NXP Semiconductors MPF5032BMMA5ES
- Part No.:
- MPF5032BMMA5ES
- Manufacturer:
- NXP Semiconductors
- Category:
- Power Management - Specialized
- Package:
- 40-PowerVFQFN
- Datasheet:
-
MPF5032BMMA5ES.pdf
- Description:
- PMIC 2 BUCKS 2 LDO A1 DIE
- Quantity:
- Payment:

- Shipping:

Inventory:490
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
MPF5032BMMA5ES from NXP Semiconductors is a fail-safe system basis chip (SBC) and power management IC designed specifically for S32Z2 automotive domain controllers. It integrates two configurable synchronous buck converters (BUCK1/2 up to 3.5 A each, supportable in dual-phase mode for 7.0 A), one 2.5 A buck (BUCK3), and two 400 mA LDOs - all operating from a 3.3–5.25 V input. It delivers ASIL D functional safety compliance on voltage monitoring for core rails (0.8 V, 1.1 V, 1.8 V, 3.3 V) and supports I²C-based runtime configuration in EV propulsion systems.
For engineers reviewing the MPF5032BMMA5ES datasheet, MPF5032BMMA5ES pinout, MPF5032BMMA5ES application, or MPF5032BMMA5ES equivalent, key selection considerations include its QFN-40 wettable flank package with exposed thermal pad, OTP-programmed startup sequencing for S32Z2 DC1 EVB compatibility, ASIL D–QM configurable watchdog, and integrated analog multiplexer for system-level voltage/temperature monitoring.
Technical Context
The MPF5032BMMA5ES implements a dual-domain power architecture: MAIN domain supplies S32Z2 core and I/O via BUCK1/2 and LDO1/2, while FS (fail-safe) domain manages safety-critical outputs (PGOOD, RSTB, FS0B) and independent voltage supervision. Its OTP memory stores boot-time configurations for output voltages, sequencing order, and safety thresholds - eliminating external resistor networks.
It features a dedicated 32-bit I²C interface with 8-bit CRC for post-startup parameter tuning, including BUCK output voltage (0.7–1.5 V for BUCK1/2; 1.0–4.1 V for BUCK3), LDO output (1.1–4.1 V), and safety monitoring thresholds. The XFAILB pin enables synchronized power-up/down with companion front-end supplies like FS86.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Input Voltage Range | 3.3 V to 5.25 V DC - supports direct connection to automotive front-end supplies (e.g., FS86) without intermediate regulation. |
| BUCK1/2 Output | 0.7 V to 1.5 V, up to 3.5 A per channel - configurable for S32Z2 core rail (0.825 V) with dual-phase capability enabling 7.0 A total for high-current applications. |
| BUCK3 Output | 1.0 V to 4.1 V, up to 2.5 A - powers auxiliary subsystems such as communication interfaces or sensors in chassis-integrated systems. |
| LDO1/LDO2 Output | 1.1 V to 4.1 V, up to 400 mA each - supplies MCU I/O banks and peripheral logic with low-noise, fast-transient response. |
| Voltage Monitoring Accuracy | ±1.0 % target accuracy across up to 6 inputs - ensures precise UV/OV detection for ASIL D safety goal 1 (SG1) on all critical S32Z2 power rails. |
| Functional Safety | ASIL D on SG1 (UV/OV), QM on SG2 (watchdog) - certified per ISO 26262 for use in EV propulsion and domain controller safety architectures. |
| Thermal Resistance | RθJA = 30.1 °C/W - enables reliable operation at junction temperatures up to 150 °C in compact automotive PCB layouts. |
Pinout & Package
MPF5032BMMA5ES uses an HVQFN40EP (6 mm × 6 mm × 0.85 mm, 0.5 mm pitch) package with wettable flanks and an exposed thermal pad (EP) soldered to GND for enhanced thermal dissipation. The package is qualified for −40 °C to +125 °C ambient operation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| BUCK1_FB / BUCK2_FB / BUCK3_FB | Voltage feedback inputs | Enable closed-loop regulation of respective buck outputs; require external resistive dividers for voltage setting. |
| BUCK1_SW1/2 / BUCK2_SW1/2 / BUCK3_SW | Switching node outputs | Drive external high-side MOSFETs or internal power stages; require proper layout for EMI control and thermal management. |
| LDO1_OUT / LDO2_OUT | Regulated output terminals | Deliver low-noise, stable DC power to MCU I/O and peripherals; require local ceramic decoupling capacitors. |
| PGOOD / RSTB / FS0B | Safety status outputs | Open-drain active-low signals indicating power health, reset state, and fail-safe condition - directly interface with S32Z2 safety monitors. |
| SCL / SDA | I²C interface pins | Support 32-bit command structure with 8-bit CRC for secure, error-checked configuration and telemetry readback. |
| XFAILB | Power synchronization input/output | Coordinates startup/shutdown timing with upstream PMICs (e.g., FS86) to enforce deterministic sequencing across multi-chip power domains. |
Key Features
| Feature | Design Value |
|---|---|
