Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

NXP Semiconductors MPF5030BMMA0ES

Part No.:
MPF5030BMMA0ES
Manufacturer:
NXP Semiconductors
Category:
Power Management - Specialized
Package:
40-PowerVFQFN
Datasheet:
AetrixMPF5030BMMA0ES.pdf
Description:
PMIC 3 BUCKS 2 LDO A1 DIE
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,016

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

MPF5030BMMA0ES from NXP Semiconductors is a fail-safe power management IC (PMIC) designed as a companion to S32Z2/E2 automotive processors. It integrates two configurable synchronous buck converters (BUCK1/2 up to 3.5 A each, multiphase capable to 7.0 A), one 2.5 A buck (BUCK3), and two 400 mA LDOs - all operating from a 3.3–5.25 V input. Its ASIL D–capable voltage supervision and I2C-configurable sequencing support EV propulsion domain controllers.

For engineers reviewing the MPF5030BMMA0ES datasheet, MPF5030BMMA0ES pinout, MPF5030BMMA0ES application, or MPF5030BMMA0ES equivalent, this page delivers verified functional safety parameters, OTP-programmable startup configuration, thermal resistance data (RθJA = 30.1 °C/W), and precise pin-level circuit roles for automotive drive train system design.

Technical Context

The MPF5030BMMA0ES implements dual-domain power management with independent main and fail-safe domains (GNDFS/GND), enabling ASIL D compliance on UV/OV monitoring across 0.8 V, 1.1 V, 1.8 V, and 3.3 V rails. Its integrated analog multiplexer supports full-system voltage and temperature monitoring via six inputs with ±1.0 % accuracy.

Startup is controlled by OTP memory storing output voltages and sequencing order, reducing external components; runtime reconfiguration uses a 32-bit I2C interface with 8-bit CRC. The device includes LBIST/ABIST, dedicated PGOOD/RSTB/FS0B safety outputs with latent fault detection, and 10 ms RSTB delay for MCU compliance.

Key Specifications

ParameterValue and Actual Design Meaning
Input Voltage Range3.3 V to 5.25 V DC - supports direct integration with FS86/FS6x front-end supplies in automotive drivetrain systems
BUCK1/2 Output0.7 V to 1.5 V, up to 3.5 A per phase - configurable for core rail of S32Z2/E2 processors; multiphase operation enables 7.0 A total
BUCK3 Output1.0 V to 4.1 V, up to 2.5 A - powers auxiliary subsystems including I/O or peripherals
LDO1/LDO2 Output1.1 V to 4.1 V, up to 400 mA each - supplies MCU I/O and system peripherals with low-noise regulation
Voltage Monitoring Accuracy±1.0 % target accuracy across up to 6 inputs - enables ASIL D–compliant UV/OV detection on critical power rails
Thermal ResistanceRθJA = 30.1 °C/W - validated on JEDEC-standard board; supports thermal design in compact 6 × 6 mm QFN packages
Functional SafetyASIL D on SG1 (UV/OV), QM on SG2 (watchdog) - certified per ISO 26262 for safety goal decomposition in automotive applications

Pinout & Package

MPF5030BMMA0ES uses an HVQFN40EP package: 6 mm × 6 mm × 0.85 mm body, 0.5 mm pitch, wettable flanks, and exposed thermal pad (EP) soldered to GND for optimal heat dissipation.

Pin/TerminalCircuit RoleDesign Meaning
BUCK1_FB / BUCK2_FB / BUCK3_FBVoltage feedback inputCloses regulation loop for respective buck converters; enables precise output voltage control
LDO1_OUT / LDO2_OUTRegulated outputDelivers stable low-noise supply to MCU I/O and peripheral circuits
PGOOD / RSTB / FS0BSafety status outputsOpen-drain active-low signals indicating power health, reset state, and fail-safe condition with latent fault detection
SCL / SDAI2C interface32-bit command interface with 8-bit CRC for runtime configuration and telemetry readback
XFAILBPower-up synchronizationEnables coordinated sequencing with external PMICs or safety controllers in multi-rail systems

Key Features

FeatureDesign Value
OTP-based startup configurationEliminates external resistor networks for voltage setpoints and sequencing order, reducing BOM count and layout complexity
Dual-domain ground separationGNDFS and GND pins isolate fail-safe logic from main domain, supporting ASIL D fault containment requirements
Integrated analog multiplexerRoutes up to six voltage/temperature sensor inputs to internal ADC, enabling consolidated system health monitoring
EMI-optimized switching regulatorsSpread spectrum and manual frequency tuning reduce conducted emissions to meet IEC 61967-4 automotive standards
Fail-safe state machineHardware-enforced response to detected faults, independent of software execution, ensuring deterministic behavior during safety events

Applications

EV Propulsion Domain ControllerChassis-Integrated System

Use Scenario: Centralized power management for traction inverter control units requiring redundant rail monitoring and fail-safe shutdown.

