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Microchip Technology MSC2X31SDA070J
- Part No.:
- MSC2X31SDA070J
- Manufacturer:
- Microchip Technology
- Category:
- Diode Arrays
- Package:
- -
- Datasheet:
-
MSC2X31SDA070J.pdf
- Description:
- DIODE SIC SBD 700V 30A
- Quantity:
- Payment:
- Shipping:
Inventory:4,882
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Product details
Overview
MSC2X31SDA070J from Microsemi is a dual silicon carbide Schottky barrier diode configured in parallel topology, rated for 700 V DC reverse voltage and 30 A DC forward current per diode at TC = 90 °C, with 1.5 V typical forward voltage at 30 A and 25 °C, used in high-frequency PFC stages of industrial switch-mode power supplies.
For engineers reviewing the MSC2X31SDA070J datasheet, MSC2X31SDA070J pinout, MSC2X31SDA070J application, or MSC2X31SDA070J equivalent, key selection criteria include junction-to-case thermal resistance (0.95 °C/W), isolation voltage rating (2500 V RMS), avalanche-energy rating, and SOT-227 package compatibility with direct heatsink mounting.
Technical Context
The MSC2X31SDA070J integrates two independent SiC Schottky diodes in a single isolated SOT-227 package with common cathode configuration for parallel operation. It eliminates reverse recovery charge and exhibits low leakage (<1 μA at 25 °C, VR = 700 V) and low capacitive charge (83 nC at VR = 400 V).
Its thermal design supports high-power density operation via low RΘJC (0.95 °C/W typ) and wide operating temperature range (–55 °C to +175 °C), enabling use in thermally constrained inverters and motor controllers where silicon diodes would require oversized heatsinks.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Max DC reverse voltage | 700 V - Supports primary-side rectification in 400 V AC input PFC and 600 V DC bus inverters without derating. |
| Max DC forward current per diode | 30 A at TC = 90 °C - Enables continuous conduction mode operation in 3–5 kW power stages with forced-air cooling. |
| Forward voltage (typ) | 1.5 V at IF = 30 A, TJ = 25 °C - Reduces conduction loss by ~35% vs. comparable Si fast recovery diodes. |
| Junction-to-case thermal resistance | 0.95 °C/W (typ) - Allows direct mounting to heatsink with minimal thermal interface resistance for stable thermal management. |
| Isolation voltage | 2500 V RMS (50–60 Hz, 1 min) - Meets reinforced insulation requirements for industrial equipment safety standards. |
| Reverse leakage current | 1 μA max at TJ = 25 °C, VR = 700 V - Ensures low standby loss in high-voltage hold-up circuits. |
| Total capacitive charge | 83 nC at VR = 400 V - Minimizes switching loss during hard-commutation in ZVS/ZCS topologies. |
Pinout & Package
SOT-227 (also known as MiniBLOC) package with isolated metal baseplate, 4-terminal configuration: two anodes (A1, A2), one shared cathode (K), and isolated mounting base (M). Designed for bolt-down mechanical attachment and thermal coupling to external heatsink.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A1 | Anode 1 | Input terminal for first SiC diode; electrically isolated from A2 and K until bonded in circuit. |
| A2 | Anode 2 | Input terminal for second SiC diode; enables parallel current sharing when used with matched layout. |
| K | Common cathode | Single output node for both diodes; must be routed with low-inductance path to minimize switching oscillation. |
| M | Mounting base / isolation terminal | Electrically isolated metal baseplate rated for 2500 V RMS; serves as thermal interface, not electrical connection. |
Key Features
| Feature | Design Value |
|---|---|
| No reverse recovery | Eliminates switching tail current and associated EMI, enabling >200 kHz operation without snubbers in PFC boost stages. |
| Low forward voltage | 1.5 V typical at rated current reduces conduction loss by up to 40% versus 650 V Si FRD, improving full-load efficiency. |
| Avalanche-energy rated | Withstands repetitive unclamped inductive switching events in motor drive freewheeling paths without degradation. |
| Isolated voltage rating | 2500 V RMS isolation allows safe integration into Class I insulated systems without additional barrier materials. |
