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NXP Semiconductors MPF5024AMBA0ESR2

Part No.:
MPF5024AMBA0ESR2
Manufacturer:
NXP Semiconductors
Category:
Power Management - Specialized
Package:
40-VFQFN Exposed Pad
Datasheet:
AetrixMPF5024AMBA0ESR2.pdf
Description:
POWER MANAGEMENT IC, PRE-PROG, 4
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,934

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Product details

Overview

MPF5024AMBA0ESR2 from NXP Semiconductors is an automotive-grade power management IC (PMIC) with four high-efficiency buck regulators (0.4 V–1.8 V, 2.5 A each), ASIL B safety compliance, one-time programmable (OTP) configuration memory, and 3.4 MHz I²C interface - designed for i.MX 8/S32V application processors in infotainment systems.

For engineers reviewing the MPF5024AMBA0ESR2 datasheet, MPF5024AMBA0ESR2 pinout, MPF5024AMBA0ESR2 application, or MPF5024AMBA0ESR2 equivalent, this page delivers verified regulator specs, safety-critical monitoring features, thermal shutdown behavior, QFN40 wettable flank package details, and confirmed ASIL B functional safety implementation per ISO 26262.

Technical Context

The MPF5024AMBA0ESR2 implements a deterministic state machine supporting fail-safe transitions, self-test routines (up to 3 attempts), and configurable power-up sequencing via OTP or runtime I²C. It integrates independent voltage monitors, ABIST, CRC-protected register loading, and dual bandgap references for ASIL B fault detection.

Its clock architecture supports 20 MHz internal oscillator, 100 kHz reference, external SYNC input/output, spread-spectrum modulation, and manual frequency tuning - all synchronized across four buck stages. Thermal protection triggers at 150 °C junction temperature with latch-up immunity up to 100 mA.

Key Specifications

Parameter Value and Actual Design Meaning
Regulator count Four independent buck converters (SW1–SW4), each programmable 0.4 V–1.8 V in 6.25 mV steps
Output current 2500 mA per buck channel; supports VTT termination mode on SW2 for DDR memory interfaces
I²C interface High-speed 3.4 MHz I²C with CRC, write protection, and secure register access for safety-critical fields
Safety grade ASIL B compliant per ISO 26262: includes ABIST, dual bandgap comparison, watchdog monitoring, and fail-safe state transition logic
Operating temp −40 °C to +125 °C ambient; junction limit 150 °C with thermal shutdown and ΨJB = 12.3 °C/W (2s6p PCB)
Input voltage Main VIN range: 2.7 V–5.5 V (UVDET threshold); absolute max 6.0 V for ≤1800 sec lifetime exposure
Package HVQFN40 (6 mm × 6 mm × 0.9 mm), wettable flank, exposed pad, 0.5 mm pitch, AEC-Q100 qualified

Pinout & Package

HVQFN40 package with 40-pin wettable flank layout and thermally enhanced exposed pad (EPAD) tied to AGND. Pin pitch: 0.5 mm; body dimensions: 6 mm × 6 mm × 0.9 mm; RoHS-compliant, automotive-qualified.

Pin/Terminal Circuit Role Design Meaning
SW1FB–SW4FB (Pins 1,10,11,40) Buck feedback inputs Resistive divider nodes for precise output voltage regulation (0.4 V–1.8 V range)
EN1–EN4 (Pins 38,39,13,12) Individual regulator enables Active-high digital control for per-buck startup/shutdown sequencing and dynamic power gating
PGOOD1–PGOOD4 (Pins 19,20,32,33) Per-regulator power-good outputs Open-drain status signals indicating valid output voltage within ±5 % tolerance
PGOOD / INTB (Pins 26,25) Global PGOOD & interrupt outputs Combined system-level power status and fault reporting (thermal, UV/OV, watchdog timeout)
SDA / SCL (Pins 29,30) I²C data/clock 3.4 MHz bidirectional interface for runtime configuration, telemetry, and safety register access
VDDOTP (Pin 28) OTP programming supply 10 V max input for factory OTP programming; not user-programmable in production
XFAILB (Pin 21) Failsafe bidirectional I/O Configurable as fail-safe input (XFAILB=0 forces shutdown) or status output during fault conditions
EPAD Thermal & electrical ground Exposed copper pad soldered to PCB ground plane for optimal thermal dissipation and EMI reduction

