NXP Semiconductors MPF5030BMMA0ES
- Part No.:
- MPF5030BMMA0ES
- Manufacturer:
- NXP Semiconductors
- Category:
- Power Management - Specialized
- Package:
- 40-PowerVFQFN
- Datasheet:
-
MPF5030BMMA0ES.pdf
- Description:
- PMIC 3 BUCKS 2 LDO A1 DIE
- Quantity:
- Payment:

- Shipping:

Inventory:2,016
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Product details
Overview
MPF5030BMMA0ES from NXP Semiconductors is a fail-safe power management IC (PMIC) designed as a companion to S32Z2/E2 automotive processors. It integrates two configurable synchronous buck converters (BUCK1/2 up to 3.5 A each, multiphase capable to 7.0 A), one 2.5 A buck (BUCK3), and two 400 mA LDOs - all operating from a 3.3–5.25 V input. Its ASIL D–capable voltage supervision and I2C-configurable sequencing support EV propulsion domain controllers.
For engineers reviewing the MPF5030BMMA0ES datasheet, MPF5030BMMA0ES pinout, MPF5030BMMA0ES application, or MPF5030BMMA0ES equivalent, this page delivers verified functional safety parameters, OTP-programmable startup configuration, thermal resistance data (RθJA = 30.1 °C/W), and precise pin-level circuit roles for automotive drive train system design.
Technical Context
The MPF5030BMMA0ES implements dual-domain power management with independent main and fail-safe domains (GNDFS/GND), enabling ASIL D compliance on UV/OV monitoring across 0.8 V, 1.1 V, 1.8 V, and 3.3 V rails. Its integrated analog multiplexer supports full-system voltage and temperature monitoring via six inputs with ±1.0 % accuracy.
Startup is controlled by OTP memory storing output voltages and sequencing order, reducing external components; runtime reconfiguration uses a 32-bit I2C interface with 8-bit CRC. The device includes LBIST/ABIST, dedicated PGOOD/RSTB/FS0B safety outputs with latent fault detection, and 10 ms RSTB delay for MCU compliance.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Input Voltage Range | 3.3 V to 5.25 V DC - supports direct integration with FS86/FS6x front-end supplies in automotive drivetrain systems |
| BUCK1/2 Output | 0.7 V to 1.5 V, up to 3.5 A per phase - configurable for core rail of S32Z2/E2 processors; multiphase operation enables 7.0 A total |
| BUCK3 Output | 1.0 V to 4.1 V, up to 2.5 A - powers auxiliary subsystems including I/O or peripherals |
| LDO1/LDO2 Output | 1.1 V to 4.1 V, up to 400 mA each - supplies MCU I/O and system peripherals with low-noise regulation |
| Voltage Monitoring Accuracy | ±1.0 % target accuracy across up to 6 inputs - enables ASIL D–compliant UV/OV detection on critical power rails |
| Thermal Resistance | RθJA = 30.1 °C/W - validated on JEDEC-standard board; supports thermal design in compact 6 × 6 mm QFN packages |
| Functional Safety | ASIL D on SG1 (UV/OV), QM on SG2 (watchdog) - certified per ISO 26262 for safety goal decomposition in automotive applications |
Pinout & Package
MPF5030BMMA0ES uses an HVQFN40EP package: 6 mm × 6 mm × 0.85 mm body, 0.5 mm pitch, wettable flanks, and exposed thermal pad (EP) soldered to GND for optimal heat dissipation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| BUCK1_FB / BUCK2_FB / BUCK3_FB | Voltage feedback input | Closes regulation loop for respective buck converters; enables precise output voltage control |
| LDO1_OUT / LDO2_OUT | Regulated output | Delivers stable low-noise supply to MCU I/O and peripheral circuits |
| PGOOD / RSTB / FS0B | Safety status outputs | Open-drain active-low signals indicating power health, reset state, and fail-safe condition with latent fault detection |
| SCL / SDA | I2C interface | 32-bit command interface with 8-bit CRC for runtime configuration and telemetry readback |
| XFAILB | Power-up synchronization | Enables coordinated sequencing with external PMICs or safety controllers in multi-rail systems |
Key Features
| Feature | Design Value |
|---|---|
