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Vishay General Semiconductor - Diodes Division MSMP9.0A-M3/89A
- Part No.:
- MSMP9.0A-M3/89A
- Manufacturer:
- Vishay General Semiconductor - Diodes Division
- Category:
- TVS Diodes
- Package:
- DO-219AD
- Datasheet:
-
MSMP9.0A-M3/89A.pdf
- Description:
- TVS DIODE 9VWM 15.4VC MICROSMP
- Quantity:
- Payment:
- Shipping:
Inventory:14,960
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Product details
Overview
MSMP9.0A-M3/89A from Vishay General Semiconductor is a unidirectional surface-mount TRANSZORB® transient voltage suppressor in MicroSMP (DO-219AD) package, with 9.0 V stand-off voltage (VWM), 10.0–11.1 V breakdown voltage (VBR), 150 W peak pulse power (10/1000 μs), and 15.4 V maximum clamping voltage at 9.7 A IPPM. It protects signal lines in automotive sensor units against ESD and load-switching transients.
For engineers reviewing the MSMP9.0A-M3/89A datasheet, MSMP9.0A-M3/89A pinout, MSMP9.0A-M3/89A application, or MSMP9.0A-M3/89A equivalent, key selection criteria include unidirectional polarity, AEC-Q101 qualification, 15 kV air/8 kV contact ESD rating, MicroSMP footprint compatibility, and clamping performance under 10/1000 μs surge conditions.
Technical Context
This TVS diode uses an oxide planar chip junction and is optimized for low-profile PCB placement with 0.65 mm typical height. Its unidirectional architecture provides reverse-biased clamping only, requiring correct cathode orientation during layout.
Thermal design relies on 6.0 mm × 6.0 mm copper pads per terminal to achieve RθJM = 30 °C/W and sustain 150 W peak pulse power. It meets J-STD-020C MSL Level 1 and supports lead-free reflow up to 260 °C peak temperature.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VWM | 9.0 V - Maximum continuous reverse operating voltage before clamping begins; sets upper limit for normal signal line bias. |
| VBR (min/max) | 10.0 V / 11.1 V - Breakdown occurs within this range at 1.0 mA test current; defines turn-on threshold consistency. |
| VCL @ IPPM | 15.4 V at 9.7 A - Clamping voltage under 10/1000 μs surge; determines worst-case overvoltage seen by protected IC. |
| PPPM (10/1000 μs) | 150 W - Peak transient energy handling capacity; enables protection against IEC 61000-4-5 level 3 surges. |
| ESD Rating | 15 kV air / 8 kV contact - Complies with IEC 61000-4-2; ensures robustness against human-body-model discharge events. |
| Package | MicroSMP (DO-219AD) - 2.70 mm × 1.40 mm footprint with 0.65 mm height; compatible with high-density automated SMT assembly. |
| AEC-Q101 | Qualified - Validated for automotive-grade reliability including temperature cycling, HTRB, and ESD stress per AEC standard. |
Pinout & Package
MicroSMP (DO-219AD) is a two-terminal surface-mount package with cathode indicated by a color band. Anode and cathode terminals are located on opposite ends of the rectangular body; no internal leads or exposed die pad.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Anode | Current entry point during forward conduction; connected to protected line's lower-potential side. | Must be tied to signal or power rail being protected; polarity reversal prevents clamping action. |
| Cathode | Current exit point during reverse-biased clamping; marked by visible color band. | Connected to ground or common reference; orientation error causes open-circuit failure under surge. |
Key Features
| Feature | Design Value |
|---|---|
| Very low profile (0.65 mm) | Enables use in ultra-thin consumer and ADAS modules where Z-height is constrained below 0.7 mm. |
| Oxide planar chip junction | Delivers tight VBR tolerance (±5% typical) and stable leakage (<2 μA at VWM), critical for low-power sensor interfaces. |
| Matte tin plated leads | Ensures solderability per J-STD-002 and JESD 22-B102; eliminates whisker risk per JESD 201 Class 2. |
| UL 94 V-0 molding compound | Meets flammability requirements for automotive cabin and engine-control PCBs without additional conformal coating. |
| Halogen-free & RoHS-compliant | Satisfies EU Directive 2011/65/EU and automotive material declaration (IMDS) requirements for green manufacturing. |
Applications
| Automotive Sensor Protection | Industrial I/O Interface |
|---|---|
|
