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NXP Semiconductors MVR5510AMBALES
- Part No.:
- MVR5510AMBALES
- Manufacturer:
- NXP Semiconductors
- Category:
- Power Management - Specialized
- Package:
- 56-VFQFN Exposed Pad
- Datasheet:
-
MVR5510AMBALES.pdf
- Description:
- SAFETY POWER MANAGEMENT IC, QFN5
- Quantity:
- Payment:
- Shipping:
Inventory:3,742
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Product details
Overview
MVR5510AMBALES from NXP Semiconductors is an automotive-grade multi-output power management IC (PMIC) designed for S32G3/LPDDR4-based domain controllers and telematics systems. It integrates a 60 V synchronous buck controller (VPRE), three low-voltage synchronous buck converters (BUCK1–BUCK3), one boost converter, three LDOs, and a high-voltage LDO (HVLDO), all supporting ASIL B safety compliance per ISO 26262 and AEC-Q100 Grade 1 qualification.
For engineers reviewing the MVR5510AMBALES datasheet, MVR5510AMBALES pinout, MVR5510AMBALES application, or MVR5510AMBALES equivalent, this device delivers configurable rail sequencing, I²C-controlled operation with CRC, fail-safe outputs (FS0B), and EMC-optimized frequency synchronization - critical for gateway and V2X system power architecture validation.
Technical Context
The MVR5510AMBALES implements dual independent state machines: a Main state machine managing power-up sequencing, standby/deep-sleep transitions, and regulator enable/disable timing; and a Fail-Safe state machine monitoring voltage supervision (VMON1–VMON4), thermal shutdown (TSD), and fault collection via FCCU1/2 inputs. Its OTP-programmable configuration enables custom power-up slots, VPRE auto-on behavior, and STBY entry conditions.
It supports dual-phase operation on BUCK1/BUCK2 for up to 7.2 A peak MCU core supply, spread-spectrum and manual frequency tuning for EMI reduction, and external MOSFET control for VPRE (up to 10 A). The HVLDO operates in both LDO mode (10 mA) and switch mode (100 mA), while quiescent current drops to 35 µA in standby with VPRE and HVLDO active.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Input Voltage Range | VSUP1/2: 4.7 V to 36 V continuous (60 V max transient); supports 12 V and 24 V automotive battery systems with load dump resilience. |
| Output Rails | 1x VPRE controller (external FETs), 3x integrated synchronous bucks (BUCK1–BUCK3), 1x boost, 3x LDOs, 1x HVLDO - enabling full SoC power tree for S32G3. |
| ASIL Level | ASIL B compliant per ISO 26262; includes dedicated fail-safe output (FS0B), built-in self-test (BIST), and FCCU interface for MCU-level fault reporting. |
| Control Interface | I²C up to 3.4 MHz with CRC protection; supports OTP programming for fixed configurations and engineering-mode customization. |
| Thermal Rating | Junction temperature range: –40 °C to +150 °C; RθJA = 17 °C/W on 2s8p board - validated for under-hood deployment in domain controllers. |
| Package | 8 mm × 8 mm, 56-pin QFN with exposed pad (wettable flank for ES suffix); MSL3, AEC-Q100 qualified. |
| Quiescent Current | 35 µA in standby mode (VPRE + HVLDO active); enables always-on functionality in low-power telematics wake-up paths. |
Pinout & Package
Package: 8 mm × 8 mm, 56-pin QFN-EP (exposed pad), wettable flank (ES suffix), RoHS-compliant, AEC-Q100 Grade 1 qualified.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| PWRON1 / PWRON2 | Power Enable Inputs | Asynchronous wake-up triggers; PWRON1 initiates main power-up, PWRON2 enables deep-sleep exit or OFF-mode entry. |
| STBY | Standby Control Input | Edge-triggered entry into standby mode; requires synchronized I²C command for safe rail discharge before transition. |
| PGOOD / RSTB / FS0B | Power Status Outputs | PGOOD indicates all rails in regulation; RSTB (active-low) resets MCU; FS0B (open-drain, active-low) signals fail-safe condition per ASIL B requirements. |
| VDDIO | Digital Interface Supply | 1.75–3.4 V input powering I²C, INTB, FIN/FOUT - decoupled separately to ensure noise-immune communication. |
| VCOREMON | Core Voltage Monitor Input | Must connect to BUCK1 output (or BUCK1/2 dual-phase node) for accurate SVS/DVS feedback to safety logic. |
| FCCU1/WDI / FCCU2 | Fault Collection Unit Inputs | Accept watchdog timeout and fault signals from MCU; enable bidirectional safety monitoring between PMIC and host processor. |
