Vishay General Semiconductor - Diodes Division MSMP8.0AHM3/H
- Part No.:
- MSMP8.0AHM3/H
- Manufacturer:
- Vishay General Semiconductor - Diodes Division
- Category:
- TVS Diodes
- Package:
- DO-219AD
- Datasheet:
-
MSMP8.0AHM3/H.pdf
- Description:
- LOW PROFILE OF 150W TVS PRODUCT
- Quantity:
- Payment:

- Shipping:

Inventory:22,738
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
MSMP8.0AHM3/H from Vishay General Semiconductor is a unidirectional surface-mount TRANSZORB® transient voltage suppressor in MicroSMP (DO-219AD) package, with 8.0 V stand-off voltage (VWM), 8.89–9.83 V breakdown voltage (VBR), 150 W peak pulse power (10/1000 μs), and AEC-Q101 qualification. It protects automotive sensor signal lines and MOSFET gates against ESD and inductive switching transients.
For engineers reviewing the MSMP8.0AHM3/H datasheet, MSMP8.0AHM3/H pinout, MSMP8.0AHM3/H application, or MSMP8.0AHM3/H equivalent, key selection criteria include clamping voltage (13.6 V max at IPPM), low-profile height (0.65 mm), MSL Level 1 rating, and verified 15 kV air / 8 kV contact ESD immunity per IEC 61000-4-2 and AEC-Q101-001.
Technical Context
This device operates as a unidirectional TVS diode with oxide planar chip junction, designed for fast response to transient overvoltages. Its clamping behavior follows VCL = RD × IPP + VBR(max), with RD = 0.342 Ω and VBR(max) = 9.83 V - enabling predictable suppression under 10/1000 μs surges up to 11.0 A.
Thermal performance is defined by RθJM = 30 °C/W (junction-to-mount) and RθJA = 250 °C/W (junction-to-ambient), requiring minimum 6.0 mm × 6.0 mm copper pads per terminal for rated 150 W pulse handling. It meets J-STD-020C MSL Level 1 and LF peak of 260 °C for reflow compatibility.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VWM | 8.0 V - maximum reverse stand-off voltage before conduction; ensures no leakage during normal 8 V rail operation. |
| VBR (min/max) | 8.89 V / 9.83 V at 1.0 mA - precise breakdown threshold defining turn-on onset for transient clamping. |
| VC (max) @ IPPM | 13.6 V at 11.0 A (10/1000 μs) - peak clamped voltage protecting downstream ICs within safe voltage margins. |
| PPPM | 150 W (10/1000 μs) - surge energy absorption capability validated on 6.0 mm × 6.0 mm PCB copper pads. |
| ESD Rating | 15 kV air / 8 kV contact - exceeds IEC 61000-4-2 Level 4, suitable for automotive sensor interface protection. |
| Package | MicroSMP (DO-219AD) - 2.30 mm × 1.10 mm footprint, 0.65 mm height, halogen-free, RoHS-compliant, AEC-Q101 qualified. |
| TJ max | 150 °C - maximum operating junction temperature enabling use in under-hood automotive environments. |
Pinout & Package
MicroSMP (DO-219AD) is a 2-terminal surface-mount package with cathode denoted by a color band. Anode and cathode terminals are located on opposite ends of the rectangular die; polarity must be observed during PCB layout to ensure correct transient shunting path.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Anode | Transient current entry point (for unidirectional operation) | Connected to protected line (e.g., sensor output); conducts only when line voltage exceeds VBR relative to cathode. |
| Cathode | Transient current return path to ground or reference rail | Marked by color band; must connect to low-impedance ground plane to achieve specified clamping performance. |
Key Features
| Feature | Design Value |
|---|---|
| AEC-Q101 qualification | Validated for automotive applications including engine control, ADAS sensors, and body electronics per stress test requirements. |
| Low profile (0.65 mm height) | Enables placement in space-constrained modules such as camera ECUs and radar front-ends without mechanical interference. |
| Oxide planar chip junction | Ensures stable, repeatable VBR tolerance and long-term reliability under thermal cycling and humidity exposure. |
| Matte tin-plated leads | Guarantees solderability per J-STD-002 and JESD 22-B102, with whisker resistance per JESD 201 Class 2. |
| UL 94 V-0 molding compound | Provides flame-retardant encapsulation required for automotive and industrial safety compliance. |
Applications
| Automotive Sensor Protection | Industrial Motor Drive I/O |
|---|---|
Use Scenario: Protecting LIN/CAN sensor signal lines (e.g., temperature, pressure, position) from load dump and ESD events in vehicle cabins and powertrains. IC Role / Device Role / Timing Role: Unidirectional TVS clamp placed between sensor output and microcontroller input to limit voltage excursions below absolute maximum ratings. Use Value: Maintains signal integrity during 15 kV ESD strikes and 10/1000 μs inductive spikes while adding < 0.3 pF capacitance to preserve rise time. |
Use Scenario: Safeguarding digital I/O pins of PLC modules and motor driver gate drivers exposed to relay coil flyback and field wiring transients. IC Role / Device Role / Timing Role: Standoff-rated transient suppressor mounted directly at connector entry points to divert surge energy before reaching logic-level circuitry. Use Value: Clamps to ≤13.6 V at 11 A, preventing latch-up or permanent damage to 3.3 V/5 V interface ICs in harsh factory environments. |
| Automotive Power Supply Rail | Consumer IoT Interface Protection |
Use Scenario: Secondary protection on 12 V battery-fed subsystem rails (e.g., infotainment USB-C port, lighting control) where primary TVS or fuse coordination is required. IC Role / Device Role / Timing Role: Fast-reacting secondary clamp working in concert with upstream fuses or polymer PTCs to limit let-through energy during sustained overvoltage. Use Value: Withstands repeated 150 W pulses and maintains VWM stability across -55 °C to +150 °C, supporting ASIL-B system robustness. |
Use Scenario: ESD hardening of USB, I²C, and UART lines in smart home hubs and wearable chargers subjected to user-handling discharge. IC Role / Device Role / Timing Role: Board-level ESD suppressor placed adjacent to connectors to absorb human-body-model discharges before reaching SoC GPIOs. Use Value: Delivers 8 kV contact / 15 kV air ESD immunity in a 2.3 mm × 1.1 mm footprint - minimizing PCB area vs. larger SOD-323 alternatives. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar transient voltage suppression applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SMAJ8.0A-HF | Same VWM/VBR range but SMA (DO-214AC) package (4.5 mm × 2.7 mm); higher RθJA (400 °C/W); non-AEC-Q101. | Limited to commercial-grade industrial or consumer use; not qualified for automotive under-hood deployment. | Select when cost sensitivity outweighs space constraints and AEC-Q101 is not mandated. |
| SMCJ8.0A-QH | Higher PPPM (1500 W), DO-214AB package (7.1 mm × 6.2 mm); AEC-Q101 qualified; VBR = 8.89–9.83 V same as MSMP8.0AHM3/H. | Used where higher surge margin is needed (e.g., alternator-connected systems), but requires 3× board area. | Choose when system-level surge testing exceeds 150 W and board space permits larger footprint. |
Compared with SMAJ8.0A-HF and SMCJ8.0A-QH, MSMP8.0AHM3/H uniquely delivers AEC-Q101 qualification in the smallest qualified footprint (MicroSMP), enabling high-density automotive PCB layouts without sacrificing surge rating or thermal derating compliance.
Availability
MSMP8.0AHM3/H is available at Aetrix Electronics and suitable for automotive sensor protection, industrial motor drive I/O, and consumer IoT interface protection requiring stable component supply, full traceability, and long-term lifecycle support.
Supply support for MSMP8.0AHM3/H includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Vishay General Semiconductor is a global leader in discrete semiconductors, specializing in diodes, rectifiers, TVS devices, and optoelectronics with emphasis on reliability and automotive-grade validation.
The MSMP8.0AHM3/H belongs to Vishay's eSMP® Series of ultra-low-profile TVS diodes, engineered specifically for space-constrained, high-reliability automotive and industrial applications demanding AEC-Q101 compliance and minimal board real estate.
FAQ
What is the exact breakdown voltage range for MSMP8.0AHM3/H?
The MSMP8.0AHM3/H has a guaranteed breakdown voltage (VBR) range of 8.89 V to 9.83 V at 1.0 mA test current, as specified in the Vishay datasheet Document Number 89457. This tight tolerance ensures consistent clamping onset across production lots and supports reliable design margining for 8 V nominal systems.
Is MSMP8.0AHM3/H suitable for automotive under-hood applications?
Yes, MSMP8.0AHM3/H is AEC-Q101 qualified and rated for TJ = -55 °C to +150 °C, making it suitable for under-hood automotive applications such as engine control units and transmission sensors. Its MicroSMP package withstands thermal cycling and vibration when mounted per recommended pad layout.
What is the maximum clamping voltage of MSMP8.0AHM3/H at rated surge current?
The MSMP8.0AHM3/H exhibits a maximum clamping voltage (VC) of 13.6 V at 11.0 A peak pulse current (10/1000 μs waveform), measured with 6.0 mm × 6.0 mm copper pads. This value is derived from VCL = RD × IPP + VBR(max), where RD = 0.342 Ω and VBR(max) = 9.83 V.
Does MSMP8.0AHM3/H meet lead-free reflow requirements?
Yes, MSMP8.0AHM3/H is RoHS-compliant and qualified for lead-free reflow with a maximum peak temperature of 260 °C per J-STD-020C. Its matte tin-plated terminals ensure solderability and pass JESD 201 Class 2 whisker testing.
How does the MicroSMP package of MSMP8.0AHM3/H compare to SMA or SMC packages in layout impact?
The MicroSMP (DO-219AD) package of MSMP8.0AHM3/H measures 2.30 mm × 1.10 mm with 0.65 mm height - less than half the footprint of SMA (DO-214AC) and one-fifth that of SMC (DO-214AB). This enables dense routing in compact modules like ADAS cameras, where board space and profile are critical constraints.
MSMP8.0AHM3/H Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Vishay General Semiconductor - Diodes Division
- Package/Case:
- DO-219AD
- Series:
- TransZorb®
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Type:
- Zener
- Unidirectional Channels:
- 1
- Bidirectional Channels:
- -
- Voltage - Reverse Standoff (Typ):
- 8V
- Voltage - Breakdown (Min):
- 8.89V
- Voltage - Clamping (Max) @ Ipp:
- 13.6V
- Current - Peak Pulse (10/1000µs):
- 11A
- Power - Peak Pulse:
- 150W
- Power Line Protection:
- No
- Applications:
- General Purpose
- Capacitance @ Frequency:
- -
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- Automotive
- Qualification:
- AEC-Q101
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- DO-219AD (MicroSMP)
MSMP8.0AHM3/H FAQ
1.How can I place an order for MSMP8.0AHM3/H through Aetrix?
Please submit a Request for Quotation (RFQ) for MSMP8.0AHM3/H on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MSMP8.0AHM3/H reliable?
The price and inventory of MSMP8.0AHM3/H are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MSMP8.0AHM3/H is usually 5 days.
3.What payment methods are accepted for MSMP8.0AHM3/H?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MSMP8.0AHM3/H transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MSMP8.0AHM3/H?
MSMP8.0AHM3/H orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MSMP8.0AHM3/H order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MSMP8.0AHM3/H?
For technical support, including MSMP8.0AHM3/H datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MSMP8.0AHM3/H requirements.
6.How does Aetrix verify that MSMP8.0AHM3/H is sourced from the original manufacturer or authorized distributors?
All MSMP8.0AHM3/H products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MSMP8.0AHM3/H meets industry standards.
7.What is the process for return or replacement of MSMP8.0AHM3/H?
All MSMP8.0AHM3/H units undergo pre-shipment inspection (PSI). If there is an issue with MSMP8.0AHM3/H, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MSMP8.0AHM3/H part is unused and in its original packaging.
Return procedure for MSMP8.0AHM3/H:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MSMP8.0AHM3/H Tags

-
ESD9B5.0ST5G
onsemi

-
DESD3V3E1BL-7B
Diodes Incorporated

-
ESD5Z3.3T1G
onsemi

-
D5V0H1B2LP-7B
Diodes Incorporated

-
D5V0P1B2LP-7B
Diodes Incorporated

-
DESD5V0U1BA-7
Diodes Incorporated

-
ESD5Z5.0T1G
onsemi

-
DESD5V0U1BB-7
Diodes Incorporated

-
D12V0L1B2LP-7B
Diodes Incorporated

-
PESD2V0Y1BSFYL
Nexperia USA Inc.

-
DF2S5M4CT,L3F
Toshiba Semiconductor and Storage

-
D5V0L1B2WS-7
Diodes Incorporated
Tech Hub
Comparator circuit design covering voltage thresholds, input limits, open-collector outputs, LM393 wiring, op-amp differences, hysteresis, timing, window detection and practical fault diagnosis.
Schmitt triggers use separate rising and falling thresholds to stabilize slow or noisy signals. This guide covers hysteresis, 74HC14 and 74HCT14 selection, comparator calculations, RC oscillators and p…
Counterfeit components can hide behind convincing markings and passing basic function tests. This engineering reference covers source traceability, external inspection, X-ray, XRF, electrical testing, …
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …

