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NXP Semiconductors MPF5030BMMA4ESR2
- Part No.:
- MPF5030BMMA4ESR2
- Manufacturer:
- NXP Semiconductors
- Category:
- Power Management - Specialized
- Package:
- 40-PowerVFQFN
- Datasheet:
-
MPF5030BMMA4ESR2.pdf
- Description:
- PMIC 3 BUCKS 2 LDO A1 DIE
- Quantity:
- Payment:
- Shipping:
Inventory:3,749
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Product details
Overview
MPF5030BMMA4ESR2 from NXP Semiconductors is a fail-safe power management IC (PMIC) designed as a companion to S32Z2/E2 automotive processors. It integrates two multiphase synchronous buck converters (BUCK1/2 up to 7.0 A), one single-phase buck (BUCK3 up to 2.5 A), and two configurable LDOs (up to 400 mA each), all operating from a 3.3–5.25 V input. It delivers ASIL D functional safety for voltage rails and supports I²C-based dynamic configuration in EV propulsion domain controllers.
For engineers reviewing the MPF5030BMMA4ESR2 datasheet, MPF5030BMMA4ESR2 pinout, MPF5030BMMA4ESR2 application, or MPF5030BMMA4ESR2 equivalent, key selection criteria include its OTP-programmed ASIL D capability on SG1 (UV/OV monitoring), QM-level watchdog (SG2), 40-pin HVQFN40eP wettable flank package, and integrated analog multiplexer for system-wide voltage/temperature monitoring.
Technical Context
The MPF5030BMMA4ESR2 implements a dual-domain power architecture with independent main and fail-safe domains, including dedicated GNDFS and GND pins, separate RSTB/FS0B safety outputs, and XFAILB synchronization for multi-PMIC coordination. Its OTP memory stores boot-time configurations for output voltages and sequencing, reducing external component count.
It features a 32-bit I²C interface with 8-bit CRC for robust register access, programmable BUCK1/2 phase operation (single/dual), and configurable LDO1/LDO2 output voltages (1.1–4.1 V). Voltage supervision includes six inputs with ±1.0% accuracy and built-in LBIST/ABIST for functional safety compliance per ISO 26262.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Input Voltage Range | 3.3 V to 5.25 V DC - supports direct integration with FS86/FS6x front-end supplies in automotive drivetrain systems |
| BUCK1/2 Output | 0.7–1.5 V, up to 3.5 A per phase; multiphase capable to 7.0 A - powers S32Z2/E2 core rail (VDD_CORE = 0.825 V) with tight regulation |
| BUCK3 Output | 1.0–4.1 V, up to 2.5 A - supplies I/O or peripheral rails such as 1.8 V or 3.3 V domains |
| LDO1/LDO2 Output | 1.1–4.1 V, up to 400 mA each - provides low-noise bias for MCU I/O and system peripherals |
| Safety Certification | ASIL D on SG1 (UV/OV for 0.8 V/1.1 V/1.8 V/3.3 V rails); QM on SG2 (watchdog) - enables use in ASIL D decomposition without additional hardware redundancy |
| Thermal Resistance | RθJA = 30.1 °C/W - enables stable operation at TJ ≤ 150 °C in compact automotive ECUs with standard PCB copper |
| Package | HVQFN40eP, 6 × 6 × 0.85 mm, 0.5 mm pitch, exposed pad - optimized for thermal dissipation and automated optical inspection via wettable flanks |
Pinout & Package
HVQFN40eP package with 40-pin layout, 6 mm × 6 mm footprint, 0.5 mm pitch, and thermally enhanced exposed pad soldered to ground plane for optimal heat transfer in automotive under-hood environments.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| BUCK1_FB / BUCK2_FB / BUCK3_FB | Voltage feedback inputs | Enable precise closed-loop regulation of each buck output; require external resistor dividers for target voltage setting |
| BUCK1_SW1/2 / BUCK2_SW1/2 / BUCK3_SW | Switching node outputs | Connect directly to external high-frequency power inductors; layout critical for EMI control and efficiency |
| LDO1_OUT / LDO2_OUT | Regulated output terminals | Deliver low-noise, current-limited bias for sensitive digital I/O and analog subsystems |
| PGOOD / RSTB / FS0B | Safety-critical open-drain outputs | Signal power-good status, reset assertion, and fail-safe state to host processor or external safety circuitry |
| SCL / SDA | I²C interface signals | Support 32-bit address space and 8-bit CRC for secure, error-checked configuration and telemetry readback |
| XFAILB | Power-up/down synchronization input/output | Coordinates sequencing across multiple PMICs in distributed power architectures without external logic |
Key Features
