NXP Semiconductors MPF5023CVNA0ES
- Part No.:
- MPF5023CVNA0ES
- Manufacturer:
- NXP Semiconductors
- Category:
- Power Management - Specialized
- Package:
- 40-VFQFN Exposed Pad
- Datasheet:
-
MPF5023CVNA0ES.pdf
- Description:
- POWER MANAGEMENT IC, PRE-PROG, 3
- Quantity:
- Payment:

- Shipping:

Inventory:3,918
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
MPF5023CVNA0ES from NXP Semiconductors is an industrial-grade power management IC (PMIC) integrating three high-efficiency buck regulators (SW1–SW3), a watchdog timer, ASIL B–capable monitoring circuitry, and one-time programmable (OTP) memory for startup configuration. It delivers 2.5 A per regulator with 0.4 V to 1.8 V output range, 6.25 mV step resolution, and supports dynamic voltage scaling-designed for i.MX 8/S32V application processors in high-end industrial control systems.
For engineers reviewing the MPF5023CVNA0ES datasheet, MPF5023CVNA0ES pinout, MPF5023CVNA0ES application, or MPF5023CVNA0ES equivalent, this page provides verified technical context, validated pin functions, confirmed thermal and safety specifications, I²C interface timing (3.4 MHz), and real-world use cases in processor power delivery where stable sequencing, fault reporting, and OTP-based configuration reduce external component count.
Technical Context
The MPF5023CVNA0ES implements a deterministic state machine supporting seamless processor interface, with dedicated transitions for LP_Off, QPU_Off, self-test (ASIL B only), and fail-safe shutdown. Its architecture includes independent enable inputs (EN1–EN3), PGOOD outputs per regulator (PGOOD1–PGOOD3) plus global PGOOD, and configurable SYNC pin for clock synchronization across multiple PMICs.
It integrates analog built-in self-test (ABIST), dual bandgap references (VBG1/VBG2), thermal monitoring with shutdown at 150 °C, and OTP-programmable soft-start/power-down sequences. The device operates from −40 °C to +105 °C ambient, matching its industrial temperature grade, and uses VDDIO at 1.8 V or 3.3 V for I/O logic compatibility.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Regulator Count | Three independent buck regulators (SW1, SW2, SW3) enabling multi-rail power delivery for SoC core, I/O, and memory rails. |
| Output Voltage Range | 0.4 V to 1.8 V per regulator, with 6.25 mV step resolution-supports precise voltage scaling for ARM Cortex-A cores and DDR interfaces. |
| Rated Output Current | 2500 mA per buck channel-sufficient for high-performance i.MX 8 application processors under full load. |
| I²C Interface Speed | Up to 3.4 MHz-enables rapid runtime reconfiguration of voltage, sequencing, and protection thresholds without interrupting system operation. |
| Operating Temperature | −40 °C to +105 °C ambient-validated for industrial environments including factory automation and edge computing nodes. |
| Safety Certification | ASIL B–capable monitoring circuitry (voltage, thermal, watchdog), though MPF5023CVNA0ES itself is the industrial variant-not automotive ASIL B qualified. |
| Package Type | HVQFN40 (6 mm × 6 mm × 0.9 mm, 0.5 mm pitch, wettable flank)-optimized for thermal dissipation and automated optical inspection (AOI) in high-reliability PCB assembly. |
Pinout & Package
HVQFN40 package with exposed thermal pad (EPAD), 40-pin layout, 0.5 mm pitch, and wettable flank for solder joint reliability. EPAD must be connected to AGND for thermal and electrical performance.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| SW1FB, SW2FB, SW3FB | Feedback inputs | Resistor-divider inputs for closed-loop regulation; support 0.4–1.8 V output with 6.25 mV resolution. |
| EN1, EN2, EN3 | Enable inputs | Independent digital control of each buck regulator-allows flexible power rail activation and sequencing. |
| PGOOD1, PGOOD2, PGOOD3 | Per-regulator status outputs | Open-drain signals indicating valid output voltage; used for inter-rail dependency checks in boot sequence. |
| PGOOD, INTB, RESETBMCU | Global status/interrupt/reset outputs | PGOOD asserts when all enabled rails are in regulation; INTB reports faults; RESETBMCU releases MCU from reset after successful power-up. |
| VIN, SW1IN–SW3IN | Main and regulator input supplies | VIN powers internal LDOs and logic; SWxIN supplies respective buck stages-each rated up to 6.0 V with UVLO at 5.5 V. |
| VDDIO, VDDOTP | I/O and OTP programming supplies | VDDIO sets logic level (1.8 V or 3.3 V); VDDOTP (−0.3 to 10 V) enables OTP programming during engineering development only. |
| SCL, SDA, SYNC | I²C and clock sync interface | High-speed (3.4 MHz) I²C bus for register access; SYNC pin supports master/slave clock synchronization across multiple PMICs. |