IC Role / Device Role / Timing Role: Primary PMIC providing core (0.825 V), I/O (1.1 V), and analog (3.3 V) rails to S32Z2 processor with ASIL D–compliant UV/OV supervision.

Use Value: Enables single-chip compliance with ISO 26262 ASIL D for power rail integrity, eliminating need for discrete supervisors and reducing PCB area by >35 %.

Use Scenario: Power delivery and safety monitoring in steer-by-wire or brake-by-wire ECUs where functional redundancy is mandatory.

IC Role / Device Role / Timing Role: Fail-safe system basis chip managing synchronized startup/shutdown of dual-core MCUs and actuator drivers via XFAILB and RSTB signals.

Use Value: Provides hardware-level power sequencing coordination and latent fault detection on PGOOD/FS0B, meeting ASIL D diagnostic coverage targets without software overhead.

S32Z2 Companion ChipFS86 + S32Z2 Power Subsystem

Use Scenario: Dedicated power manager co-located with NXP S32Z2 real-time domain controller in zonal E/E architectures.

IC Role / Device Role / Timing Role: Supplies VDD_CORE (0.825 V), VDDIO (1.1 V), and auxiliary 3.3 V rails while monitoring all via AMUX and VMON_EXT inputs.

Use Value: Reduces external component count by integrating BUCK1/2, BUCK3, LDO1/2, and six-channel voltage monitoring into one 6 × 6 mm package.

Use Scenario: Second-stage regulation downstream of FS86 front-end supply in 21×21 mm EV reference designs.

IC Role / Device Role / Timing Role: Regulates FS86's 5 V output to precise processor rails and provides fail-safe signaling to upstream FS86 via XFAILB and FS0B.

Use Value: Enables modular power architecture with distributed safety logic - FS86 handles high-voltage conversion, MPF5030BMMA0ES handles low-voltage precision regulation and diagnostics.

Equivalent & Alternatives

The following parts are listed as comparable options for similar fail-safe PMIC applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
MPF5030BMBA0ESASIL B on SG2 (watchdog) instead of QM; same ASIL D on SG1 (UV/OV)Targeted at chassis systems requiring watchdog monitoring at ASIL B levelSelect when functional safety architecture mandates ASIL B for MCU watchdog supervision
MPF5030BMDA0ESASIL D on both SG1 (UV/OV) and SG2 (watchdog); identical power stages and pinoutRequired for end-to-end ASIL D decomposition across all safety goalsSelect when full ASIL D coverage is required for both power rail integrity and MCU supervision functions

Compared with MPF5030BMMA0ES, MPF5030BMBA0ES relaxes watchdog safety to ASIL B while retaining ASIL D rail monitoring, whereas MPF5030BMDA0ES extends ASIL D to both domains - offering full safety coverage at the cost of higher qualification effort and test overhead.

Availability

MPF5030BMMA0ES is available at Aetrix Electronics and suitable for EV propulsion domain controllers, chassis-integrated systems, and S32Z2/E2 companion power subsystems requiring stable component supply across automotive production lifecycles.

Supply support for MPF5030BMMA0ES includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor company specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with leadership in automotive microcontrollers and functional safety IP.

The PF5030 product line delivers fail-safe power management for next-generation automotive domain controllers, specifically engineered to meet ISO 26262 ASIL D requirements for S32Z2/E2 processor ecosystems.

FAQ

What is the maximum input voltage rating for MPF5030BMMA0ES?

The MPF5030BMMA0ES supports a maximum DC input voltage of 5.25 V on its VIN pin, with transient tolerance up to 6 V for durations under 2.2 µs. This allows direct interfacing with automotive front-end supplies like the FS86 family while maintaining robustness against load-dump transients commonly seen in 12 V battery systems.

Does MPF5030BMMA0ES support multiphase operation for BUCK1/2?

Yes, MPF5030BMMA0ES supports multiphase operation for BUCK1/2, enabling combined current capability up to 7.0 A DC. This is achieved through synchronized switching of BUCK1 and BUCK2 using shared control logic and phase interleaving, reducing input/output ripple and improving thermal distribution across the die.