| Feature | Design Value |
|---|---|
| OTP-based startup configuration | Eliminates external resistors and EEPROM, reducing BOM count and enabling field-agnostic boot behavior |
| Multiphase BUCK1/2 operation | Enables 7.0 A total current delivery with interleaved switching to lower input/output ripple and thermal stress |
| Integrated analog multiplexer (AMUX) | Allows single ADC channel to monitor up to six system voltages and die temperature, minimizing MCU resource usage |
| ASIL D voltage monitoring | Provides independent, redundant UV/OV detection on all critical S32Z2/E2 rails with 1.0 % accuracy and latent fault coverage |
| EMI-optimized switching | Includes spread-spectrum modulation and manual frequency tuning to meet CISPR 25 Class 5 conducted emission limits |
Applications
| EV Propulsion Domain Controller | Chassis-Integrated System |
|---|---|
Use Scenario: Centralized power management for S32Z2-based traction inverter control units in battery electric vehicles. IC Role / Device Role / Timing Role: Primary PMIC supplying VDD_CORE (0.825 V), VDDIO (1.1 V/1.8 V), and auxiliary 3.3 V rails while enforcing ASIL D voltage supervision. Use Value: Reduces external component count by 30% vs discrete regulator solutions and enables deterministic power-up sequencing compliant with ISO 26262 timing requirements. | Use Scenario: Power delivery and safety monitoring in steer-by-wire or brake-by-wire ECUs with dual-redundant microcontrollers. IC Role / Device Role / Timing Role: Fail-safe system basis chip managing main and safety domain supplies, with independent PGOOD/RSTB/FS0B outputs tied to watchdog and lockstep cores. Use Value: Delivers certified ASIL D voltage monitoring and synchronized reset release (10 ms delay) to meet ASIL D decomposition targets without external safety monitors. |
| S32Z2 Companion Chip | FS86 + S32Z2 Power Subsystem |
Use Scenario: Reference design implementation on Greenbox III evaluation board for S32Z2 DC2 EVB development. IC Role / Device Role / Timing Role: Dedicated companion PMIC handling all non-core power domains (I/O, analog, peripherals) while offloading sequencing and monitoring from the S32Z2 SoC. Use Value: Enables full utilization of S32Z2's low-power states via I²C-controlled LDO/buck enable/disable and sleep current of 15 µA. | Use Scenario: Integrated front-end + core PMIC stack in 21×21 mm automotive module using FS86 pre-regulator and MPF5030BMMA4ESR2 for final regulation. IC Role / Device Role / Timing Role: Secondary PMIC receiving regulated 5 V from FS86, generating sub-1.5 V core and 1.8/3.3 V I/O rails with coordinated XFAILB handshake. Use Value: Achieves <15 mVpp output ripple and <10 µs fault response time across all rails, meeting stringent EMC and functional safety timing constraints. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar power management applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MPF5030BMMA0ES | Same silicon revision (A0), identical ASIL D/SG1 and QM/SG2 configuration, but unprogrammed OTP - requires external configuration at boot | Used in prototype or flexible evaluation contexts where runtime I²C tuning is preferred over fixed OTP settings | Select when design requires post-manufacturing customization of voltage setpoints or sequencing order |
| MPF5030BMDA0ES | Same package and pinout, but ASIL D on both SG1 and SG2 - includes fully enabled watchdog with ASIL D diagnostic coverage | Targeted at highest-integrity applications like autonomous driving controllers requiring dual ASIL D safety goals | Select only if watchdog monitoring must meet ASIL D, not QM; adds diagnostic overhead and reduces configurability |
Compared with MPF5030BMMA4ESR2, MPF5030BMMA0ES offers field-programmable flexibility at the cost of boot-time dependency on I²C initialization, while MPF5030BMDA0ES trades reduced configurability for full ASIL D coverage on both voltage and watchdog functions - making MPF5030BMMA4ESR2 optimal for production S32Z2/E2 systems balancing safety, performance, and design reuse.
Availability
MPF5030BMMA4ESR2 is available at Aetrix Electronics and suitable for EV propulsion domain controllers, chassis-integrated systems, and S32Z2/E2 companion power subsystems requiring stable component supply across automotive production lifecycles.
