Vishay General Semiconductor - Diodes Division MSP3V3-E3/89A
- Part No.:
- MSP3V3-E3/89A
- Manufacturer:
- Vishay General Semiconductor - Diodes Division
- Category:
- TVS Diodes
- Package:
- DO-219AD
- Datasheet:
-
MSP3V3-E3/89A.pdf
- Description:
- TVS DIODE 3.3VWM 11.5VC MICROSMP
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
MSP3V3-E3/89A from Vishay General Semiconductor is a unidirectional surface-mount Transient Voltage Suppressor (TVS) in the MicroSMP package, designed for low-profile board-level protection of sensitive ICs and MOSFETs against ESD and inductive switching transients. It features a 3.3 V stand-off voltage (VWM), 4.1–5.1 V breakdown range (VBR), 150 W peak pulse power (10/1000 μs), and AEC-Q101 qualification for automotive-grade reliability.
For engineers reviewing the MSP3V3-E3/89A datasheet, MSP3V3-E3/89A pinout, MSP3V3-E3/89A application, or MSP3V3-E3/89A equivalent, key selection criteria include clamping voltage (7.6 V max at 19.7 A), junction capacitance (~4.5 pF at 0 V), ESD immunity (15 kV air / 8 kV contact), thermal resistance (RθJA = 250 °C/W), and MicroSMP mechanical compatibility with automated SMT placement.
Technical Context
The MSP3V3-E3/89A employs an oxide planar chip junction and unidirectional polarity to provide fast-response overvoltage clamping for signal-line and power-rail protection. Its MicroSMP package enables high-density layout while maintaining robust thermal performance on 6.0 mm × 6.0 mm copper pads (RθJM = 30 °C/W).
It delivers precise transient suppression with a maximum clamping voltage of 7.6 V at 19.7 A (10/1000 μs), derived from VBR(max) + (IPPM × RD), where dynamic resistance RD is 0.127 Ω. The device operates across –55 °C to +150 °C and meets J-STD-020C MSL Level 1 with 260 °C reflow peak.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VWM (Stand-off Voltage) | 3.3 V - Maximum continuous reverse voltage before significant leakage; defines operating margin below clamping threshold |
| VBR (Breakdown Voltage) | 4.1–5.1 V at 1.0 mA - Confirmed avalanche onset range; ensures reliable triggering during transients |
| PPPM (Peak Pulse Power) | 150 W (10/1000 μs) - Sustains high-energy surges without failure when mounted per recommended pad layout |
| VC (Clamping Voltage) | 7.6 V max at 19.7 A - Limits downstream voltage stress on protected ICs during worst-case surge events |
| ESD Rating | 15 kV (air), 8 kV (contact) - Meets IEC 61000-4-2 system-level ESD immunity requirements |
| Thermal Resistance | RθJA = 250 °C/W - Requires careful PCB copper area planning to maintain TJ ≤ 150 °C under sustained load |
| AEC-Q101 Qualified | Yes - Validated for automotive electronics applications including infotainment and body control modules |
Pinout & Package
Package: MicroSMP - ultra-low-profile surface-mount package (0.091" × 0.055" / 2.30 mm × 1.40 mm, height 0.026" / 0.65 mm), halogen-free, RoHS-compliant, matte tin-plated terminals.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Anode | Current entry terminal during forward conduction | Connected to protected line (e.g., signal or supply rail); not used in normal TVS operation |
| Cathode | Current exit terminal during reverse-biased clamping | Marked by color band; ties to ground or lower-potential reference to shunt surge current |
Key Features
| Feature | Design Value |
|---|---|
| Ultra-low profile (0.65 mm height) | Enables use in space-constrained portable and automotive modules without compromising board stacking height |
| Oxide planar chip junction | Ensures stable, repeatable breakdown characteristics and long-term reliability under repeated surge stress |
| MSL Level 1 (260 °C peak) | Supports standard lead-free reflow without preconditioning or special handling requirements |
| Junction capacitance ~4.5 pF | Minimizes signal distortion on high-speed data lines (e.g., USB, CAN, LIN) up to ~100 MHz |
| Uni-directional polarity only | Optimized for DC-biased rails or unidirectional signal paths; avoids leakage issues in AC-coupled circuits |
Applications
| Automotive Sensor Protection | USB 2.0 Data Line Protection |
|---|---|