| Low junction-to-case thermal resistance | 0.95 °C/W typical enables compact thermal design with <10 °C temperature rise at 30 A, supporting high-power density layouts. |
Applications
| Power Factor Correction (PFC) | Anti-parallel Diode in Inverters |
|---|---|
Use Scenario: Boost PFC stage in 3–5 kW industrial SMPS with 400 V AC input. IC Role / Device Role / Timing Role: High-frequency rectifier handling 30 A average current at 100–200 kHz switching frequency. Use Value: Eliminates reverse recovery loss, reducing MOSFET turn-off stress and improving system efficiency by 0.8–1.2% at full load. | Use Scenario: IGBT anti-parallel path in 3-phase 600 V DC bus motor drives. IC Role / Device Role / Timing Role: Bidirectional current path enabling regenerative braking and sinusoidal current commutation. Use Value: Low VF and zero QRR prevent shoot-through risk and reduce gate driver stress during high-dV/dt transitions. |
| Freewheeling Diode in Converters | Snubber/Clamp Diode in Flyback |
Use Scenario: Output rectification in isolated DC–DC converters for telecom and server PSUs. IC Role / Device Role / Timing Role: Freewheeling path during synchronous rectifier off-time in active clamp flyback topologies. Use Value: Fast recovery and low leakage maintain regulation accuracy under light-load conditions while minimizing standby power. | Use Scenario: RCD snubber network across primary-side MOSFET in high-voltage flyback converters. IC Role / Device Role / Timing Role: Clamp diode absorbing leakage inductance energy during MOSFET turn-off. Use Value: Avalanche rating ensures reliability under repeated transient overvoltage events without parameter drift. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar SiC Schottky diode applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| C3D03060E (Wolfspeed) | Single 600 V / 30 A SiC SBD in TO-247-2L; no isolation; higher VF (1.7 V typ) | Requires external isolation for safety-critical systems; unsuitable for direct heatsink mounting without insulator. | Select when board space permits discrete placement and isolation is handled at PCB level. |
| STPSC3007D (STMicroelectronics) | Dual 700 V / 30 A SiC SBD in TO-247-3L; non-isolated; RΘJC = 1.5 °C/W (typ) | Lacks 2500 V isolation; requires thermal pad and separate mounting hardware for heatsink interface. | Select when cost sensitivity outweighs isolation requirement and thermal margin allows higher RΘJC. |
Compared with C3D03060E and STPSC3007D, the MSC2X31SDA070J uniquely combines dual-diode parallel configuration, 2500 V isolation, and 0.95 °C/W RΘJC in one SOT-227 package-enabling simplified mechanical integration, reduced component count, and compliance with reinforced insulation standards without added BOM complexity.
Availability
MSC2X31SDA070J is available at Aetrix Electronics and suitable for power factor correction, motor controller freewheeling, and high-voltage snubber applications requiring stable component supply, long-term industrial lifecycle support, and traceable sourcing.
Supply support for MSC2X31SDA070J includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Microsemi (now part of Microchip Technology) is a U.S.-based semiconductor company specializing in high-reliability analog, mixed-signal, and power solutions for aerospace, defense, industrial, and communications markets.
The MSC2X31SDA070J belongs to Microsemi's silicon carbide Schottky diode product line, engineered specifically for high-efficiency, high-frequency power conversion in industrial-grade PFC, inverter, and motor control systems where thermal performance and safety isolation are critical.
FAQ
What is the maximum operating junction temperature for the MSC2X31SDA070J?
The MSC2X31SDA070J has a specified operating junction temperature range of –55 °C to +175 °C. This wide range supports reliable operation in harsh environments such as industrial motor drives and outdoor power converters. The device maintains stable electrical characteristics-including low leakage and consistent forward voltage-across this full range, making MSC2X31SDA070J suitable for applications with elevated ambient temperatures and limited cooling.
How does the SOT-227 package of the MSC2X31SDA070J improve thermal performance compared to TO-247 packages?
The SOT-227 package of the MSC2X31SDA070J provides a direct metal-to-heatsink interface with a typical junction-to-case thermal resistance of 0.95 °C/W-significantly lower than TO-247-based alternatives (e.g., 1.5 °C/W for STPSC3007D). Its isolated baseplate eliminates need for insulating pads, reducing thermal impedance and enabling more compact thermal designs. This makes MSC2X31SDA070J especially effective in space-constrained, high-power-density applications.
Is the MSC2X31SDA070J rated for avalanche energy, and how is that verified?
Yes, the MSC2X31SDA070J is explicitly rated for repetitive avalanche energy per the manufacturer's datasheet. This rating is validated through standardized unclamped inductive switching (UIS) tests per JEDEC JESD24-11, confirming robustness against transient overvoltage events in motor drive and converter freewheeling paths. The avalanche capability ensures long-term reliability of MSC2X31SDA070J in real-world inductive load switching without parameter shift or failure.
Can the MSC2X31SDA070J be used as a drop-in replacement for the MSC2X30SDA070J?
No-the MSC2X31SDA070J and MSC2X30SDA070J differ in internal configuration: MSC2X31SDA070J uses a parallel anode arrangement, while MSC2X30SDA070J is configured for anti-parallel operation. Their pin assignments and circuit roles are not interchangeable. Substituting MSC2X31SDA070J for MSC2X30SDA070J without layout and schematic review will result in incorrect functionality. Always verify topology alignment before using MSC2X31SDA070J in a design originally intended for MSC2X30SDA070J.
Does the MSC2X31SDA070J meet RoHS and REACH compliance requirements?
Yes, the MSC2X31SDA070J is RoHS compliant and meets applicable REACH substance restrictions as confirmed in Microsemi's official documentation (Datasheet Revision A, November 2020). It contains no lead, mercury, cadmium, hexavalent chromium, polybrominated biphenyls (PBB), or polybrominated diphenyl ethers (PBDE), and all SVHC substances are below threshold limits. This compliance applies to MSC2X31SDA070J units shipped by authorized distributors including Aetrix Electronics.
MSC2X31SDA070J Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Microchip Technology
- Series:
- -
- Package/Case:
- -
- Packaging:
- Tube
- Product Status:
- Active
- Diode Configuration:
- -
- Technology:
- -
- Voltage - DC Reverse (Vr) (Max):
- -
- Current - Average Rectified (Io) (per Diode):
- -
- Voltage - Forward (Vf) (Max) @ If:
- -
- Speed:
- -
- Reverse Recovery Time (trr):
- -
- Current - Reverse Leakage @ Vr:
- -
- Operating Temperature - Junction:
- -
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- -
- Supplier Device Package:
- -
MSC2X31SDA070J FAQ
1.How can I place an order for MSC2X31SDA070J through Aetrix?
Please submit a Request for Quotation (RFQ) for MSC2X31SDA070J on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MSC2X31SDA070J reliable?
The price and inventory of MSC2X31SDA070J are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MSC2X31SDA070J is usually 5 days.
3.What payment methods are accepted for MSC2X31SDA070J?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MSC2X31SDA070J transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MSC2X31SDA070J?
MSC2X31SDA070J orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MSC2X31SDA070J order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MSC2X31SDA070J?
For technical support, including MSC2X31SDA070J datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MSC2X31SDA070J requirements.
6.How does Aetrix verify that MSC2X31SDA070J is sourced from the original manufacturer or authorized distributors?
All MSC2X31SDA070J products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MSC2X31SDA070J meets industry standards.
7.What is the process for return or replacement of MSC2X31SDA070J?
All MSC2X31SDA070J units undergo pre-shipment inspection (PSI). If there is an issue with MSC2X31SDA070J, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MSC2X31SDA070J part is unused and in its original packaging.
Return procedure for MSC2X31SDA070J:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MSC2X31SDA070J Tags
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BAV99,215
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BAV70LT1G
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BAT54S-7-F
Diodes Incorporated
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BAV99LT1G
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BAT54S,215
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MMBD1503-TP
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