| OTP-based startup configuration | Eliminates external resistor networks for voltage setpoints and sequencing order, reducing BOM count and layout complexity |
| Dual-domain ground separation | GNDFS and GND pins isolate fail-safe logic from main domain, supporting ASIL D fault containment requirements |
| Integrated analog multiplexer | Routes up to six voltage/temperature sensor inputs to internal ADC, enabling consolidated system health monitoring |
| EMI-optimized switching regulators | Spread spectrum and manual frequency tuning reduce conducted emissions to meet IEC 61967-4 automotive standards |
| Fail-safe state machine | Hardware-enforced response to detected faults, independent of software execution, ensuring deterministic behavior during safety events |
Applications
| EV Propulsion Domain Controller | Chassis-Integrated System |
|---|---|
Use Scenario: Centralized power management for traction inverter control units requiring redundant rail monitoring and fail-safe shutdown. IC Role / Device Role / Timing Role: Primary PMIC providing core (0.825 V), I/O (1.1 V), and analog (3.3 V) rails to S32Z2 processor with ASIL D–compliant UV/OV supervision. Use Value: Enables single-chip compliance with ISO 26262 ASIL D for power rail integrity, eliminating need for discrete supervisors and reducing PCB area by >35 %. | Use Scenario: Power delivery and safety monitoring in steer-by-wire or brake-by-wire ECUs where functional redundancy is mandatory. IC Role / Device Role / Timing Role: Fail-safe system basis chip managing synchronized startup/shutdown of dual-core MCUs and actuator drivers via XFAILB and RSTB signals. Use Value: Provides hardware-level power sequencing coordination and latent fault detection on PGOOD/FS0B, meeting ASIL D diagnostic coverage targets without software overhead. |
| S32Z2 Companion Chip | FS86 + S32Z2 Power Subsystem |
Use Scenario: Dedicated power manager co-located with NXP S32Z2 real-time domain controller in zonal E/E architectures. IC Role / Device Role / Timing Role: Supplies VDD_CORE (0.825 V), VDDIO (1.1 V), and auxiliary 3.3 V rails while monitoring all via AMUX and VMON_EXT inputs. Use Value: Reduces external component count by integrating BUCK1/2, BUCK3, LDO1/2, and six-channel voltage monitoring into one 6 × 6 mm package. | Use Scenario: Second-stage regulation downstream of FS86 front-end supply in 21×21 mm EV reference designs. IC Role / Device Role / Timing Role: Regulates FS86's 5 V output to precise processor rails and provides fail-safe signaling to upstream FS86 via XFAILB and FS0B. Use Value: Enables modular power architecture with distributed safety logic - FS86 handles high-voltage conversion, MPF5030BMMA0ES handles low-voltage precision regulation and diagnostics. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar fail-safe PMIC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MPF5030BMBA0ES | ASIL B on SG2 (watchdog) instead of QM; same ASIL D on SG1 (UV/OV) | Targeted at chassis systems requiring watchdog monitoring at ASIL B level | Select when functional safety architecture mandates ASIL B for MCU watchdog supervision |
| MPF5030BMDA0ES | ASIL D on both SG1 (UV/OV) and SG2 (watchdog); identical power stages and pinout | Required for end-to-end ASIL D decomposition across all safety goals | Select when full ASIL D coverage is required for both power rail integrity and MCU supervision functions |
Compared with MPF5030BMMA0ES, MPF5030BMBA0ES relaxes watchdog safety to ASIL B while retaining ASIL D rail monitoring, whereas MPF5030BMDA0ES extends ASIL D to both domains - offering full safety coverage at the cost of higher qualification effort and test overhead.
Availability
MPF5030BMMA0ES is available at Aetrix Electronics and suitable for EV propulsion domain controllers, chassis-integrated systems, and S32Z2/E2 companion power subsystems requiring stable component supply across automotive production lifecycles.