| OTP-configurable startup sequence | Eliminates external strapping resistors and reduces BOM count by storing voltage setpoints, ramp rates, and enable timing in on-chip non-volatile memory. |
| Dual-domain power architecture | Separates MAIN (performance) and FS (safety) power domains with independent ground (GND/GNDFS), enabling fault containment and ASIL D compliance. |
| Integrated analog multiplexer (AMUX) | Routes up to 6 system voltage/temperature signals to a shared ADC, reducing external sensing components and PCB routing complexity. |
| 10 ms RSTB delay option | Configurable release timing aligns with S32Z2's internal POR requirements, preventing premature MCU initialization during power ramp-up. |
| EMI-optimized switching regulators | Includes spread-spectrum modulation and manual frequency tuning to meet automotive conducted emission standards (IEC 61967-4) without added filtering. |
Applications
| EV Propulsion Domain Controller | Chassis Integration Module |
|---|---|
Use Scenario: Centralized power management for S32Z2-based traction inverter control units in battery electric vehicles. IC Role / Device Role / Timing Role: Primary PMIC supplying core (0.825 V), I/O (1.1 V/1.8 V), and auxiliary (3.3 V) rails while enforcing ASIL D voltage supervision and fail-safe shutdown. Use Value: Enables single-chip power solution compliant with ISO 26262 ASIL D for SG1, reducing system-level validation effort and board space vs. discrete regulator + monitor designs. | Use Scenario: Power delivery and safety monitoring in steer-by-wire or brake-by-wire ECUs requiring synchronized multi-rail startup. IC Role / Device Role / Timing Role: System basis chip coordinating power-up with front-end supply (FS86) via XFAILB, delivering regulated rails and asserting PGOOD only after all monitored voltages stabilize. Use Value: Guarantees deterministic sequencing across 6+ voltage domains with ±1.0 % monitoring accuracy - critical for time-triggered chassis control software execution. |
| S32Z2 DC1 Evaluation Board | FS86 + S32Z2 Power Subsystem |
Use Scenario: Reference platform for developing S32Z2-based domain controllers targeting 17 mm × 17 mm form factor constraints. IC Role / Device Role / Timing Role: Preconfigured OTP variant (A5) optimized for DC1 EVB, providing validated startup sequence, default I²C addresses, and thermal layout guidance. Use Value: Accelerates hardware bring-up by eliminating OTP programming steps and providing production-matched thermal performance data (RθJA = 30.1 °C/W). | Use Scenario: Two-chip power architecture where FS86 handles high-voltage battery conditioning and MPF5032BMMA5ES manages low-voltage domain controller rails. IC Role / Device Role / Timing Role: Secondary PMIC receiving clean 5 V input from FS86, generating sub-1.5 V core rails, and feeding VMON_EXT for cross-domain voltage integrity checks. Use Value: Achieves >90 % overall efficiency across 3.3 V–0.825 V conversion chain while maintaining <10 µs fault response time for ASIL D safety goals. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar fail-safe PMIC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MPF5030BMMA0ES | Same PF5030 core, ASIL D on both SG1 and SG2, includes watchdog functionality enabled. | Required where full ASIL D coverage extends to MCU watchdog monitoring (SG2), not just voltage supervision (SG1). | Select when safety architecture mandates ASIL D for both power rail integrity and processor-level supervision functions. |
| MPF5032BMBA0ES | Same PF5032 family, but ASIL B on SG2 instead of QM; otherwise identical OTP and regulator configuration. | Suitable for cost-sensitive chassis modules where ASIL B suffices for watchdog monitoring, reducing qualification scope. | Choose when functional safety requirements permit ASIL B for SG2, enabling lower-cost qualification path without compromising core rail safety (SG1 remains ASIL D). |
Compared with MPF5030BMMA0ES, MPF5032BMMA5ES trades watchdog ASIL D for reduced qualification burden while retaining identical BUCK/LDO performance and thermal specs; versus MPF5032BMBA0ES, it offers no functional difference beyond OTP version (A5 vs A0) and target evaluation board (DC1 vs generic).
Availability
MPF5032BMMA5ES is available at Aetrix Electronics and suitable for EV propulsion domain controllers, chassis-integrated systems, and S32Z2 DC1 evaluation platforms requiring stable component supply, automotive-grade lifecycle assurance, and fail-safe power architecture validation.
Supply support for MPF5032BMMA5ES includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with leadership in automotive processors and functional safety-certified power management.
The PF5030 family - including MPF5032BMMA5ES - was developed as a fail-safe system basis chip to serve as the trusted power and safety foundation for NXP's S32Z2/E2 real-time domain controllers in electric vehicle drive train systems.