Use Scenario: Protecting Hall-effect and temperature sensors in engine control units from load-dump and ISO 7637-2 transients. IC Role / Device Role / Timing Role: Unidirectional TVS placed between sensor output and microcontroller input to clamp surges before they reach ADC or GPIO pins. Use Value: Prevents latch-up or permanent damage to 3.3 V logic interfaces while maintaining < 10 ns response time and minimal signal loading. |
Use Scenario: Safeguarding USB D+ and D− lines against ESD events during hot-plug insertion in infotainment head units. IC Role / Device Role / Timing Role: Low-capacitance TVS connected from each data line to chassis ground, preserving signal integrity at 480 Mbps. Use Value: Delivers 15 kV air-gap ESD protection without degrading eye diagram margin or introducing jitter beyond USB 2.0 spec limits. |
| Industrial PLC I/O Protection | DC-DC Converter Input Protection |
Use Scenario: Shielding digital input channels of programmable logic controllers from field-wiring induced transients in factory automation. IC Role / Device Role / Timing Role: Standoff-rated TVS installed at terminal block entry point to absorb 1 kV/500 A surge pulses per IEC 61000-4-4. Use Value: Maintains functional safety by limiting voltage seen by optocoupler input stage to < 8 V, preventing false triggering or isolation breakdown. |
Use Scenario: Suppressing voltage spikes on 5 V or 12 V input rails of buck converters caused by upstream switch-mode noise or cable inductance. IC Role / Device Role / Timing Role: Unidirectional TVS placed between input capacitor and converter VIN pin to clamp overshoot during load-step transitions. Use Value: Reduces need for oversized input capacitors and prevents overvoltage shutdown of controller ICs like LM5085 or TPS54302. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar transient voltage suppression applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SMAJ3.3A | DO-214AC package (larger footprint, 2.4 mm height), higher RθJA (400 °C/W), same VWM/VBR range | Less suitable for ultra-thin designs; requires larger PCB area and may need thermal relief for high-repetition surges | Preferred where legacy DO-214AC footprint exists or where higher surge repetition tolerance is needed with heatsinking |
| TPSMF3.3A | MicroSMP package, same dimensions, but lower PPPM (100 W), higher VC (8.5 V at 15 A), non-AEC-Q101 | Lacks automotive qualification; acceptable for commercial industrial applications with lower surge severity | Select when cost sensitivity outweighs AEC-Q101 requirement and clamping voltage margin allows ≥ 8.5 V |
Compared with SMAJ3.3A and TPSMF3.3A, the MSP3V3-E3/89A uniquely combines AEC-Q101 qualification, 150 W surge rating, and 0.65 mm profile in MicroSMP-making it optimal for next-gen automotive ECUs and compact industrial sensors where space, reliability, and standardized testing are critical.
Availability
MSP3V3-E3/89A is available at Aetrix Electronics and suitable for automotive sensor interfaces, USB 2.0 data line protection, and industrial PLC I/O requiring stable component supply with full traceability and long-term lifecycle support.
Supply support for MSP3V3-E3/89A includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Vishay General Semiconductor is a global leader in discrete semiconductors, specializing in diodes, rectifiers, TVS devices, and optoelectronics with emphasis on reliability, precision, and application-specific validation.
The MSP3V3-E3/89A belongs to Vishay's TRANSZORB® MicroSMP series, engineered for high-density board-level ESD and surge protection in automotive, industrial, and consumer electronics where low profile and AEC-Q101 compliance are mandatory.
FAQ
What is the maximum clamping voltage of the MSP3V3-E3/89A at its rated peak pulse current?
The MSP3V3-E3/89A has a maximum clamping voltage (VC) of 7.6 V at 19.7 A (10/1000 μs waveform), measured under standard test conditions with 6.0 mm × 6.0 mm copper pads. This value is derived from its specified dynamic resistance (RD = 0.127 Ω) and maximum breakdown voltage (VBR = 5.10 V), ensuring predictable protection behavior for downstream 3.3 V logic circuits. The MSP3V3-E3/89A maintains this clamping performance across its full operating temperature range.
Is the MSP3V3-E3/89A suitable for bidirectional signal line protection?