Use Scenario: Protecting LIN bus transceivers and analog sensor outputs (e.g., pressure, temperature) in engine control units from load-dump and inductive switching spikes. IC Role / Device Role / Timing Role: Unidirectional clamping device placed between signal line and chassis ground to shunt transient energy before it reaches downstream ASIC. Use Value: Limits clamped voltage to ≤15.4 V during 10/1000 μs surges, preserving integrity of 5 V or 3.3 V interface logic and preventing latch-up in microcontrollers. |
Use Scenario: Safeguarding RS-485/RS-422 differential data lines in factory automation PLCs exposed to motor drive noise and relay bounce. IC Role / Device Role / Timing Role: Standoff-clamp TVS mounted across differential pair inputs to absorb common-mode transients while maintaining signal integrity. Use Value: With 9.0 V VWM and 15.4 V VCL, it avoids false triggering during nominal ±5 V signaling yet clamps fast-rising surges within 1 ns response time. |
| Consumer USB Port Protection | Medical Diagnostic Equipment |
|
Use Scenario: Shielding USB 2.0 D+/D− lines in portable medical monitors from ESD events during cable insertion and handling. IC Role / Device Role / Timing Role: Low-capacitance unidirectional TVS placed inline with each data line to ground, minimizing signal distortion. Use Value: Achieves <15 pF junction capacitance at zero bias, preserving USB 2.0 eye diagram integrity while passing 15 kV air-gap ESD per IEC 61000-4-2. |
Use Scenario: Protecting analog front-end inputs of ECG and EEG patient monitoring systems from electrostatic discharge during clinical use. IC Role / Device Role / Timing Role: High-reliability transient suppressor on biopotential amplifier inputs, certified to AEC-Q101 for long-term stability. Use Value: Maintains <2 μA reverse leakage at 9.0 V, preventing DC offset drift in high-gain amplifiers while delivering 8 kV contact ESD immunity. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar transient suppression applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SMAJ9.0A | DO-214AC (SMA) package; 2.5 mm height; 1.5× larger footprint; same VWM/VBR specs and 150 W PPPM. | Less suitable for space-constrained automotive modules; better thermal dissipation on large pads due to higher RθJA margin. | Select SMAJ9.0A when board real estate allows and higher manual-handling robustness is needed. |
| SMCJ9.0A | DO-214AB (SMC) package; 2.3 mm height; 7.1 mm × 6.2 mm footprint; 1500 W PPPM rating (10/1000 μs). | Used in primary-level AC/DC input protection; over-specified for signal-line clamping but offers higher surge margin. | Choose SMCJ9.0A only for high-energy industrial mains-side protection-not for signal integrity-critical locations. |
Compared with SMAJ9.0A and SMCJ9.0A, the MSMP9.0A-M3/89A delivers identical electrical clamping performance in a 60 % smaller footprint and 75 % lower profile, making it optimal for modern automotive and portable electronics where Z-height and area are constrained.
Availability
MSMP9.0A-M3/89A is available at Aetrix Electronics and suitable for automotive sensor protection, industrial I/O interface hardening, and medical diagnostic equipment requiring stable component supply with AEC-Q101 qualification and halogen-free compliance.
Supply support for MSMP9.0A-M3/89A includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Vishay General Semiconductor designs and manufactures discrete semiconductors including diodes, rectifiers, and TVS devices, with focus on reliability, miniaturization, and automotive-grade qualification.
The MSMP series was developed specifically for space-constrained automotive and industrial applications requiring AEC-Q101 qualified, ultra-low-profile transient suppression in MicroSMP packaging.
FAQ
What is the clamping voltage of the MSMP9.0A-M3/89A under a 10/1000 μs surge?
The MSMP9.0A-M3/89A has a maximum clamping voltage (VCL) of 15.4 V at 9.7 A peak pulse current (IPPM) under a 10/1000 μs waveform. This value is measured per Figure 1 in the official Vishay datasheet (Document Number: 89457) and reflects worst-case clamping behavior when mounted on 6.0 mm × 6.0 mm copper pads. The MSMP9.0A-M3/89A maintains this performance across its full operating temperature range.
Is the MSMP9.0A-M3/89A suitable for automotive applications?