Supply support for MPF5030BMMA4ESR2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with leadership in functional safety and automotive-grade process technologies.
The PF5030 product line is engineered as a fail-safe system basis chip family for next-generation automotive domain controllers, specifically targeting S32Z2/E2 processor ecosystems with integrated SMPS, LDOs, and ISO 26262-compliant safety mechanisms.
FAQ
What is the functional safety classification of MPF5030BMMA4ESR2?
MPF5030BMMA4ESR2 is certified ASIL D on safety goal 1 (SG1/CSG_01) for undervoltage/overvoltage monitoring across all S32Z2/E2 power rails (0.8 V, 1.1 V, 1.8 V, 3.3 V), and ASIL QM on safety goal 2 (SG2/CSG_02) for watchdog functionality. This configuration is fixed per its OTP code 'M' and matches the MPF5030BMMA4ESR2 part number specification in Table 2 of the PF5030_SDS Rev. 2.
Does MPF5030BMMA4ESR2 support multiphase operation for BUCK1/2?
Yes, MPF5030BMMA4ESR2 supports multiphase operation for BUCK1/2, enabling combined DC output current up to 7.0 A through interleaved switching. This capability is inherent to the PF5030 silicon and is active in MPF5030BMMA4ESR2 regardless of OTP configuration, as confirmed in Section 2 Features and benefits of the PF5030_SDS.
What package type and thermal characteristics apply to MPF5030BMMA4ESR2?
MPF5030BMMA4ESR2 uses the HVQFN40eP package: 6 mm × 6 mm, 0.5 mm pitch, wettable flanks, with an exposed thermal pad. Its thermal resistance is RθJA = 30.1 °C/W (JEDEC JESD51-2), and it operates across −40 °C to 125 °C ambient, supporting junction temperatures up to 150 °C - consistent with Grade 1 automotive qualification per Table 5 in the PF5030_SDS.
Can MPF5030BMMA4ESR2 be used with NXP FS86 front-end supplies?
Yes, MPF5030BMMA4ESR2 is explicitly designed to work with NXP FS86 and FS6x front system supply families, as stated in Section 1 General description. Its 5.25 V maximum input rating and 3.3–5.25 V operating range align with FS86's regulated 5 V output, and Table 2 confirms its use in "FS86 + S32Z2 (21x21 mm)" reference designs.
What is the role of the XFAILB pin on MPF5030BMMA4ESR2?
The XFAILB pin on MPF5030BMMA4ESR2 serves as a bidirectional power-up/down synchronization interface for leader/follower PMIC coordination. As described in Section 2 Features and benefits, it enables enhanced sequencing management across multiple MPF5030BMMA4ESR2 devices or mixed-PMIC systems without external glue logic, ensuring deterministic timing alignment during system boot and shutdown events.
MPF5030BMMA4ESR2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 40-PowerVFQFN
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Applications:
- System Basis Chip
- Current - Supply:
- -
- Voltage - Supply:
- 3.3V ~ 5.25V
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount, Wettable Flank
- Supplier Device Package:
- 40-HVQFN (6x6)
MPF5030BMMA4ESR2 FAQ
1.How can I place an order for MPF5030BMMA4ESR2 through Aetrix?
Please submit a Request for Quotation (RFQ) for MPF5030BMMA4ESR2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MPF5030BMMA4ESR2 reliable?
The price and inventory of MPF5030BMMA4ESR2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MPF5030BMMA4ESR2 is usually 5 days.
3.What payment methods are accepted for MPF5030BMMA4ESR2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MPF5030BMMA4ESR2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MPF5030BMMA4ESR2?
MPF5030BMMA4ESR2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MPF5030BMMA4ESR2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MPF5030BMMA4ESR2?
For technical support, including MPF5030BMMA4ESR2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MPF5030BMMA4ESR2 requirements.
6.How does Aetrix verify that MPF5030BMMA4ESR2 is sourced from the original manufacturer or authorized distributors?
All MPF5030BMMA4ESR2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MPF5030BMMA4ESR2 meets industry standards.
7.What is the process for return or replacement of MPF5030BMMA4ESR2?
All MPF5030BMMA4ESR2 units undergo pre-shipment inspection (PSI). If there is an issue with MPF5030BMMA4ESR2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MPF5030BMMA4ESR2 part is unused and in its original packaging.
Return procedure for MPF5030BMMA4ESR2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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