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NXP Semiconductors MPF5023CMMA0ES
- Part No.:
- MPF5023CMMA0ES
- Manufacturer:
- NXP Semiconductors
- Category:
- Power Management - Specialized
- Package:
- 40-VFQFN Exposed Pad
- Datasheet:
-
MPF5023CMMA0ES.pdf
- Description:
- POWER MANAGEMENT IC, PRE-PROG, 3
- Quantity:
- Payment:
- Shipping:
Inventory:4,216
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Product details
Overview
MPF5023CMMA0ES from NXP Semiconductors is an automotive-grade power management IC (PMIC) with three high-efficiency buck regulators (0.4 V–1.8 V, 2.5 A each), OTP-based startup configuration, and ASIL B–capable safety monitoring. It serves as a primary PMIC for i.MX 8/S32V application processors in infotainment systems requiring precise sequencing, dynamic voltage scaling, and fail-safe operation.
For engineers reviewing the MPF5023CMMA0ES datasheet, MPF5023CMMA0ES pinout, MPF5023CMMA0ES application, or MPF5023CMMA0ES equivalent, this device delivers verified QM-grade functional safety, 3.4 MHz I²C configurability, thermal/UV/OV/ILIM fault protection, and 40-pin HVQFN wettable flank packaging optimized for automotive PCB reliability and thermal performance.
Technical Context
The MPF5023CMMA0ES implements a deterministic state machine supporting LP_Off, QPU_Off, self-test (ASIL B only), power-up sequencing, Run, and Standby modes - all governed by OTP-configurable timing and enable logic. Its clock architecture integrates 20 MHz and 100 kHz oscillators with SYNC pin support for external clock synchronization or spread-spectrum modulation.
Regulator control includes per-buck dynamic voltage scaling (6.25 mV steps), programmable current limit, VTT termination on SW2, and independent PGOOD outputs plus global PGOOD. Safety features include ABIST, bandgap monitoring, watchdog timer with WDI input, and XFAILB bidirectional fault signaling - all compliant with AEC-Q100 and designed for QM automotive applications.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Regulator count | Three synchronous buck converters (SW1–SW3), each delivering up to 2.5 A at 0.4–1.8 V output |
| Input voltage range | VIN: 0.9 V to 5.5 V (operating); absolute max 6.0 V - supports 3.3 V/5 V system rails with UVLO detection |
| I²C interface | High-speed I²C up to 3.4 MHz - enables real-time voltage/frequency tuning and register access during system run state |
| Package | HVQFN40, 6 mm × 6 mm × 0.9 mm, 0.5 mm pitch, wettable flank, exposed pad - optimized for automotive thermal dissipation and solder joint inspection |
| Operating temperature | −40 °C to +125 °C ambient - qualified for under-hood and head-unit environments per AEC-Q100 Grade 1 |
| Safety grade | QM (Quality Management) - no ASIL B safety bits enabled; supports functional safety system integration without built-in ASIL B certification overhead |
| Startup configuration | One-time programmable (OTP) memory stores default voltages, sequencing order, soft-start times, and regulator enable states - eliminates external resistor networks |
Pinout & Package
HVQFN40 package with 40 terminals, 0.5 mm pitch, 6 mm × 6 mm body, 0.9 mm height, wettable flank, and exposed thermal pad (EPAD) connected to AGND.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| SW1FB, SW2FB, SW3FB | Feedback inputs | Resistor-divider nodes for closed-loop regulation of SW1–SW3 outputs; support 6.25 mV voltage step resolution |
| EN1, EN2, EN3 | Enable inputs | Independent digital control of SW1–SW3 startup/shutdown; compatible with processor GPIO or sequencer signals |
| PGOOD1–PGOOD3, PGOOD | Power-good outputs | Open-drain status flags indicating individual regulator readiness (PGOOD1–3) and global system readiness (PGOOD) |
| RESETBMCU | Reset output | Open-drain MCU reset signal released after successful power-up sequence completion - synchronizes processor boot |
| WDI, INTB, XFAILB | Fault interface pins | WDI accepts external watchdog pulse; INTB signals interrupt events; XFAILB provides bidirectional fail-safe signaling with external controller |
| VDDIO, VDDOTP | Supply inputs | VDDIO powers I/Os (1.8 V or 3.3 V); VDDOTP supplies OTP programming block (up to 10 V) - isolated for secure configuration |
| SCL, SDA, SYNC | Communication pins | I²C bus interface (3.4 MHz) and bidirectional SYNC pin for clock synchronization or spread-spectrum control |
| AGND, EPAD | Ground connections | Analog ground reference and thermally enhanced exposed pad - must be soldered to PCB ground plane for thermal and EMI performance |
