NXP Semiconductors MPF5023AMMA0ESR2
- Part No.:
- MPF5023AMMA0ESR2
- Manufacturer:
- NXP Semiconductors
- Category:
- Power Management - Specialized
- Package:
- 40-VFQFN Exposed Pad
- Datasheet:
-
MPF5023AMMA0ESR2.pdf
- Description:
- POWER MANAGEMENT IC, PRE-PROG, 3
- Quantity:
- Payment:

- Shipping:

Inventory:2,876
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
MPF5023AMMA0ESR2 from NXP Semiconductors is a high-performance power management IC (PMIC) designed for automotive infotainment and advanced multimedia processors including i.MX 8 and S32V series. It integrates three 2.5 A buck regulators (0.4–1.8 V output), one-time programmable (OTP) memory for startup configuration, ASIL B safety monitoring, and a 3.4 MHz I²C interface - enabling precise voltage sequencing and dynamic scaling in space-constrained automotive ECUs.
For engineers reviewing the MPF5023AMMA0ESR2 datasheet, MPF5023AMMA0ESR2 pinout, MPF5023AMMA0ESR2 application, or MPF5023AMMA0ESR2 equivalent, this device delivers deterministic power-up sequencing, thermal/fault protection with fail-safe state transition, and I²C-configurable regulator operation - critical for functional safety compliance and processor co-powering in ADAS and digital cockpit systems.
Technical Context
The MPF5023AMMA0ESR2 implements a hierarchical state machine supporting ASIL B safety requirements: it performs triple self-tests on bandgap references, oscillator accuracy (±15%), register CRC integrity, and ABIST on all voltage monitors before transitioning from QPU_Off to System ON. Its OTP memory stores boot-time configurations including PGOOD sequencing, soft-start timing, and regulator enable order - eliminating external resistors and reducing BOM count.
Each buck regulator supports dynamic voltage scaling (DVS), spread-spectrum switching, manual frequency tuning, and configurable multiphase/VTT termination modes. The SYNC pin enables clock synchronization across multiple PMICs, while the watchdog timer (WDI input + internal counter) and XFAILB bidirectional fault signaling provide layered system-level failure detection and recovery coordination.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Buck Regulators | Three independent 2.5 A buck converters (SW1–SW3), each adjustable 0.4–1.8 V in 6.25 mV steps - supports core, I/O, and memory rail powering with VTT mode on SW2. |
| I²C Interface | High-speed 3.4 MHz I²C bus with CRC protection and secure write capability - enables real-time voltage/frequency reconfiguration during runtime without interrupting system operation. |
| Safety Compliance | ASIL B–rated monitoring circuit per ISO 26262: includes independent UV/OV/thermal/overcurrent fault detection, fail-safe state lockout, and ABIST for analog monitor validation. |
| Startup Configuration | One-time programmable (OTP) memory stores default voltages, sequencing order, soft-start times, and power-down behavior - eliminates need for external configuration resistors or EEPROM. |
| Package & Thermal | 40-pin HVQFN (6 mm × 6 mm × 0.9 mm, 0.5 mm pitch) with wettable flank and exposed pad; RθJA = 26.8 °C/W (2s6p PCB) - supports high-density automotive PCB layouts with robust thermal dissipation. |
| Operating Range | −40 °C to +125 °C ambient temperature; main input VIN = 0.3–5.5 V (UVDET threshold); junction limit TJ = 150 °C - qualified for under-hood automotive environments. |
| ESD Robustness | HBM ±2000 V, CDM ±500 V per AEC-Q100 Rev-G - ensures reliability during automated assembly and field operation in harsh EMI environments. |
Pinout & Package
MPF5023AMMA0ESR2 uses a 40-pin HVQFN package (SOT618-17(D)) with wettable flank, dimple cut, and exposed thermal pad (EPAD) connected to AGND. Pitch is 0.5 mm; body dimensions are 6.0 mm × 6.0 mm × 0.9 mm. The EPAD must be soldered to a dedicated ground plane for optimal thermal performance and EMI suppression.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| SW1FB, SW2FB, SW3FB | Feedback inputs | Resistor-divider nodes for closed-loop regulation of each buck output; support remote sensing and precision voltage setting (±1% typical). |
| EN1, EN2, EN3 | Regulator enable inputs | Independent digital control (active-high) to power up/down individual bucks - enables flexible power domain management and low-power states. |
| PGOOD1–PGOOD3, PGOOD | Power-good outputs | Open-drain status signals indicating individual regulator stability (PGOODx) and global system readiness (PGOOD) - used for processor reset coordination and sequencing verification. |
| RESETBMCU | Processor reset output | Open-drain MCU reset signal asserted during power-up sequence and released only after all required rails meet tolerance and timing - ensures deterministic boot. |
| WDI, INTB, XFAILB | Fault signaling terminals | WDI accepts external watchdog pulses; INTB reports asynchronous faults (OV/UV/thermal); XFAILB is bidirectional fail-safe signaling pin - enables cross-IC safety arbitration. |
| VDDIO, VDDOTP, VIN, AGND | Supply & reference pins | VDDIO powers I/O logic (1.8 V or 3.3 V); VDDOTP supplies OTP programming block (up to 10 V); VIN is main input (≤5.5 V); AGND is analog ground reference - strict separation prevents noise coupling. |