FAQ
What is the primary application target for MPF5032BMMA5ES?
MPF5032BMMA5ES is engineered specifically for S32Z2-based automotive domain controllers, particularly the S32Z2 DC1 evaluation board. It provides tightly integrated, ASIL D–compliant power regulation and safety monitoring for EV propulsion and chassis-integrated systems - delivering BUCK1/2 for core voltage, BUCK3 for auxiliary loads, LDO1/2 for I/O, and fail-safe outputs (PGOOD, RSTB, FS0B) in a single HVQFN40EP package.
Does MPF5032BMMA5ES support dual-phase operation for higher current delivery?
Yes, MPF5032BMMA5ES supports dual-phase operation for BUCK1/2, enabling up to 7.0 A DC total output current. This capability is essential for powering high-performance S32Z2 cores requiring stable 0.825 V at elevated load currents. Phase interleaving reduces input/output ripple and improves thermal distribution across the die, as confirmed in the PF5030_SDS Rev. 2 functional description.
How does MPF5032BMMA5ES achieve ASIL D compliance for voltage monitoring?
MPF5032BMMA5ES achieves ASIL D compliance for safety goal 1 (SG1) through independent analog voltage monitoring circuitry with ±1.0 % target accuracy across up to six inputs, dedicated fail-safe domain (GNDFS), redundant supervision paths, and built-in self-test (ABIST/LBIST). These features ensure robust detection of undervoltage/overvoltage faults on all critical S32Z2 rails (0.8 V, 1.1 V, 1.8 V, 3.3 V) per ISO 26262 requirements.
What package type and thermal characteristics does MPF5032BMMA5ES use?
MPF5032BMMA5ES uses the HVQFN40EP package (6 mm × 6 mm × 0.85 mm, 0.5 mm pitch) with wettable flanks and an exposed thermal pad. Its thermal resistance is RθJA = 30.1 °C/W under JEDEC JESD51-2 conditions, supporting continuous operation at junction temperatures up to 150 °C - verified for −40 °C to +125 °C ambient operation in automotive environments.
Can MPF5032BMMA5ES be configured after power-up, and what interface is used?
Yes, MPF5032BMMA5ES supports full post-startup configuration via its 32-bit I²C interface with 8-bit CRC protection. Engineers can dynamically adjust BUCK output voltages (e.g., BUCK1/2 from 0.7 V to 1.5 V), LDO outputs (1.1 V to 4.1 V), sequencing delays, and safety thresholds - enabling flexible system-level tuning for different operating modes without requiring OTP reprogramming.
MPF5032BMMA5ES Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 40-PowerVFQFN
- Packaging:
- Tray
- Product Status:
- Active
- Applications:
- System Basis Chip
- Current - Supply:
- -
- Voltage - Supply:
- 3.3V ~ 5.25V
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount, Wettable Flank
- Supplier Device Package:
- 40-HVQFN (6x6)
MPF5032BMMA5ES FAQ
1.How can I place an order for MPF5032BMMA5ES through Aetrix?
Please submit a Request for Quotation (RFQ) for MPF5032BMMA5ES on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MPF5032BMMA5ES reliable?
The price and inventory of MPF5032BMMA5ES are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MPF5032BMMA5ES is usually 5 days.
3.What payment methods are accepted for MPF5032BMMA5ES?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MPF5032BMMA5ES transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MPF5032BMMA5ES?
MPF5032BMMA5ES orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MPF5032BMMA5ES order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MPF5032BMMA5ES?
For technical support, including MPF5032BMMA5ES datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MPF5032BMMA5ES requirements.
6.How does Aetrix verify that MPF5032BMMA5ES is sourced from the original manufacturer or authorized distributors?
All MPF5032BMMA5ES products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MPF5032BMMA5ES meets industry standards.
7.What is the process for return or replacement of MPF5032BMMA5ES?
All MPF5032BMMA5ES units undergo pre-shipment inspection (PSI). If there is an issue with MPF5032BMMA5ES, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MPF5032BMMA5ES part is unused and in its original packaging.
Return procedure for MPF5032BMMA5ES:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MPF5032BMMA5ES Tags

-
TPS2511DGNR
Texas Instruments

-
UTC2000/MG
Microchip Technology

-
TUSB320HAIRWBR
Texas Instruments

-
TPS61252DSGR
Texas Instruments

-
PI5USB30216CXUAEX
Diodes Incorporated
-
SN6501DBVR
Texas Instruments

-
CYPD3177-24LQXQT
Infineon Technologies
-
SN6501QDBVRQ1
Texas Instruments

-
STUSB1600AQTR
STMicroelectronics

-
SN6505BDBVR
Texas Instruments
-
SN6501DBVT
Texas Instruments

-
TPS65150PWPR
Texas Instruments
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