Key Features
| Feature | Design Value |
|---|---|
| OTP-based startup configuration | Eliminates external resistors and sequencing ICs by storing voltage targets, ramp rates, and enable order in one-time programmable memory |
| Dynamic voltage scaling (DVS) | Per-regulator DVS via I²C allows real-time voltage adjustment (6.25 mV steps) to match processor DVFS states - reduces dynamic power by up to 30 % |
| VTT termination mode | SW2 configurable as DDR VTT supply (0.9 V ±1%) with dedicated current-sense and regulation - supports DDR3/DDR4 memory interfaces |
| Thermal & fault monitoring | Integrated thermal shutdown (TJ > 150 °C), overvoltage/undervoltage detection on all rails, and programmable current limiting prevent system damage during transient faults |
| Wettable flank QFN | 40-pin HVQFN with solderable side flanks enables automated optical inspection (AOI) of solder joints - critical for zero-defect automotive manufacturing |
Applications
| Automotive Infotainment Head Unit | Advanced Driver Assistance Systems (ADAS) Camera Module |
|---|---|
Use Scenario: Central infotainment unit powering i.MX 8 QuadMax SoC, display interface, audio codec, and USB peripherals in vehicle dashboard. IC Role / Device Role / Timing Role: Primary PMIC providing three regulated rails (core, GPU, I/O) with synchronized startup, PGOOD coordination, and RESETBMCU timing aligned to SoC boot requirements. Use Value: Reduces BOM count by 7 components vs discrete solution; achieves <50 ms cold-boot time via OTP-optimized sequencing and eliminates external sequencing logic. | Use Scenario: Compact rear-view or surround-view camera ECU with S32V234 processor, image sensor, and ISP, operating in high-temperature cabin environments. IC Role / Device Role / Timing Role: Power manager delivering 1.0 V core, 1.8 V I/O, and DDR VTT rails with thermal derating, fault logging, and fail-safe XFAILB signaling to host domain controller. Use Value: Enables continuous operation up to 125 °C ambient; thermal monitoring triggers graceful degradation instead of hard shutdown - improves system uptime and diagnostics. |
| Industrial Human-Machine Interface (HMI) | Medical Imaging Control Panel |
Use Scenario: Ruggedized factory-floor HMI running Linux on i.MX 6ULL, driving capacitive touchscreen and Ethernet connectivity. IC Role / Device Role / Timing Role: Standalone PMIC supplying processor, memory, and peripheral rails with programmable soft-start to avoid inrush current tripping upstream 24 V DC-DC converters. Use Value: I²C configurability allows field firmware updates to adjust voltages for different display panels - avoids hardware respins across product variants. | Use Scenario: Diagnostic imaging console with real-time video processing, touch UI, and network connectivity in hospital environments requiring long-term reliability. IC Role / Device Role / Timing Role: High-integrity power controller delivering tightly regulated 1.1 V, 1.8 V, and 3.3 V rails with ABIST self-test, CRC-protected registers, and watchdog supervision. Use Value: Supports IEC 62304 Class C software safety requirements via deterministic fault reporting, register integrity checks, and fail-safe state transitions. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar PMIC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MPF5023CMBA0ES | ASIL B–certified variant with additional safety registers (FS_CNT, OTP_FS_MAX_CNT), ABIST enhancements, and fail-safe state machine extensions | Required for ISO 26262 ASIL B–compliant systems where internal fault detection and lock-down behavior are mandated | Select MPF5023CMBA0ES when functional safety certification is required; MPF5023CMMA0ES suffices for QM-level automotive systems without ASIL enforcement |
| PF5023CVNA0ES | Industrial-grade version rated for −40 °C to +105 °C ambient; lacks automotive qualification (AEC-Q100) and QM/ASIL labeling | Suitable for non-automotive embedded applications such as industrial gateways or test equipment where extended temperature is not needed | Choose PF5023CVNA0ES for cost-sensitive industrial designs without automotive qualification requirements; MPF5023CMMA0ES ensures full AEC-Q100 compliance and QM traceability |
Compared with MPF5023CMBA0ES and PF5023CVNA0ES, MPF5023CMMA0ES uniquely balances automotive qualification (AEC-Q100 Grade 1), QM safety classification, and production-ready OTP configuration - making it optimal for volume infotainment and ADAS ECUs where certification overhead must be minimized without sacrificing reliability.
Availability
MPF5023CMMA0ES is available at Aetrix Electronics and suitable for automotive infotainment, ADAS camera modules, and industrial HMIs requiring stable component supply, AEC-Q100 qualification, and long-term lifecycle support.
Supply support for MPF5023CMMA0ES includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure, high-performance processing and power management solutions for automotive, industrial, and IoT markets.
The PF5023 product line delivers integrated power management for NXP's i.MX and S32V application processors, engineered to simplify power architecture, reduce system-level BOM, and accelerate time-to-market for complex embedded systems.
FAQ
What is the safety qualification level of MPF5023CMMA0ES?
MPF5023CMMA0ES is certified to AEC-Q100 Grade 1 and classified as QM (Quality Management) - meaning it meets automotive reliability standards but does not implement ASIL B–level safety mechanisms like those in MPF5023CMBA0ES. It supports functional safety system integration without built-in ASIL B certification overhead, making it ideal for non-safety-critical automotive subsystems such as infotainment displays and audio processors.
Does MPF5023CMMA0ES support dynamic voltage scaling (DVS)?
Yes, MPF5023CMMA0ES supports per-regulator dynamic voltage scaling via its 3.4 MHz I²C interface. Each buck converter (SW1–SW3) can be adjusted in 6.25 mV steps while the system is running, enabling real-time adaptation to processor DVFS states. This capability is implemented in the functional register map and requires no OTP reprogramming - allowing runtime optimization of power efficiency across varying compute loads.
What package type and thermal characteristics does MPF5023CMMA0ES use?
MPF5023CMMA0ES uses a 40-pin HVQFN package (6 mm × 6 mm × 0.9 mm, 0.5 mm pitch) with wettable flanks and an exposed thermal pad. Its junction-to-ambient thermal resistance is 26.8 °C/W (JESD51-7, 2s6p board), and it operates from −40 °C to +125 °C ambient. The exposed pad must be soldered to a PCB ground plane with ≥9 thermal vias to achieve specified thermal performance and ensure reliable operation in automotive under-hood environments.
Can MPF5023CMMA0ES be used with non-NXP processors?
Yes, MPF5023CMMA0ES is compatible with non-NXP processors including Qualcomm Snapdragon, Texas Instruments Jacinto, and Renesas R-Car families. Its three configurable buck regulators, programmable sequencing, and I²C interface provide flexible rail generation and control. Application notes confirm successful integration with these platforms using custom OTP configurations and external enable logic - no NXP-specific firmware or drivers are required.
How is OTP programming handled for MPF5023CMMA0ES?
OTP programming for MPF5023CMMA0ES is performed exclusively by NXP or authorized third parties during production - end customers cannot program OTP in-system. During engineering development, NXP's GUI-based tool and socketed evaluation board allow emulation and OTP configuration validation. Production units ship with factory-programmed OTP contents; field updates are limited to volatile I²C register writes - ensuring configuration integrity and preventing accidental corruption.
MPF5023CMMA0ES Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 40-VFQFN Exposed Pad
- Packaging:
- Tray
- Product Status:
- Active
- Applications:
- High Performance i.MX 8, S32x Processor Based
- Current - Supply:
- 200µA
- Voltage - Supply:
- 2.5V ~ 5.5V
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount, Wettable Flank
- Supplier Device Package:
- 40-HVQFN (6x6)
MPF5023CMMA0ES FAQ
1.How can I place an order for MPF5023CMMA0ES through Aetrix?
Please submit a Request for Quotation (RFQ) for MPF5023CMMA0ES on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MPF5023CMMA0ES reliable?
The price and inventory of MPF5023CMMA0ES are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MPF5023CMMA0ES is usually 5 days.
3.What payment methods are accepted for MPF5023CMMA0ES?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MPF5023CMMA0ES transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MPF5023CMMA0ES?
MPF5023CMMA0ES orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MPF5023CMMA0ES order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MPF5023CMMA0ES?
For technical support, including MPF5023CMMA0ES datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MPF5023CMMA0ES requirements.
6.How does Aetrix verify that MPF5023CMMA0ES is sourced from the original manufacturer or authorized distributors?
All MPF5023CMMA0ES products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MPF5023CMMA0ES meets industry standards.
7.What is the process for return or replacement of MPF5023CMMA0ES?
All MPF5023CMMA0ES units undergo pre-shipment inspection (PSI). If there is an issue with MPF5023CMMA0ES, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MPF5023CMMA0ES part is unused and in its original packaging.
Return procedure for MPF5023CMMA0ES:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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