| SYNC, SCL, SDA | Timing & communication | SYNC enables multi-PMIC clock synchronization; SCL/SDA implement 3.4 MHz I²C with CRC and secure write - supports dynamic DVS and runtime configuration updates. |
Key Features
| Feature | Design Value |
|---|---|
| Triple 2.5 A Buck Regulation | Simultaneous, independently configurable 0.4–1.8 V outputs with 6.25 mV resolution - supports heterogeneous SoC power domains (CPU, GPU, DDR, I/O) from single PMIC. |
| ASIL B Functional Safety Architecture | Dual-bandgap monitoring, register CRC, triple self-test execution, and fail-safe state transition - satisfies ISO 26262 hardware safety requirements without external safety controller. |
| OTP-Based Startup Configuration | Eliminates 12+ external resistors and capacitors by storing voltage setpoints, sequencing order, soft-start delays, and fault thresholds in on-chip OTP memory. |
| Dynamic Voltage Scaling (DVS) | Real-time I²C-controlled output voltage adjustment during operation - reduces dynamic power consumption in multimedia workloads and extends battery life in portable automotive modules. |
| VTT Termination Mode | SW2 configurable as DDR VTT terminator (0.6 V ±1%) with current sink/source capability - replaces discrete termination solutions in LPDDR4/LPDDR5 memory interfaces. |
| Thermal & Fault Protection | Programmable overtemperature shutdown (TJ > 150 °C), per-rail OV/UV detection, current-limit fault reporting, and latch-up immunity (100 mA) - prevents catastrophic failure in sustained overload conditions. |
Applications
| Automotive Infotainment Head Unit | Digital Cockpit Processor Power |
|---|---|
|
Use Scenario: Powering NXP i.MX 8QuadMax SoC in a 12 V automotive head unit with display, audio, navigation, and connectivity modules. IC Role / Device Role / Timing Role: Primary PMIC delivering core (0.8 V), GPU (0.9 V), DDR (1.1 V), and I/O (1.8 V) rails with synchronized startup and DVS during video decode. Use Value: Reduces BOM count by 15+ passive components; enables ASIL B–compliant power sequencing verified via built-in PGOOD and RESETBMCU timing. |
Use Scenario: Supplying S32V234 vision processor in ADAS camera ECU requiring tight voltage tolerances and fast transient response. IC Role / Device Role / Timing Role: Central power controller managing CPU, ISP, and memory rails with VTT termination on DDR3L and thermal throttling feedback to host MCU. Use Value: Achieves <50 µs load transient response and ±1% output accuracy - critical for image sensor stability and real-time vision processing. |
| Industrial HMI Controller | High-End Consumer Media Hub |
|
Use Scenario: Powering i.MX 6SoloX in ruggedized factory HMI with extended temperature operation and EMC-hardened layout. IC Role / Device Role / Timing Role: Standalone point-of-load regulator providing isolated 1.2 V, 1.5 V, and 3.3 V rails with watchdog supervision and brownout recovery. Use Value: Supports −40 °C to +125 °C operation with 26.8 °C/W thermal resistance - maintains reliability in unventilated enclosures. |
Use Scenario: Enabling premium Android TV box with 4K HDR decoding, voice assistant, and Wi-Fi 6 - demanding low-noise, high-efficiency power delivery. IC Role / Device Role / Timing Role: Companion PMIC to main SoC, supplying auxiliary rails (USB PHY, HDMI, audio codec) with spread-spectrum switching to reduce EMI. Use Value: Spread-spectrum mode lowers peak radiated emissions by >10 dB - simplifies FCC/CE certification without added shielding. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar PMIC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MPF5023CMBA0ESR2 | ASIL B–rated variant with full safety feature set (fail-safe state, triple self-test, FS_CNT registers); identical pinout and electrical specs. | Required for ISO 26262 ASIL B–compliant systems where functional safety is mandated (e.g., instrument clusters, ADAS ECUs). | Select MPF5023CMBA0ESR2 when safety certification is mandatory; MPF5023AMMA0ESR2 is suitable for QM-grade infotainment subsystems. |
| MPF5023CVNA0ESR2 | Industrial-grade version (105 °C max ambient); lacks ASIL B safety features and self-test circuitry; same OTP/I²C architecture and buck performance. | Targeted at non-automotive industrial or consumer applications where extended temperature range is needed but safety certification is not required. | Choose MPF5023CVNA0ESR2 for cost-sensitive industrial HMIs or media hubs operating up to 105 °C ambient. |
Compared with MPF5023AMMA0ESR2, the CMBA0ESR2 adds fail-safe state transitions and triple self-test for ASIL B compliance, while CVNA0ESR2 trades safety features for broader industrial temperature support - all share identical buck regulation, I²C interface, and package, enabling scalable design reuse across automotive tiers and industrial segments.
Availability
MPF5023AMMA0ESR2 is available at Aetrix Electronics and suitable for automotive infotainment, digital cockpit, and industrial HMI applications requiring stable component supply, long lifecycle support, and AEC-Q100 qualified reliability.