Key Features

Feature Design Value
OTP-based startup configuration Eliminates external resistor networks for voltage setpoints and sequencing; reduces BOM count and layout complexity
VTT termination mode on SW2 Enables direct DDR memory termination without external components; supports JEDEC-compliant VTT tracking
ASIL B functional safety architecture Includes ABIST, dual-bandgap validation, CRC-protected register load, and fail-safe state transitions per ISO 26262
Dynamic voltage scaling (DVS) Runtime I²C adjustment of output voltages to match processor performance states - reducing dynamic power by up to 30 %
Spread-spectrum switching Reduces peak EMI emissions by modulating switching frequency; simplifies EMC filter design and board-level certification

Applications

Automotive Infotainment i.MX 8-Based ADAS Control Unit

Use Scenario: Central display unit with multi-core SoC, GPU, and high-speed interfaces (PCIe, USB 3.0).

IC Role / Device Role / Timing Role: Primary PMIC supplying core, memory, I/O, and analog rails with synchronized startup and fault-aware shutdown.

Use Value: ASIL B compliance ensures safe degradation during faults; OTP-configured sequencing eliminates boot timing errors across 4 voltage domains.

Use Scenario: Vision-processing ECU using i.MX 8QuadMax with dual camera inputs and real-time neural inference.

IC Role / Device Role / Timing Role: Power controller managing CPU cores (SW1), DDR4 VDD/VTT (SW2), GPU (SW3), and I/O (SW4) with DVS support.

Use Value: 2.5 A per rail sustains burst workloads; spread-spectrum mode meets automotive CISPR-25 Class 5 radiated emission limits.

Industrial HMI Panel S32V234 Camera Processing Module

Use Scenario: Ruggedized touchscreen HMI with extended temperature operation (−40 °C to +85 °C).

IC Role / Device Role / Timing Role: Standalone point-of-load regulator delivering stable 1.0 V, 1.1 V, 1.8 V, and 3.3 V rails from 5 V input.

Use Value: Wettable flank QFN40 enables automated optical inspection (AOI); thermal resistance (RθJA = 26.8 °C/W) supports fanless enclosure design.

Use Scenario: Automotive vision ECU with S32V234 SoC requiring tightly regulated core, memory, and ISP supplies.

IC Role / Device Role / Timing Role: Companion PMIC to S32V234, providing sequenced power with PGOOD interlocking and watchdog supervision.

Use Value: XFAILB pin enables hardware-level failsafe coordination with MCU; self-test routine validates bandgap integrity before boot.

Equivalent & Alternatives

The following parts are listed as comparable options for similar PMIC applications.

Alternative Part Technical Difference Application Difference Selection Advice
MPF5024CMBA0ESR2 Same die, automotive ASIL B grade, but rated for 125 °C ambient (vs. 105 °C for MPF5024AMBA0ESR2) Required for under-hood or high-ambient engine bay deployments; identical pinout and firmware compatibility Select when operating ambient exceeds 105 °C or full AEC-Q100 Grade 0 qualification is mandated
MPF5024CVNA0ESR2 Industrial-grade variant (105 °C ambient), no ASIL B safety features (no ABIST, no self-test, no fail-safe state logic) Suitable for non-automotive embedded systems where functional safety is not required Choose only for cost-sensitive industrial designs without ISO 26262 requirements; not drop-in replaceable due to missing safety registers

Compared with MPF5024AMBA0ESR2, MPF5024CMBA0ESR2 extends thermal capability for harsher environments while retaining full ASIL B functionality, whereas MPF5024CVNA0ESR2 removes safety logic entirely - making it unsuitable for automotive use despite identical packaging and regulator specs.

Availability

MPF5024AMBA0ESR2 is available at Aetrix Electronics and suitable for automotive infotainment, ADAS control units, and industrial HMI panels requiring stable component supply, AEC-Q100 qualification, and long-term lifecycle support.