| VMON1–VMON4 | External Voltage Monitoring Inputs | Four analog inputs for supervising external rail voltages (e.g., DDR, IO, analog supplies); feed into ABIST and fail-safe decision logic. |
Key Features
| Feature | Design Value |
|---|---|
| Configurable Power-Up Sequencing | OTP-programmable slot-based startup order for all 9 regulators - ensures correct SoC boot sequence for S32G3/LPDDR4 platforms. |
| Dual-Phase BUCK1/BUCK2 Operation | Extends peak current capability to 7.2 A for MCU core supply while reducing ripple and thermal stress vs. single-phase implementation. |
| EMC-Optimized Switching | Frequency synchronization (FIN/FOUT), spread spectrum, slew rate control, and manual tuning - reduces conducted emissions in dense ECU layouts. |
| HVLDO Dual-Mode Operation | Switches between 10 mA LDO mode (low-noise analog supply) and 100 mA switch mode (higher efficiency for always-on functions). |
| Fail-Safe State Machine | Independent logic block with dedicated FS0B output, ABIST, and FCCU interface - meets ASIL B diagnostic coverage requirements without MCU dependency. |
| Low-Power Standby Mode | 35 µA IQ with VPRE and HVLDO active - sustains CAN transceiver bias and real-time clock while disabling all other rails for telematics sleep states. |
Applications
| Automotive Gateway | In-Vehicle Network Controller |
|---|---|
|
Use Scenario: Centralized vehicle communication hub aggregating CAN FD, Ethernet, and LIN traffic between domains. IC Role / Device Role / Timing Role: Primary power source for S32G3 processor, LPDDR4 memory, and PHY interfaces - delivering sequenced 1.0 V (core), 1.1 V (DDR), 3.3 V (IO), and 5 V (PHY bias). Use Value: ASIL B safety support enables functional safety partitioning; VPRE controller powers external PMICs for secondary domains without adding complexity. |
Use Scenario: Zonal controller managing sensor fusion, OTA updates, and secure V2X message routing. IC Role / Device Role / Timing Role: Supplies multiple voltage rails to S32G3 compute cluster and cryptographic accelerator - with BUCK1/2 dual-phase ensuring stable core voltage during burst processing. Use Value: 35 µA standby current enables always-on network presence; I²C CRC prevents configuration corruption during firmware updates. |
| Telematics Control Unit (TCU) | V2X Communication Module |
|
Use Scenario: Cellular-connected module handling GNSS, eCall, and remote diagnostics in parked/ignition-off states. IC Role / Device Role / Timing Role: Powers LTE modem, GNSS receiver, and secure element - using HVLDO in switch mode for 100 mA always-on supply and LDOs for low-noise RF bias. Use Value: Deep-sleep mode (15 µA) extends battery life during extended parking; PWRON2-triggered wake-up enables rapid LTE reconnection. |
Use Scenario: DSRC/C-V2X roadside unit or OBU performing low-latency vehicle-to-infrastructure handshaking. IC Role / Device Role / Timing Role: Delivers tightly regulated 1.8 V (PCIe), 3.3 V (CAN transceiver), and 5 V (RF front-end) with <100 mV discharge tolerance during STBY entry. Use Value: Fail-safe output (FS0B) asserts on VMON or TSD fault - triggering immediate isolation of V2X radio to prevent unsafe broadcast. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar multi-output PMIC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MVR5510AMDALES | ASIL D certified; adds enhanced monitoring (dual ABIST), extended FCCU coverage, and mandatory fail-safe arbitration logic. | Required for safety-critical gateway functions where ASIL D decomposition applies (e.g., autonomous driving data aggregation). | Select when full ASIL D decomposition is mandated; not drop-in due to stricter fault response timing and OTP configuration differences. |
| MVR5510AMMALES | QM (non-safety) version; lacks FS0B, ABIST, FCCU interface, and fail-safe state machine - reduced test overhead and cost. | Suitable for non-safety industrial or prototyping use cases where S32G3 is used without ISO 26262 compliance requirements. | Choose for cost-sensitive development or non-automotive applications; requires redesign of safety-critical monitoring externally. |
Compared with MVR5510AMBALES, MVR5510AMDALES provides higher diagnostic coverage for ASIL D decomposition but increases design complexity and cost, while MVR5510AMMALES removes safety infrastructure entirely - making it viable only where functional safety is not required.