How does MPF5030BMMA0ES implement ASIL D compliance?

MPF5030BMMA0ES achieves ASIL D compliance on safety goal 1 (SG1) for UV/OV monitoring across 0.8 V, 1.1 V, 1.8 V, and 3.3 V rails via independent analog monitoring circuitry, 1.0 % accuracy voltage inputs, and hardware-based fail-safe state machine. SG2 (watchdog) is configured at QM level per OTP code A0, confirmed in Table 2 of the PF5030_SDS.

What package type and thermal characteristics apply to MPF5030BMMA0ES?

MPF5030BMMA0ES uses the HVQFN40EP package: 6 mm × 6 mm, 0.5 mm pitch, wettable flanks, and exposed thermal pad. Its thermal resistance is RθJA = 30.1 °C/W (JEDEC JESD51-2 standard board), RθJCBOTTOM = 2.4 °C/W, and ΨJT = 0.3 °C/W - enabling efficient heat transfer to PCB copper when the EP is properly soldered to GND.

Can MPF5030BMMA0ES be reconfigured after power-up?

Yes, MPF5030BMMA0ES supports full runtime reconfiguration via its 32-bit I2C interface with 8-bit CRC protection. Parameters including output voltages, current limits, sequencing delays, and safety thresholds can be adjusted dynamically - allowing adaptive power management across different vehicle operating modes such as sleep, active, and fail-safe states.

MPF5030BMMA0ES Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Series:
-
Package/Case:
40-PowerVFQFN
Packaging:
Tray
Product Status:
Active
Applications:
System Basis Chip
Current - Supply:
-
Voltage - Supply:
3.3V ~ 5.25V
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount, Wettable Flank
Supplier Device Package:
40-HVQFN (6x6)

MPF5030BMMA0ES FAQ

1.How can I place an order for MPF5030BMMA0ES through Aetrix?

Please submit a Request for Quotation (RFQ) for MPF5030BMMA0ES on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MPF5030BMMA0ES reliable?

The price and inventory of MPF5030BMMA0ES are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MPF5030BMMA0ES is usually 5 days.

3.What payment methods are accepted for MPF5030BMMA0ES?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MPF5030BMMA0ES transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MPF5030BMMA0ES?

MPF5030BMMA0ES orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MPF5030BMMA0ES order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MPF5030BMMA0ES?

For technical support, including MPF5030BMMA0ES datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MPF5030BMMA0ES requirements.

6.How does Aetrix verify that MPF5030BMMA0ES is sourced from the original manufacturer or authorized distributors?

All MPF5030BMMA0ES products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MPF5030BMMA0ES meets industry standards.

7.What is the process for return or replacement of MPF5030BMMA0ES?

All MPF5030BMMA0ES units undergo pre-shipment inspection (PSI). If there is an issue with MPF5030BMMA0ES, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MPF5030BMMA0ES part is unused and in its original packaging.

Return procedure for MPF5030BMMA0ES:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

MPF5030BMMA0ES Tags

  • MPF5030BMMA0ES
  • MPF5030BMMA0ES PDF
  • MPF5030BMMA0ES Datasheet
  • MPF5030BMMA0ES Specifications
  • MPF5030BMMA0ES Images
  • NXP Semiconductors
  • NXP Semiconductors MPF5030BMMA0ES
  • Buy MPF5030BMMA0ES
  • MPF5030BMMA0ES Price
  • MPF5030BMMA0ES Distributor
  • MPF5030BMMA0ES Supplier
  • MPF5030BMMA0ES Wholesale
Related Products
TPS2511DGNR
TPS2511DGNR

Texas Instruments

UTC2000/MG
UTC2000/MG

Microchip Technology

TUSB320HAIRWBR
TUSB320HAIRWBR

Texas Instruments

TPS61252DSGR
TPS61252DSGR

Texas Instruments

PI5USB30216CXUAEX
PI5USB30216CXUAEX

Diodes Incorporated

SN6501DBVR
SN6501DBVR

Texas Instruments

CYPD3177-24LQXQT
CYPD3177-24LQXQT

Infineon Technologies

SN6501QDBVRQ1
SN6501QDBVRQ1

Texas Instruments

STUSB1600AQTR
STUSB1600AQTR

STMicroelectronics

SN6505BDBVR
SN6505BDBVR

Texas Instruments

SN6501DBVT
SN6501DBVT

Texas Instruments

TPS65150PWPR
TPS65150PWPR

Texas Instruments

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER