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NXP Semiconductors MPF5030BMMA4ES
- Part No.:
- MPF5030BMMA4ES
- Manufacturer:
- NXP Semiconductors
- Category:
- Power Management - Specialized
- Package:
- 40-PowerVFQFN
- Datasheet:
-
MPF5030BMMA4ES.pdf
- Description:
- PMIC 3 BUCKS 2 LDO A1 DIE
- Quantity:
- Payment:
- Shipping:
Inventory:395
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Product details
Overview
MPF5030BMMA4ES from NXP Semiconductors is a fail-safe power management IC (PMIC) designed as a companion to S32Z2/E2 automotive processors. It integrates two configurable synchronous buck converters (BUCK1/2 up to 3.5 A each, multiphase capable to 7.0 A), one additional buck (BUCK3 up to 2.5 A), and two LDOs (up to 400 mA each), all operating from a 3.3–5.25 V input. It delivers ASIL D functional safety for voltage rails and supports EV propulsion domain controllers.
For engineers reviewing the MPF5030BMMA4ES datasheet, MPF5030BMMA4ES pinout, MPF5030BMMA4ES application, or MPF5030BMMA4ES equivalent, key selection considerations include its OTP-programmable startup configuration, I²C-adjustable regulator outputs, integrated analog multiplexer for system monitoring, XFAILB-based power sequencing, and compliance with automotive EMI standards IEC 61967-4 and IEC 62132-4.
Technical Context
The MPF5030BMMA4ES implements a dual-domain power architecture with separate main and fail-safe domains, each with dedicated ground (GND/GNDFS), reset (RSTB), and safety outputs (PGOOD, FS0B). Its fail-safe state machine enforces ASIL D monitoring of UV/OV on 0.8 V, 1.1 V, 1.8 V, and 3.3 V rails using six voltage monitor inputs with ±1.0 % accuracy and independent analog/digital BIST (ABIST/LBIST).
Regulator control uses a 32-bit I²C interface with 8-bit CRC, supporting post-startup reconfiguration of output voltages, sequencing delays (e.g., 10 ms RSTB release), and watchdog parameters. Spread spectrum and manual frequency tuning are embedded in switching regulators to meet automotive conducted emission requirements.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Input Voltage Range | 3.3 V to 5.25 V DC - supports direct integration with NXP FS86/FS6x front-end supplies in automotive drive train systems. |
| BUCK1/2 Output | 0.7 V to 1.5 V, up to 3.5 A per phase - enables core voltage regulation for S32Z2/E2 processors; multiphase operation scales to 7.0 A for high-current loads. |
| BUCK3 Output | 1.0 V to 4.1 V, up to 2.5 A - provides flexible intermediate rail generation for peripherals or I/O domains. |
| LDO1/LDO2 Output | 1.1 V to 4.1 V, up to 400 mA each - supplies MCU I/O and system peripherals with low-noise, adjustable bias. |
| Voltage Monitoring | 6 inputs, ±1.0 % accuracy - ensures precise supervision of critical power rails for ASIL D compliance on UV/OV faults. |
| Functional Safety | ASIL D on SG1 (UV/OV), ASIL QM on SG2 (watchdog) - certified per ISO 26262 for use in safety-critical automotive applications including EV propulsion. |
| Package | HVQFN40eP, 6 × 6 × 0.85 mm, 0.5 mm pitch, wettable flanks - optimized thermal performance with RθJA = 30.1 °C/W and exposed pad for PCB heat sinking. |
Pinout & Package
HVQFN40eP package with exposed thermal pad (EP), 6 mm × 6 mm footprint, 0.5 mm pitch, and wettable flank solder joints for automated optical inspection (AOI) and enhanced thermal conduction to PCB ground plane.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| BUCK1_FB / BUCK2_FB / BUCK3_FB | Voltage feedback inputs | Enable closed-loop regulation of respective buck outputs; support external resistor divider configuration for precise output voltage setting. |
| LDO1_OUT / LDO2_OUT | Analog power outputs | Deliver regulated low-noise bias to MCU I/O banks and peripheral subsystems; each rated for up to 400 mA continuous load. |
| PWRON / XFAILB / RSTB / FS0B / PGOOD / INTB | Digital control & status signals | Support power-up sequencing (XFAILB), reset assertion (RSTB), fail-safe signaling (FS0B), power-good indication (PGOOD), and interrupt notification (INTB) with open-drain logic. |
| SCL / SDA | I²C interface | Provide 32-bit command/data transfer with 8-bit CRC for runtime configuration of regulators, monitors, and safety features. |
| VMON_EXT / AMUX / LDO1_MON / LDO2_MON | Analog monitoring inputs | Feed system-level voltage and temperature data into internal ADC and analog multiplexer for real-time health assessment and fault logging. |
Key Features
| Feature | Design Value |
|---|---|
| OTP memory storage | Stores boot-time configurations (voltage setpoints, sequencing order, safety thresholds), eliminating need for external resistors or configuration EEPROM in production designs. |
