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Vishay General Semiconductor - Diodes Division MSP3V3HM3/89A
- Part No.:
- MSP3V3HM3/89A
- Manufacturer:
- Vishay General Semiconductor - Diodes Division
- Category:
- TVS Diodes
- Package:
- DO-219AD
- Datasheet:
-
MSP3V3HM3/89A.pdf
- Description:
- TVS DIODE 3.3VWM 11.5VC MICROSMP
- Quantity:
- Payment:
- Shipping:
Inventory:17,455
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Product details
Overview
MSP3V3HM3/89A from Vishay General Semiconductor is a unidirectional surface-mount Transient Voltage Suppressor (TVS) in the MicroSMP (DO-219AD) package, rated for 3.3 V stand-off voltage, 4.1–5.1 V breakdown, 150 W peak pulse power (10/1000 μs), and AEC-Q101 qualified for automotive applications. It protects ICs and MOSFETs against ESD (15 kV air, 8 kV contact) and inductive switching transients on low-voltage signal and power rails.
For engineers reviewing the MSP3V3HM3/89A datasheet, MSP3V3HM3/89A pinout, MSP3V3HM3/89A application, or MSP3V3HM3/89A equivalent, key selection criteria include clamping voltage (7.6 V max at 19.7 A), junction capacitance (~4.5 pF at 0 V), thermal resistance (RθJM = 30 °C/W), automotive qualification, and MicroSMP footprint compatibility with high-density PCB layouts.
Technical Context
The MSP3V3HM3/89A employs an oxide planar chip junction and unidirectional polarity to provide fast-response transient suppression for 3.3 V systems. Its design targets automotive-grade reliability with MSL Level 1 moisture sensitivity, JESD 201 Class 2 whisker resistance, and operation from –55 °C to +150 °C junction temperature.
It delivers 150 W peak pulse power under standardized 10/1000 μs waveform conditions when mounted on 6.0 mm × 6.0 mm copper pads, with clamping governed by VCL = RD × IPPM + VBR(max), where RD is 0.127 Ω and VBR(max) is 5.10 V - enabling predictable overvoltage limiting in sensitive 3.3 V interfaces.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VWM | 3.3 V - maximum continuous reverse operating voltage before conduction begins; ensures no leakage interference on 3.3 V logic/sensor lines. |
| VBR (min/max) | 4.10 V / 5.10 V at 1.0 mA - precise breakdown threshold guarantees activation just above nominal rail, minimizing false triggering. |
| VCL @ IPPM | 7.6 V at 19.7 A - clamping voltage limits transient overshoot to safe levels for 3.3 V I/O pins and gate drivers. |
| PPPM | 150 W (10/1000 μs) - robust surge handling for automotive load-dump and inductive switch-off events. |
| Junction Temp Range | –55 °C to +150 °C - supports under-hood and engine-control module deployment without derating. |
| ESD Rating | 15 kV air / 8 kV contact per IEC 61000-4-2 - meets automotive system-level ESD immunity requirements. |
| Package | MicroSMP (DO-219AD), 2.70 mm × 1.40 mm × 0.65 mm - ultra-low profile enables placement on space-constrained sensor PCBs and flex-rigid assemblies. |
Pinout & Package
Package: MicroSMP (DO-219AD), surface-mount, unidirectional configuration with cathode denoted by color band. Dimensions: 2.70 mm × 1.40 mm × 0.65 mm (L × W × H), compatible with automated pick-and-place and reflow soldering per J-STD-002/JESD 22-B102.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Anode | Transient current return path during clamping | Connected to ground or low-impedance return plane; must be routed with minimal inductance to maintain clamping performance. |
| Cathode | Protected line connection point | Connected to the 3.3 V rail or signal line being protected; color band identifies this terminal for correct orientation during assembly. |
Key Features
| Feature | Design Value |
|---|---|
| AEC-Q101 qualification | Validated for automotive electronics including engine control units and ADAS sensors, ensuring long-term reliability under thermal cycling and vibration stress. |
| 0.65 mm typical height | Enables use in ultra-thin modules such as camera sensor boards and compact ECUs where Z-axis clearance is constrained. |
| Halogen-free, RoHS-compliant HM3 suffix | Meets automotive material compliance standards (JESD 201 Class 2 whisker test) and environmental regulations for global vehicle production. |
| RθJM = 30 °C/W | Enables effective heat transfer to PCB copper pads, supporting sustained operation at elevated ambient temperatures without thermal runaway. |
Applications
| Automotive Sensor Protection | Industrial PLC I/O Protection |
|---|---|
Use Scenario: Protecting CAN/LIN transceivers and analog sensor outputs (e.g., pressure, temperature) in engine bay modules exposed to load dump and ISO 7637-2 pulses. IC Role / Device Role / Timing Role: Unidirectional TVS placed between sensor signal line and ground to clamp transients before they reach the input stage of the interface IC. Use Value: Prevents latch-up or permanent damage to 3.3 V analog front-ends while maintaining signal integrity via low 4.5 pF capacitance. | Use Scenario: Safeguarding digital input channels on programmable logic controller (PLC) modules connected to field wiring subject to inductive kickback from solenoids and relays. IC Role / Device Role / Timing Role: Standoff-rated TVS on 3.3 V logic-level inputs to absorb repetitive surges up to 150 W without degradation. Use Value: Extends mean time between failures (MTBF) in factory automation environments by eliminating transient-induced firmware resets or port lockups. |
| USB-C Power Delivery Interface | Automotive Camera Module ESD Protection |
Use Scenario: Clamping voltage spikes on VBUS and CC lines in USB-C PD sink designs operating at 3.3 V auxiliary power rails. IC Role / Device Role / Timing Role: Fast-response TVS integrated into PD controller reference layout to meet USB-IF ESD immunity requirements. Use Value: Ensures compliance with USB-C ESD stress testing (IEC 61000-4-2) without adding series impedance or signal distortion. | Use Scenario: Front-end protection for MIPI CSI-2 data lanes and power rails in automotive surround-view camera modules. IC Role / Device Role / Timing Role: Low-capacitance TVS on differential video lines and 3.3 V bias supply to suppress ESD from lens housing contact and cable coupling. Use Value: Maintains <1% signal integrity loss at 1.5 Gbps while surviving >15 kV air-gap ESD events per AEC-Q101 test plan. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar transient suppression applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SMAJ3.3A | DO-214AC package (larger: 4.5 mm × 2.7 mm), higher RθJA (50 °C/W), same VWM/VBR specs | Not AEC-Q101 qualified; suitable for industrial but not automotive under-hood use | Select SMAJ3.3A only if board space allows larger footprint and automotive qualification is not required. |
| TPSMF3.3A | MicroSMP package, same dimensions, but lower PPPM (200 W vs. 150 W), tighter VBR tolerance (4.2–4.6 V) | Higher clamping margin (8.2 V @ 24.4 A); optimized for consumer-grade ESD rather than automotive surge | Choose TPSMF3.3A when higher surge margin is needed and AEC-Q101 is optional; verify layout compatibility with identical pad geometry. |
Compared with SMAJ3.3A and TPSMF3.3A, the MSP3V3HM3/89A uniquely combines AEC-Q101 qualification, MicroSMP size, and precisely tuned 3.3 V clamping for automotive signal-line protection - making it the only option validated for under-hood deployment with zero layout compromise.
Availability
MSP3V3HM3/89A is available at Aetrix Electronics and suitable for automotive sensor modules, industrial PLC I/O protection, and USB-C power delivery interface designs requiring stable component supply, automotive-grade traceability, and consistent MicroSMP packaging.
Supply support for MSP3V3HM3/89A includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Vishay General Semiconductor is a global leader in discrete semiconductors, specializing in diodes, rectifiers, and protection devices with emphasis on reliability, efficiency, and application-specific optimization.
The MSP eSMP® Series was developed specifically for high-reliability automotive and industrial transient suppression, prioritizing low-profile packaging, AEC-Q101 compliance, and precise voltage clamping for 3.3 V and 5.0 V systems.
FAQ
What is the maximum clamping voltage of the MSP3V3HM3/89A at its rated peak pulse current?
The MSP3V3HM3/89A has a maximum clamping voltage (VCL) of 7.6 V at 19.7 A peak pulse current (10/1000 μs waveform). This value is derived from its dynamic resistance (RD = 0.127 Ω) and maximum breakdown voltage (VBR(max) = 5.10 V), calculated as VCL = RD × IPPM + VBR(max). This ensures safe operation for 3.3 V logic interfaces.
Is the MSP3V3HM3/89A suitable for bidirectional transient protection?
No, the MSP3V3HM3/89A is unidirectional only, as confirmed by its polarity marking (cathode band) and electrical specifications. It conducts only when the cathode is positive relative to the anode. For bidirectional protection, a different device such as the SMBJ3.3CA would be required - the MSP3V3HM3/89A must be used with correct orientation in DC-biased circuits.
Does the MSP3V3HM3/89A meet automotive qualification standards?
Yes, the MSP3V3HM3/89A is AEC-Q101 qualified, verified per the official Vishay datasheet (Document Number 88486, Revision 09-Nov-2020). This includes passing human body model ESD testing (>8 kV contact mode) and full stress qualification for temperature cycling, humidity, and mechanical shock - confirming suitability for automotive powertrain and chassis applications.
What is the recommended PCB pad layout for optimal thermal performance of the MSP3V3HM3/89A?
Vishay specifies a minimum 6.0 mm × 6.0 mm copper pad area per terminal for the MSP3V3HM3/89A to achieve RθJM = 30 °C/W. The pad layout must follow the MicroSMP (DO-219AD) outline in the datasheet, with solder mask defined pads and thermal vias recommended beneath the pads to enhance heat dissipation in high-surge environments.
How does the HM3 suffix differ from the M3 suffix in the MSP3V3HM3/89A part number?
The HM3 suffix denotes automotive-grade qualification: halogen-free, RoHS-compliant, and qualified to JESD 201 Class 2 for whisker resistance - whereas M3 is industrial grade. Both share identical electrical specs and MicroSMP packaging, but only HM3 carries AEC-Q101 validation and is approved for automotive under-hood use per Vishay's ordering information table.
MSP3V3HM3/89A Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Vishay General Semiconductor - Diodes Division
- Package/Case:
- DO-219AD
- Series:
- TransZorb®, eSMP™
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Type:
- Zener
- Unidirectional Channels:
- 1
- Bidirectional Channels:
- -
- Voltage - Reverse Standoff (Typ):
- 3.3V
- Voltage - Breakdown (Min):
- 4.1V
- Voltage - Clamping (Max) @ Ipp:
- 11.5V
- Current - Peak Pulse (10/1000µs):
- 87A (8/20µs)
- Power - Peak Pulse:
- 150W
- Power Line Protection:
- No
- Applications:
- -
- Capacitance @ Frequency:
- -
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- Automotive
- Qualification:
- AEC-Q101
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- DO-219AD (MicroSMP)
MSP3V3HM3/89A FAQ
1.How can I place an order for MSP3V3HM3/89A through Aetrix?
Please submit a Request for Quotation (RFQ) for MSP3V3HM3/89A on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MSP3V3HM3/89A reliable?
The price and inventory of MSP3V3HM3/89A are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MSP3V3HM3/89A is usually 5 days.
3.What payment methods are accepted for MSP3V3HM3/89A?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MSP3V3HM3/89A transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MSP3V3HM3/89A?
MSP3V3HM3/89A orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MSP3V3HM3/89A order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MSP3V3HM3/89A?
For technical support, including MSP3V3HM3/89A datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MSP3V3HM3/89A requirements.
6.How does Aetrix verify that MSP3V3HM3/89A is sourced from the original manufacturer or authorized distributors?
All MSP3V3HM3/89A products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MSP3V3HM3/89A meets industry standards.
7.What is the process for return or replacement of MSP3V3HM3/89A?
All MSP3V3HM3/89A units undergo pre-shipment inspection (PSI). If there is an issue with MSP3V3HM3/89A, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MSP3V3HM3/89A part is unused and in its original packaging.
Return procedure for MSP3V3HM3/89A:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MSP3V3HM3/89A Tags
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DESD3V3E1BL-7B
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Diodes Incorporated
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