Supply support for MPF5023AMMA0ESR2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT markets, with deep expertise in processor and power management integration.
The MPF5023 series is part of NXP's automotive-grade PMIC portfolio, engineered specifically to power high-performance i.MX and S32V application processors while meeting ISO 26262 functional safety requirements and AEC-Q100 reliability standards.
FAQ
What is the safety qualification level of MPF5023AMMA0ESR2?
MPF5023AMMA0ESR2 is qualified to AEC-Q100 Grade 1 (−40 °C to +125 °C) and supports QM (Quality Management) safety integrity level per ISO 26262. It includes monitoring circuits and fault reporting but does not implement the full ASIL B self-test and fail-safe state logic found in the MPF5023CMBA0ESR2 variant. The MPF5023AMMA0ESR2 is intended for non-safety-critical automotive subsystems such as infotainment displays and connectivity modules.
Can MPF5023AMMA0ESR2 be used with i.MX 8 processors?
Yes, MPF5023AMMA0ESR2 is explicitly designed as the primary power management IC for NXP's i.MX 8 series application processors, including i.MX 8QuadMax, i.MX 8M Mini, and i.MX 8M Plus. Its OTP memory stores optimized voltage sequences and timing parameters validated for these SoCs, and its 3.4 MHz I²C interface supports dynamic voltage scaling during video and AI workloads executed on the i.MX 8 platform.
Does MPF5023AMMA0ESR2 support DDR memory termination?
Yes, MPF5023AMMA0ESR2 supports VTT termination mode on SW2, configurable via OTP or I²C to deliver precise 0.6 V (±1%) termination voltage for LPDDR4 and DDR3L memory interfaces. This eliminates the need for external termination ICs and reduces PCB area while maintaining tight voltage regulation under dynamic memory traffic loads.
How is the startup configuration stored and updated on MPF5023AMMA0ESR2?
MPF5023AMMA0ESR2 uses on-chip one-time programmable (OTP) memory to store startup configurations including output voltages, sequencing order, soft-start delays, and PGOOD timing. Programming is performed by NXP or authorized partners during manufacturing; field updates are not supported. Runtime adjustments use the 3.4 MHz I²C interface to modify functional registers without altering OTP contents.
What thermal performance can be expected from MPF5023AMMA0ESR2 in a standard PCB layout?
In a JEDEC-compliant 2s6p PCB layout (four internal copper layers, 3×3 thermal via array under the EPAD), MPF5023AMMA0ESR2 achieves a junction-to-ambient thermal resistance (RθJA) of 26.8 °C/W. This allows continuous 2.5 A operation per buck regulator at +85 °C ambient with ≤30 °C junction rise - sufficient for most automotive infotainment and industrial HMI applications without forced airflow.
MPF5023AMMA0ESR2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 40-VFQFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Applications:
- High Performance i.MX 8, S32x Processor Based
- Current - Supply:
- 200µA
- Voltage - Supply:
- 2.5V ~ 5.5V
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount, Wettable Flank
- Supplier Device Package:
- 40-HVQFN (6x6)
MPF5023AMMA0ESR2 FAQ
1.How can I place an order for MPF5023AMMA0ESR2 through Aetrix?
Please submit a Request for Quotation (RFQ) for MPF5023AMMA0ESR2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MPF5023AMMA0ESR2 reliable?
The price and inventory of MPF5023AMMA0ESR2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MPF5023AMMA0ESR2 is usually 5 days.
3.What payment methods are accepted for MPF5023AMMA0ESR2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MPF5023AMMA0ESR2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MPF5023AMMA0ESR2?
MPF5023AMMA0ESR2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MPF5023AMMA0ESR2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MPF5023AMMA0ESR2?
For technical support, including MPF5023AMMA0ESR2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MPF5023AMMA0ESR2 requirements.
6.How does Aetrix verify that MPF5023AMMA0ESR2 is sourced from the original manufacturer or authorized distributors?
All MPF5023AMMA0ESR2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MPF5023AMMA0ESR2 meets industry standards.
7.What is the process for return or replacement of MPF5023AMMA0ESR2?
All MPF5023AMMA0ESR2 units undergo pre-shipment inspection (PSI). If there is an issue with MPF5023AMMA0ESR2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MPF5023AMMA0ESR2 part is unused and in its original packaging.
Return procedure for MPF5023AMMA0ESR2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MPF5023AMMA0ESR2 Tags

-
TPS2511DGNR
Texas Instruments

-
UTC2000/MG
Microchip Technology

-
TUSB320HAIRWBR
Texas Instruments

-
TPS61252DSGR
Texas Instruments

-
PI5USB30216CXUAEX
Diodes Incorporated
-
SN6501DBVR
Texas Instruments

-
CYPD3177-24LQXQT
Infineon Technologies
-
SN6501QDBVRQ1
Texas Instruments

-
STUSB1600AQTR
STMicroelectronics

-
SN6505BDBVR
Texas Instruments
-
SN6501DBVT
Texas Instruments

-
TPS65150PWPR
Texas Instruments
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