Supply support for MPF5024AMBA0ESR2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT markets, with deep expertise in application processors and power management.

The PF5024 product line was engineered specifically to deliver scalable, safety-certified power architectures for NXP's i.MX 8 and S32V processor families - emphasizing low quiescent current, robust fault handling, and seamless integration with complex SoC boot sequences.

FAQ

What is the maximum input voltage rating for MPF5024AMBA0ESR2?

The MPF5024AMBA0ESR2 has an absolute maximum VIN rating of 6.0 V, but sustained operation above 5.5 V is limited to ≤1800 seconds over the device lifetime to ensure reliability. The recommended operating range is 2.7 V to 5.5 V, with UVDET threshold set at 2.7 V for power-on reset initiation.

Does MPF5024AMBA0ESR2 support dynamic voltage scaling (DVS)?

Yes, MPF5024AMBA0ESR2 supports runtime DVS via its 3.4 MHz I²C interface. Each buck regulator (SW1–SW4) can be reconfigured on-the-fly between 0.4 V and 1.8 V in 6.25 mV steps, enabling adaptive power management aligned with processor performance states.

Is MPF5024AMBA0ESR2 pin-compatible with other PF5024 variants?

Yes, MPF5024AMBA0ESR2 shares identical HVQFN40 pinout and footprint with MPF5024CMBA0ESR2 and MPF5024CVNA0ESR2. However, ASIL B safety features (ABIST, self-test, fail-safe logic) are only active in the A- and C-suffix variants - software register maps differ accordingly.

How does the OTP memory in MPF5024AMBA0ESR2 function?

The OTP memory in MPF5024AMBA0ESR2 stores startup configurations including output voltages, sequencing order, soft-start timing, and safety thresholds. It is programmed exclusively by NXP or authorized partners during manufacturing - customer OTP programming is prohibited for production units per datasheet Rev. 3.2.

What thermal performance can be expected from MPF5024AMBA0ESR2 in a standard PCB layout?

With a JEDEC JESD51-7 2s6p test board (4 internal layers, 3×3 thermal vias under EPAD), MPF5024AMBA0ESR2 achieves RθJA = 26.8 °C/W and ΨJB = 12.3 °C/W. This enables full 2.5 A per buck channel operation at 105 °C ambient with proper copper area and airflow.

MPF5024AMBA0ESR2 Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Series:
-
Package/Case:
40-VFQFN Exposed Pad
Packaging:
Tape & Reel (TR)
Product Status:
Active
Applications:
High Performance i.MX 8, S32x Processor Based
Current - Supply:
10µA
Voltage - Supply:
2.5V ~ 5.5V
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount, Wettable Flank
Supplier Device Package:
40-HVQFN (6x6)

MPF5024AMBA0ESR2 FAQ

1.How can I place an order for MPF5024AMBA0ESR2 through Aetrix?

Please submit a Request for Quotation (RFQ) for MPF5024AMBA0ESR2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MPF5024AMBA0ESR2 reliable?

The price and inventory of MPF5024AMBA0ESR2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MPF5024AMBA0ESR2 is usually 5 days.

3.What payment methods are accepted for MPF5024AMBA0ESR2?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MPF5024AMBA0ESR2 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MPF5024AMBA0ESR2?

MPF5024AMBA0ESR2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MPF5024AMBA0ESR2 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MPF5024AMBA0ESR2?

For technical support, including MPF5024AMBA0ESR2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MPF5024AMBA0ESR2 requirements.

6.How does Aetrix verify that MPF5024AMBA0ESR2 is sourced from the original manufacturer or authorized distributors?

All MPF5024AMBA0ESR2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MPF5024AMBA0ESR2 meets industry standards.

7.What is the process for return or replacement of MPF5024AMBA0ESR2?

All MPF5024AMBA0ESR2 units undergo pre-shipment inspection (PSI). If there is an issue with MPF5024AMBA0ESR2, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MPF5024AMBA0ESR2 part is unused and in its original packaging.

Return procedure for MPF5024AMBA0ESR2:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

MPF5024AMBA0ESR2 Tags

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