No-the MSP3V3-E3/89A is strictly unidirectional and must be used only on DC-biased or single-polarity signal paths. Its cathode band indicates polarity, and reverse connection will result in no clamping action during positive transients. For bidirectional protection (e.g., USB D+/D−, RS-485), a dedicated bidirectional TVS such as the SMBJ3.3CA is required. The MSP3V3-E3/89A datasheet explicitly states "Uni-directional polarity only" as a core feature.
Does the MSP3V3-E3/89A meet automotive qualification standards?
Yes-the MSP3V3-E3/89A is AEC-Q101 qualified, confirming its suitability for automotive electronic systems including engine control, body electronics, and ADAS sensor modules. This qualification covers stress tests for temperature cycling, humidity, mechanical shock, and ESD per AEC-Q101-001. The device also meets J-STD-020C MSL Level 1, supporting standard lead-free reflow without moisture sensitivity concerns. The MSP3V3-E3/89A carries this qualification in its HM3 suffix variant; the E3/89A marking confirms commercial-grade MicroSMP packaging with identical electrical specs.
What is the junction capacitance of the MSP3V3-E3/89A and how does it affect high-speed signals?
The MSP3V3-E3/89A exhibits typical junction capacitance of ~4.5 pF at 0 V bias and ~3.5 pF at its 3.3 V stand-off voltage, measured at 1 MHz. This low capacitance minimizes signal attenuation and timing skew on high-speed lines such as USB 2.0 (480 Mbps), CAN FD, and I²C, enabling clean eye diagrams and reliable bit error rate performance. When placed on differential pairs, the matched capacitance across both lines preserves common-mode rejection. The MSP3V3-E3/89A's capacitance is verified in Figure 4 of its official datasheet (Document Number: 88486).
Can the MSP3V3-E3/89A be mounted on the bottom side of a PCB using wave soldering?
No-the MSP3V3-E3/89A is explicitly not recommended for PCB bottom-side wave mounting, as stated in its datasheet's "Features" section. Its MicroSMP package lacks thermal mass and mechanical robustness for direct exposure to wave solder heat profiles, risking delamination or solder joint voiding. Reflow soldering is the only validated assembly method. For bottom-side protection needs, alternative packages such as SMA or SMC should be evaluated. This restriction applies uniformly to all MicroSMP-series devices, including the MSP3V3-E3/89A.
MSP3V3-E3/89A Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Vishay General Semiconductor - Diodes Division
- Package/Case:
- DO-219AD
- Series:
- TransZorb®, eSMP®
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Type:
- Zener
- Unidirectional Channels:
- 1
- Bidirectional Channels:
- -
- Voltage - Reverse Standoff (Typ):
- 3.3V
- Voltage - Breakdown (Min):
- 4.1V
- Voltage - Clamping (Max) @ Ipp:
- 11.5V
- Current - Peak Pulse (10/1000µs):
- 87A (8/20µs)
- Power - Peak Pulse:
- 150W
- Power Line Protection:
- No
- Applications:
- General Purpose
- Capacitance @ Frequency:
- -
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- DO-219AD (MicroSMP)
MSP3V3-E3/89A FAQ
1.How can I place an order for MSP3V3-E3/89A through Aetrix?
Please submit a Request for Quotation (RFQ) for MSP3V3-E3/89A on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MSP3V3-E3/89A reliable?
The price and inventory of MSP3V3-E3/89A are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MSP3V3-E3/89A is usually 5 days.
3.What payment methods are accepted for MSP3V3-E3/89A?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MSP3V3-E3/89A transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MSP3V3-E3/89A?
MSP3V3-E3/89A orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MSP3V3-E3/89A order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MSP3V3-E3/89A?
For technical support, including MSP3V3-E3/89A datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MSP3V3-E3/89A requirements.
6.How does Aetrix verify that MSP3V3-E3/89A is sourced from the original manufacturer or authorized distributors?
All MSP3V3-E3/89A products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MSP3V3-E3/89A meets industry standards.
7.What is the process for return or replacement of MSP3V3-E3/89A?
All MSP3V3-E3/89A units undergo pre-shipment inspection (PSI). If there is an issue with MSP3V3-E3/89A, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MSP3V3-E3/89A part is unused and in its original packaging.
Return procedure for MSP3V3-E3/89A:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MSP3V3-E3/89A Tags

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