Supply support for MPF5030BMMA0ES includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with leadership in automotive microcontrollers and functional safety IP.
The PF5030 product line delivers fail-safe power management for next-generation automotive domain controllers, specifically engineered to meet ISO 26262 ASIL D requirements for S32Z2/E2 processor ecosystems.
FAQ
What is the maximum input voltage rating for MPF5030BMMA0ES?
The MPF5030BMMA0ES supports a maximum DC input voltage of 5.25 V on its VIN pin, with transient tolerance up to 6 V for durations under 2.2 µs. This allows direct interfacing with automotive front-end supplies like the FS86 family while maintaining robustness against load-dump transients commonly seen in 12 V battery systems.
Does MPF5030BMMA0ES support multiphase operation for BUCK1/2?
Yes, MPF5030BMMA0ES supports multiphase operation for BUCK1/2, enabling combined current capability up to 7.0 A DC. This is achieved through synchronized switching of BUCK1 and BUCK2 using shared control logic and phase interleaving, reducing input/output ripple and improving thermal distribution across the die.
How does MPF5030BMMA0ES implement ASIL D compliance?
MPF5030BMMA0ES achieves ASIL D compliance on safety goal 1 (SG1) for UV/OV monitoring across 0.8 V, 1.1 V, 1.8 V, and 3.3 V rails via independent analog monitoring circuitry, 1.0 % accuracy voltage inputs, and hardware-based fail-safe state machine. SG2 (watchdog) is configured at QM level per OTP code A0, confirmed in Table 2 of the PF5030_SDS.
What package type and thermal characteristics apply to MPF5030BMMA0ES?
MPF5030BMMA0ES uses the HVQFN40EP package: 6 mm × 6 mm, 0.5 mm pitch, wettable flanks, and exposed thermal pad. Its thermal resistance is RθJA = 30.1 °C/W (JEDEC JESD51-2 standard board), RθJCBOTTOM = 2.4 °C/W, and ΨJT = 0.3 °C/W - enabling efficient heat transfer to PCB copper when the EP is properly soldered to GND.
Can MPF5030BMMA0ES be reconfigured after power-up?
Yes, MPF5030BMMA0ES supports full runtime reconfiguration via its 32-bit I2C interface with 8-bit CRC protection. Parameters including output voltages, current limits, sequencing delays, and safety thresholds can be adjusted dynamically - allowing adaptive power management across different vehicle operating modes such as sleep, active, and fail-safe states.
MPF5030BMMA0ES Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 40-PowerVFQFN
- Packaging:
- Tray
- Product Status:
- Active
- Applications:
- System Basis Chip
- Current - Supply:
- -
- Voltage - Supply:
- 3.3V ~ 5.25V
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount, Wettable Flank
- Supplier Device Package:
- 40-HVQFN (6x6)
MPF5030BMMA0ES FAQ
1.How can I place an order for MPF5030BMMA0ES through Aetrix?
Please submit a Request for Quotation (RFQ) for MPF5030BMMA0ES on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MPF5030BMMA0ES reliable?
The price and inventory of MPF5030BMMA0ES are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MPF5030BMMA0ES is usually 5 days.
3.What payment methods are accepted for MPF5030BMMA0ES?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MPF5030BMMA0ES transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MPF5030BMMA0ES?
MPF5030BMMA0ES orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MPF5030BMMA0ES order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MPF5030BMMA0ES?
For technical support, including MPF5030BMMA0ES datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MPF5030BMMA0ES requirements.
6.How does Aetrix verify that MPF5030BMMA0ES is sourced from the original manufacturer or authorized distributors?
All MPF5030BMMA0ES products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MPF5030BMMA0ES meets industry standards.
7.What is the process for return or replacement of MPF5030BMMA0ES?
All MPF5030BMMA0ES units undergo pre-shipment inspection (PSI). If there is an issue with MPF5030BMMA0ES, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MPF5030BMMA0ES part is unused and in its original packaging.
Return procedure for MPF5030BMMA0ES:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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