Yes, the MSMP9.0A-M3/89A is AEC-Q101 qualified and explicitly rated for automotive use per Vishay's qualification report. It meets stringent requirements including temperature cycling, high-temperature reverse bias (HTRB), and ESD testing per AEC-Q101-001. The MSMP9.0A-M3/89A is commonly deployed in engine control units, body electronics, and ADAS sensor modules where reliability under harsh environmental conditions is mandatory.
What does the "M3/89A" suffix indicate in MSMP9.0A-M3/89A?
The "M3" suffix denotes halogen-free, RoHS-compliant, commercial-grade construction with matte tin-plated terminals. The "89A" refers to the preferred tape-and-reel packaging code: 7-inch diameter plastic tape with 4500 units per reel. This packaging format is optimized for high-speed pick-and-place assembly and is specified in Vishay's ordering information table for the MSMP9.0A-M3/89A.
How does the MicroSMP package of the MSMP9.0A-M3/89A compare to SMA or SMC packages?
The MicroSMP (DO-219AD) package of the MSMP9.0A-M3/89A measures 2.70 mm × 1.40 mm with 0.65 mm height-approximately 60 % smaller in area and half the height of DO-214AC (SMA) and DO-214AB (SMC). Unlike SMA/SMC, MicroSMP lacks a heat sink tab and relies on optimized pad layout for thermal transfer. The MSMP9.0A-M3/89A achieves equivalent 150 W surge capability in this miniature form factor.
Does the MSMP9.0A-M3/89A support lead-free reflow soldering?
Yes, the MSMP9.0A-M3/89A is qualified for lead-free reflow with a maximum peak temperature of 260 °C, compliant with J-STD-020C MSL Level 1. Its matte tin terminals meet J-STD-002 solderability requirements, and the molding compound is UL 94 V-0 rated. The MSMP9.0A-M3/89A sustains these specifications without degradation when processed using standard Pb-free reflow profiles.
MSMP9.0A-M3/89A Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Vishay General Semiconductor - Diodes Division
- Package/Case:
- DO-219AD
- Series:
- TransZorb®
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Type:
- Zener
- Unidirectional Channels:
- 1
- Bidirectional Channels:
- -
- Voltage - Reverse Standoff (Typ):
- 9V
- Voltage - Breakdown (Min):
- 10V
- Voltage - Clamping (Max) @ Ipp:
- 15.4V
- Current - Peak Pulse (10/1000µs):
- 9.7A
- Power - Peak Pulse:
- 150W
- Power Line Protection:
- No
- Applications:
- General Purpose
- Capacitance @ Frequency:
- -
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- DO-219AD (MicroSMP)
MSMP9.0A-M3/89A FAQ
1.How can I place an order for MSMP9.0A-M3/89A through Aetrix?
Please submit a Request for Quotation (RFQ) for MSMP9.0A-M3/89A on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MSMP9.0A-M3/89A reliable?
The price and inventory of MSMP9.0A-M3/89A are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MSMP9.0A-M3/89A is usually 5 days.
3.What payment methods are accepted for MSMP9.0A-M3/89A?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MSMP9.0A-M3/89A transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MSMP9.0A-M3/89A?
MSMP9.0A-M3/89A orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MSMP9.0A-M3/89A order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MSMP9.0A-M3/89A?
For technical support, including MSMP9.0A-M3/89A datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MSMP9.0A-M3/89A requirements.
6.How does Aetrix verify that MSMP9.0A-M3/89A is sourced from the original manufacturer or authorized distributors?
All MSMP9.0A-M3/89A products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MSMP9.0A-M3/89A meets industry standards.
7.What is the process for return or replacement of MSMP9.0A-M3/89A?
All MSMP9.0A-M3/89A units undergo pre-shipment inspection (PSI). If there is an issue with MSMP9.0A-M3/89A, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MSMP9.0A-M3/89A part is unused and in its original packaging.
Return procedure for MSMP9.0A-M3/89A:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MSMP9.0A-M3/89A Tags
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ESD9B5.0ST5G
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DESD3V3E1BL-7B
Diodes Incorporated
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Diodes Incorporated
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Diodes Incorporated
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Diodes Incorporated
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onsemi
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DESD5V0U1BB-7
Diodes Incorporated
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D12V0L1B2LP-7B
Diodes Incorporated
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Nexperia USA Inc.
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Toshiba Semiconductor and Storage
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Diodes Incorporated
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