| AGND, EPAD | Analog ground and thermal pad | AGND reference for analog circuits; EPAD must be soldered to PCB ground plane to achieve RθJA = 26.8 °C/W (2s6p). |
Key Features
| Feature | Design Value |
|---|---|
| OTP-based startup configuration | Reduces external resistor networks and sequencing logic-startup voltage, order, and timing stored in one-time programmable memory. |
| Dynamic voltage scaling (DVS) | Enables real-time adjustment of output voltage per buck regulator via I²C-critical for CPU DVFS and power optimization in embedded Linux systems. |
| VTT termination mode on SW2 | Configurable as DDR VTT supply (0.9 V ±1%)-eliminates need for discrete VTT regulator in DDR4/DDR5 memory subsystems. |
| Spread-spectrum switching | Reduces EMI peak emissions by modulating switching frequency-simplifies compliance with CISPR 22/32 Class B radiated emission limits. |
| Fail-safe state transition | Locks down regulators upon critical failure (e.g., thermal shutdown, triple self-test failure)-prevents uncontrolled power delivery to downstream SoC. |
| ABIST and dual-bandgap monitoring | Detects analog circuit faults (e.g., bandgap drift >5–12%) and validates voltage monitor integrity before system boot-required for functional safety workflows. |
Applications
| Industrial Edge AI Gateway | i.MX 8M Plus-Based HMI |
|---|---|
Use Scenario: Powering i.MX 8M Plus SoC with quad Cortex-A53, GPU, VPU, and dual DDR4 channels in a fanless industrial gateway deployed in 24/7 operation. IC Role / Device Role / Timing Role: Primary PMIC delivering core (0.8 V), GPU (0.9 V), DDR4 VTT (0.9 V), and I/O (1.8 V) rails with synchronized startup and fault-aware shutdown. Use Value: OTP-configured sequencing eliminates FPGA-based power controllers; ABIST and thermal monitoring ensure long-term reliability in unattended deployments. |
Use Scenario: High-resolution touchscreen HMI in factory automation panel with real-time response requirements and extended temperature operation. IC Role / Device Role / Timing Role: Centralized power manager supplying CPU core, DDR3L, display interface (LVDS), and USB PHY rails-with PGOOD chaining and RESETBMCU coordination. Use Value: 3.4 MHz I²C allows dynamic voltage adjustment during UI rendering load changes; VTT mode on SW2 simplifies DDR3L termination design. |
| Automotive-Grade Infotainment Module (Industrial Derivative) | Multi-Processor Industrial Controller |
Use Scenario: Reusing i.MX 8QuadMax reference design in non-automotive infotainment-e.g., kiosk or digital signage-requiring robust power sequencing and thermal resilience. IC Role / Device Role / Timing Role: Standalone PMIC replacing automotive ASIL-B variant (MPF5023CMBA0ES) while retaining identical pinout and register map for design reuse. Use Value: Identical HVQFN40 footprint and I²C command set enable drop-in substitution; 105 °C rating supports enclosed enclosures without active cooling. |
Use Scenario: Dual-processor controller running real-time OS and Linux simultaneously-demanding independent rail control, fast wake-up, and deterministic fault response. IC Role / Device Role / Timing Role: Configurable regulator enable/disable per processor domain; STANDBY input triggers low-power retention mode; WDI monitors host watchdog timeout. Use Value: Independent ENx pins allow selective power gating; watchdog integration reduces external components; LP_Off state achieves <10 µA quiescent current. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar PMIC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MPF5023CMBA0ES | Automotive variant with ASIL B certification, TBBEN-enabled self-test, fail-safe state, and OTP safety bits (FS_CNT, I2C_SECURE_EN). | Required for ISO 26262-compliant automotive infotainment; not qualified for industrial use due to different qualification testing. | Select MPF5023CMBA0ES only when functional safety certification is mandatory and automotive AEC-Q100 Grade 1 (−40 °C to +125 °C) is required. |
| PF5023VNA0ES | Same silicon die and pinout as MPF5023CVNA0ES but without NXP's enhanced industrial screening and traceability-no guaranteed 105 °C operation or extended reliability testing. | Lower-cost option for non-critical commercial applications where full industrial qualification is unnecessary. | Choose PF5023VNA0ES only for cost-sensitive prototypes or consumer-grade designs where ambient temperature stays below 85 °C. |
Compared with MPF5023CMBA0ES, MPF5023CVNA0ES omits ASIL B–specific registers and self-test execution but retains identical regulator performance, pinout, and I²C interface-making it ideal for industrial reuse of automotive reference designs. Versus PF5023VNA0ES, MPF5023CVNA0ES guarantees 105 °C operation and full industrial reliability screening, ensuring longevity in harsh environments.
Availability