| Multiphase BUCK1/2 operation | Enables 7.0 A total current delivery from two parallel 3.5 A buck stages, reducing per-phase current stress and improving thermal distribution across the die and PCB. |
| Fail-safe domain isolation | Dedicated GNDFS, RSTB, and FS0B pins ensure independent monitoring and response in safety-critical failure modes, meeting ASIL D decomposition requirements. |
| EMC-optimized switching | Integrated spread spectrum modulation and manual frequency tuning reduce peak conducted emissions, easing compliance with IEC 61967-4 during vehicle-level EMC testing. |
| Thermal-enhanced HVQFN | Wettable flank package with exposed pad achieves RθJCBOTTOM = 2.4 °C/W, enabling reliable operation at TJ ≤ 150 °C in under-hood automotive environments. |
Applications
| EV Propulsion Domain Controller | Chassis-Integrated System |
|---|---|
Use Scenario: Centralized power management for traction inverter gate drivers, motor position sensors, and real-time safety co-processors in battery electric vehicles. IC Role / Device Role / Timing Role: Primary PMIC supplying core (0.825 V), I/O (1.1 V), and analog (3.3 V) rails to S32Z2 processor while enforcing ASIL D voltage supervision and fail-safe shutdown. Use Value: Reduces bill-of-materials by integrating five regulators and six voltage monitors into single QFN40 package, eliminating discrete supervisor ICs and external sequencing logic. | Use Scenario: Powering steer-by-wire ECUs where mechanical redundancy requires independent power domains with deterministic fault response. IC Role / Device Role / Timing Role: Dual-domain regulator delivering isolated main and fail-safe supplies (via GND/GNDFS separation) with synchronized power-up via XFAILB and independent PGOOD assertion. Use Value: Enables hardware-level domain isolation required for ASIL D decomposition without external isolators or redundant PMICs. |
| S32Z2/E2 Companion Chip | Automotive Functional Safety Subsystem |
Use Scenario: Reference design integration on Greenbox III and S32Z2 DC2 EVB evaluation platforms for rapid validation of processor power architecture. IC Role / Device Role / Timing Role: Pre-validated, OTP-configured companion PMIC providing known-good startup sequence, voltage setpoints, and I²C register map aligned to S32Z2/E2 datasheet timing requirements. Use Value: Accelerates bring-up by eliminating custom OTP programming and regulator loop compensation tuning during early development phases. | Use Scenario: Supervising critical voltage rails in ADAS domain controllers where latent fault detection must meet ISO 26262 FMEDA targets. IC Role / Device Role / Timing Role: Safety controller executing LBIST/ABIST, monitoring six rail voltages with 1.0 % accuracy, and asserting FS0B/PGOOD within defined fault latency windows. Use Value: Provides built-in diagnostic coverage for voltage monitoring path per ASIL D requirements, reducing software diagnostic burden and validation effort. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar PMIC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MPF5030BMMA0ES | Same silicon revision (A0), identical OTP code A0, but unprogrammed - requires field programming before first use. | Used in prototype builds where OTP customization is deferred; lacks preconfigured startup settings for S32Z2/E2. | Select when flexibility to define custom voltage sequences or safety thresholds is required during development. |
| MPF5032BMMA4ES | Same package and pinout, but disables BUCK3 and watchdog functionality; retains ASIL D on SG1 only. | Targeted at cost-sensitive chassis modules where BUCK3 and full watchdog are unnecessary. | Choose when BUCK3 is unused and simplified safety scope (SG1-only ASIL D) satisfies system requirements. |
Compared with MPF5030BMMA4ES, MPF5030BMMA0ES offers identical hardware capability but requires post-silicon OTP programming, while MPF5032BMMA4ES reduces feature count (no BUCK3, no watchdog) to lower cost and complexity - both retain the same HVQFN40eP package and ASIL D voltage supervision on core rails.
Availability
MPF5030BMMA4ES is available at Aetrix Electronics and suitable for EV propulsion domain controllers, chassis-integrated systems, and S32Z2/E2 companion applications requiring stable component supply across automotive production lifecycles.
Supply support for MPF5030BMMA4ES includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and IoT markets.
The PF5030 product line delivers fail-safe, ASIL-certified power management ICs optimized for next-generation automotive processors like S32Z2/E2, with emphasis on integrated safety monitoring, multiphase regulation, and EMC robustness in harsh drive train environments.
