase BLDC pre-driver applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MP6539GF-P | Includes VIN pin, auto-bootstrap pre-charge, over-current protection, and VDS sensing; higher BOM cost and longer power-up latency (≈1ms). | Preferred where system-level fault coverage (e.g., MOSFET short-circuit) is required and boot capacitor pre-charge cannot be managed externally. | Select MP6539GF-P if OCP and autonomous bootstrap initialization are mandatory; MP6539BGF-P saves cost and complexity when those features are handled by MCU firmware. |
| TBD720D | 100V-rated, includes built-in 3.3V LDO, no integrated current sense, fixed 500ns dead time, no charge pump-relies on PWM duty cycle for bootstrap recharge. | Suitable for simpler trapezoidal commutation systems without FOC or precise current feedback requirements. | Choose TBD720D for cost-sensitive, lower-performance applications where external current sensing and manual bootstrap management are acceptable. |
Compared with MP6539GF-P, MP6539BGF-P trades over-current protection and auto-precharge for lower quiescent current (2µA vs. ~100µA), faster wake-up (70µs), and reduced pin count-making it optimal for firmware-managed, battery-conscious BLDC systems. Against TBD720D, it adds charge pump reliability and analog current sense, justifying its use in higher-fidelity motor control.
Availability
MP6539BGF-P is available at Aetrix Electronics and suitable for e-bike motor controllers, cordless power tools, electric scooter drives, and industrial fan systems requiring stable component supply, long-lifecycle assurance, and RoHS-compliant packaging.
Supply support for MP6539BGF-P includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Monolithic Power Systems (MPS) is a fabless semiconductor company specializing in high-performance power management ICs, including DC/DC converters, motor drivers, and LED controllers.
The MP6539B series belongs to MPS's high-voltage BLDC pre-driver product line, engineered specifically for compact, efficient, and thermally robust motor control in portable and battery-powered equipment.
FAQ
What is the purpose of the DT pin, and how does it affect dead-time configuration?
The DT pin sets dead time across all three phases using an external resistor to ground. Dead time is calculated as tDEAD(µs) = 0.044 × RDT(kΩ) + 0.1. With DT open, default dead time is 6µs; grounding DT yields minimum 77ns. This single-point adjustment ensures consistent shoot-through prevention without per-phase calibration.
Does MP6539BGF-P support automatic bootstrap capacitor charging at startup?
No. Unlike MP6539, the MP6539BGF-P omits auto-bootstrap pre-charge. Before first high-side activation, each LS-FET must be pulsed low individually to charge the corresponding bootstrap capacitor via the internal diode. Large capacitors (>220nF) require multiple low-duty-cycle pulses to limit diode stress.
How is current sensing implemented, and what external components are required?
Current sensing uses the LSS pin as the common-source node of the low-side shunt resistor. The integrated amplifier outputs 20× the LSS–GND voltage on CSO. A minimum 1nF capacitor must connect CSO to GND; optional RC filter (R ≥1kΩ, C ≥10nF) holds sensed current during PWM off-time for accurate FOC sampling.
What happens to gate drive outputs during VDD UVLO or thermal shutdown?
During VDD UVLO (below 6.8V), all HS/LS outputs are actively driven low, then transition to high-impedance as VDD falls further. During thermal shutdown (>150°C), all gate drivers disable and nFAULT goes low. Both conditions clear automatically once VDD rises above threshold or junction temperature falls below hysteresis limit.
Can MP6539BGF-P drive 100V MOSFETs safely under continuous conduction mode?
Yes-its 120V BST rating and charge pump sustain high-side gate drive even during 100% duty cycle. However, bootstrap capacitor sizing must satisfy CBOOT ≥ QT/(ΔVBOOT − VFBOOT) to maintain >10V gate drive. For a 50nC MOSFET at 12V VDD, ≥100nF ceramic is recommended.
Is there over-current protection built into MP6539BGF-P?
No. MP6539BGF-P excludes over-current protection and VDS sensing present in MP6539. Fault detection relies solely on VDD UVLO, VBST UVLO, and thermal shutdown. Current limiting must be implemented externally via CSO feedback to the host MCU or analog comparator.
What package thermal characteristics apply to MP6539BGF-P?
MP6539BGF-P uses TSSOP-28 EP with exposed thermal pad. Its θJA is 32°C/W and θJC is 6°C/W on a 4-layer PCB per JESD51-7. Full thermal pad soldering to a solid GND plane is mandatory to achieve rated 3.9W power dissipation at +25°C ambient.
MP6539BGF-P Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Monolithic Power Systems Inc.
- Series:
- -
- Package/Case:
- 28-TSSOP (0.173", 4.40mm Width) Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- -
- Driven Configuration:
- Half-Bridge
- Channel Type:
- 3-Phase
- Number of Drivers:
- 6
- Gate Type:
- N-Channel MOSFET
- Voltage - Supply:
- 8.5V ~ 14V
- Logic Voltage - VIL, VIH:
- -
- Current - Peak Output (Source, Sink):
- 800mA, 1A
- Input Type:
- Non-Inverting
- High Side Voltage - Max (Bootstrap):
- -
- Rise / Fall Time (Typ):
- -
- Operating Temperature:
- -40°C ~ 125°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 28-TSSOP-EP
MP6539BGF-P FAQ
1.How can I place an order for MP6539BGF-P through Aetrix?
Please submit a Request for Quotation (RFQ) for MP6539BGF-P on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MP6539BGF-P reliable?
The price and inventory of MP6539BGF-P are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MP6539BGF-P is usually 5 days.
3.What payment methods are accepted for MP6539BGF-P?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MP6539BGF-P transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MP6539BGF-P?
MP6539BGF-P orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MP6539BGF-P order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MP6539BGF-P?
For technical support, including MP6539BGF-P datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MP6539BGF-P requirements.
6.How does Aetrix verify that MP6539BGF-P is sourced from the original manufacturer or authorized distributors?
All MP6539BGF-P products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MP6539BGF-P meets industry standards.
7.What is the process for return or replacement of MP6539BGF-P?
All MP6539BGF-P units undergo pre-shipment inspection (PSI). If there is an issue with MP6539BGF-P, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MP6539BGF-P part is unused and in its original packaging.
Return procedure for MP6539BGF-P:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MP6539BGF-P Tags

-
ZXGD3009E6TA
Diodes Incorporated

-
1EDN7512BXTSA1
Infineon Technologies
-
UCC27517DBVR
Texas Instruments

-
MCP1416T-E/OT
Microchip Technology

-
MCP1402T-E/OT
Microchip Technology

-
MCP1415T-E/OT
Microchip Technology

-
MCP1401T-E/OT
Microchip Technology

-
IX4428NTR
Littelfuse Inc.

-
IRS2005STRPBF
Infineon Technologies

-
IRS2008STRPBF
Infineon Technologies

-
IX4310TTR
Littelfuse Inc.

-
2EDN7524RXTMA1
Infineon Technologies
Tech Hub
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