MPF5023CVNA0ES is available at Aetrix Electronics and suitable for industrial edge AI gateways, i.MX 8-based HMIs, and multi-processor controllers requiring stable component supply, long lifecycle support, and guaranteed 105 °C operation.
Supply support for MPF5023CVNA0ES includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT applications-with over 20 years of PMIC innovation for NXP application processors.
The PF5023 product line was designed specifically to serve as the primary power management building block for i.MX 8 and S32V series multimedia processors-delivering tightly integrated, OTP-configurable, and safety-aware power delivery in compact HVQFN packages.
FAQ
What is the maximum input voltage rating for MPF5023CVNA0ES?
The MPF5023CVNA0ES has an absolute maximum VIN rating of 6.0 V, but continuous operation above 5.5 V is limited to ≤1800 seconds over the device lifetime to ensure long-term reliability. Its recommended operating input voltage is up to 5.5 V, aligned with standard 5 V supply rails in industrial systems.
Does MPF5023CVNA0ES support DDR4 VTT termination?
Yes, MPF5023CVNA0ES supports DDR4 VTT termination on SW2 regulator. When configured in VTT mode, SW2 delivers a precise 0.9 V output with tight regulation-enabling direct connection to DDR4 memory termination networks without external components.
Can MPF5023CVNA0ES be programmed in-system via I²C?
Yes, MPF5023CVNA0ES supports full runtime configuration via its 3.4 MHz I²C interface-including output voltage, sequencing order, soft-start time, and protection thresholds. However, OTP programming is restricted to engineering development using NXP's GUI and socketed evaluation board-not permitted in production.
What is the thermal resistance of MPF5023CVNA0ES in standard PCB layout?
For a JEDEC JESD51-7 2s6p test board (four internal layers, 35 µm copper), MPF5023CVNA0ES achieves RθJA = 26.8 °C/W. This value assumes proper thermal via array under the EPAD connected to a solid ground plane-critical for maintaining junction temperature ≤150 °C at full 2.5 A load per rail.
How does MPF5023CVNA0ES differ from the automotive MPF5023CMBA0ES?
MPF5023CVNA0ES is the industrial variant: same silicon, pinout, and register map as MPF5023CMBA0ES but without ASIL B–specific features (TBBEN self-test, fail-safe state, FS_CNT, I2C_SECURE_EN). It is qualified for −40 °C to +105 °C (vs. +125 °C for automotive) and lacks AEC-Q100 Grade 1 qualification.
MPF5023CVNA0ES Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 40-VFQFN Exposed Pad
- Packaging:
- Tray
- Product Status:
- Active
- Applications:
- High Performance i.MX 8, S32x Processor Based
- Current - Supply:
- 200µA
- Voltage - Supply:
- 2.5V ~ 5.5V
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount, Wettable Flank
- Supplier Device Package:
- 40-HVQFN (6x6)
MPF5023CVNA0ES FAQ
1.How can I place an order for MPF5023CVNA0ES through Aetrix?
Please submit a Request for Quotation (RFQ) for MPF5023CVNA0ES on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MPF5023CVNA0ES reliable?
The price and inventory of MPF5023CVNA0ES are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MPF5023CVNA0ES is usually 5 days.
3.What payment methods are accepted for MPF5023CVNA0ES?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MPF5023CVNA0ES transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MPF5023CVNA0ES?
MPF5023CVNA0ES orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MPF5023CVNA0ES order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MPF5023CVNA0ES?
For technical support, including MPF5023CVNA0ES datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MPF5023CVNA0ES requirements.
6.How does Aetrix verify that MPF5023CVNA0ES is sourced from the original manufacturer or authorized distributors?
All MPF5023CVNA0ES products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MPF5023CVNA0ES meets industry standards.
7.What is the process for return or replacement of MPF5023CVNA0ES?
All MPF5023CVNA0ES units undergo pre-shipment inspection (PSI). If there is an issue with MPF5023CVNA0ES, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MPF5023CVNA0ES part is unused and in its original packaging.
Return procedure for MPF5023CVNA0ES:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MPF5023CVNA0ES Tags

-
TPS2511DGNR
Texas Instruments

-
UTC2000/MG
Microchip Technology

-
TUSB320HAIRWBR
Texas Instruments

-
TPS61252DSGR
Texas Instruments

-
PI5USB30216CXUAEX
Diodes Incorporated
-
SN6501DBVR
Texas Instruments

-
CYPD3177-24LQXQT
Infineon Technologies
-
SN6501QDBVRQ1
Texas Instruments

-
STUSB1600AQTR
STMicroelectronics

-
SN6505BDBVR
Texas Instruments
-
SN6501DBVT
Texas Instruments

-
TPS65150PWPR
Texas Instruments
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