FAQ
What is the primary function of MPF5030BMMA4ES in an automotive system?
The MPF5030BMMA4ES serves as a fail-safe system basis chip that integrates multiple SMPSs and LDOs to power and supervise NXP S32Z2/E2 processors in automotive applications. Its core function is to deliver tightly regulated voltage rails (including 0.825 V core, 1.1 V I/O, and 3.3 V analog), enforce ASIL D-compliant voltage monitoring, and manage power-up sequencing via XFAILB - all within a single HVQFN40eP package. MPF5030BMMA4ES replaces discrete power and safety components in EV propulsion and chassis systems.
Does MPF5030BMMA4ES support multiphase operation for higher current delivery?
Yes, MPF5030BMMA4ES supports multiphase operation for its BUCK1 and BUCK2 regulators, enabling combined DC output current up to 7.0 A. This is achieved by synchronizing the two 3.5 A buck stages through shared control logic and feedback paths, reducing ripple current and thermal stress compared to single-phase operation. The MPF5030BMMA4ES datasheet confirms this capability explicitly for BUCK1/2, making it suitable for high-current core rail applications in S32Z2/E2-based domain controllers.
How does MPF5030BMMA4ES achieve ASIL D compliance for voltage monitoring?
MPF5030BMMA4ES achieves ASIL D compliance for voltage monitoring (Safety Goal 1) through independent analog circuitry with six dedicated monitor inputs, ±1.0 % target accuracy across temperature, and redundant fault detection paths. It includes built-in self-test (ABIST/LBIST), latent fault detection on safety outputs (PGOOD, RSTB, FS0B), and separate fail-safe domain grounding (GNDFS) to prevent common-cause failures. These features are validated per ISO 26262 and documented in the PF5030_SDS for MPF5030BMMA4ES.
What package type and thermal characteristics apply to MPF5030BMMA4ES?
MPF5030BMMA4ES uses the HVQFN40eP package: 6 mm × 6 mm, 0.5 mm pitch, with wettable flanks and an exposed thermal pad. Its thermal resistance is RθJA = 30.1 °C/W (JEDEC JESD51-2), RθJCBOTTOM = 2.4 °C/W, and maximum junction temperature is 150 °C. The exposed pad must be soldered to PCB ground for optimal heat dissipation - a requirement confirmed in the PF5030_SDS package outline and thermal characterization tables for MPF5030BMMA4ES.
Can MPF5030BMMA4ES be configured after power-up, and how?
Yes, MPF5030BMMA4ES supports post-startup configuration via its 32-bit I²C interface with 8-bit CRC protection. Engineers can dynamically adjust output voltages, sequencing delays (e.g., 10 ms RSTB release), watchdog timeout values, and safety thresholds without resetting the device. This I²C programmability complements the One-Time Programmable (OTP) memory used for boot-time settings, giving MPF5030BMMA4ES flexibility across system states - a capability explicitly detailed in the PF5030_SDS Features section for MPF5030BMMA4ES.
MPF5030BMMA4ES Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 40-PowerVFQFN
- Packaging:
- Tray
- Product Status:
- Active
- Applications:
- System Basis Chip
- Current - Supply:
- -
- Voltage - Supply:
- 3.3V ~ 5.25V
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount, Wettable Flank
- Supplier Device Package:
- 40-HVQFN (6x6)
MPF5030BMMA4ES FAQ
1.How can I place an order for MPF5030BMMA4ES through Aetrix?
Please submit a Request for Quotation (RFQ) for MPF5030BMMA4ES on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MPF5030BMMA4ES reliable?
The price and inventory of MPF5030BMMA4ES are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MPF5030BMMA4ES is usually 5 days.
3.What payment methods are accepted for MPF5030BMMA4ES?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MPF5030BMMA4ES transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MPF5030BMMA4ES?
MPF5030BMMA4ES orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MPF5030BMMA4ES order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MPF5030BMMA4ES?
For technical support, including MPF5030BMMA4ES datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MPF5030BMMA4ES requirements.
6.How does Aetrix verify that MPF5030BMMA4ES is sourced from the original manufacturer or authorized distributors?
All MPF5030BMMA4ES products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MPF5030BMMA4ES meets industry standards.
7.What is the process for return or replacement of MPF5030BMMA4ES?
All MPF5030BMMA4ES units undergo pre-shipment inspection (PSI). If there is an issue with MPF5030BMMA4ES, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MPF5030BMMA4ES part is unused and in its original packaging.
Return procedure for MPF5030BMMA4ES:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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