Availability
MVR5510AMBALES is available at Aetrix Electronics and suitable for automotive gateway, domain controller, and telematics applications requiring stable component supply, ASIL B compliance, and long-term automotive lifecycle support.
Supply support for MVR5510AMBALES includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company specializing in secure connectivity solutions for automotive, industrial, and IoT markets, with leadership in radar, V2X, and automotive processors.
The VR5510 product line targets next-generation automotive domain controllers and gateways, delivering scalable safety (QM to ASIL D), configurable multi-rail power, and robust EMC performance for S32G-family SoCs.
FAQ
What safety standard does MVR5510AMBALES comply with?
MVR5510AMBALES complies with ISO 26262 up to ASIL B and is qualified per AEC-Q100 Grade 1 (–40 °C to +125 °C ambient). It includes fail-safe outputs (FS0B), built-in self-test (ABIST/LBIST), FCCU interface, and dedicated monitoring circuitry - all verified for ASIL B diagnostic coverage in automotive safety plans.
Does MVR5510AMBALES support dual-phase operation for MCU core supply?
Yes, MVR5510AMBALES supports dual-phase operation across BUCK1 and BUCK2, enabling up to 7.2 A peak current for S32G3 MCU core supply. This configuration reduces output ripple, improves transient response, and lowers thermal stress compared to single-phase operation - confirmed in Section 3 Features and Figure 1 application diagram.
How is the power-up sequence configured on MVR5510AMBALES?
The power-up sequence of MVR5510AMBALES is configured via one-time programmable (OTP) memory, defining slot-based activation order for all nine regulators. OTP programming occurs during engineering validation using BAL Report files, and the sequence is fixed post-programming - ensuring repeatable, deterministic boot behavior for S32G3/LPDDR4 platforms.
What is the quiescent current of MVR5510AMBALES in standby mode?
MVR5510AMBALES draws 35 µA typical quiescent current in standby mode with VPRE and HVLDO enabled, as specified in Table 4 (Electrical Characteristics). This ultra-low IQ enables always-on functionality in telematics and V2X modules while maintaining ASIL B safety readiness.
Can MVR5510AMBALES drive external MOSFETs for high-voltage conversion?
Yes, MVR5510AMBALES includes the VPRE synchronous buck controller with dedicated gate drivers (PRE_GHS, PRE_GLS), bootstrap (PRE_BOOT), and current sense (PRE_CSP) pins - enabling direct control of external high-side and low-side MOSFETs for up to 10 A output at up to 60 V input, as detailed in Section 3 and Figure 2 internal block diagram.
MVR5510AMBALES Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 56-VFQFN Exposed Pad
- Packaging:
- Tray
- Product Status:
- Active
- Applications:
- -
- Current - Supply:
- 15mA
- Voltage - Supply:
- 60V
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount, Wettable Flank
- Supplier Device Package:
- 56-HVQFN (8x8)
MVR5510AMBALES FAQ
1.How can I place an order for MVR5510AMBALES through Aetrix?
Please submit a Request for Quotation (RFQ) for MVR5510AMBALES on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MVR5510AMBALES reliable?
The price and inventory of MVR5510AMBALES are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MVR5510AMBALES is usually 5 days.
3.What payment methods are accepted for MVR5510AMBALES?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MVR5510AMBALES transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MVR5510AMBALES?
MVR5510AMBALES orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MVR5510AMBALES order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MVR5510AMBALES?
For technical support, including MVR5510AMBALES datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MVR5510AMBALES requirements.
6.How does Aetrix verify that MVR5510AMBALES is sourced from the original manufacturer or authorized distributors?
All MVR5510AMBALES products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MVR5510AMBALES meets industry standards.
7.What is the process for return or replacement of MVR5510AMBALES?
All MVR5510AMBALES units undergo pre-shipment inspection (PSI). If there is an issue with MVR5510AMBALES, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MVR5510AMBALES part is unused and in its original packaging.
Return procedure for MVR5510AMBALES:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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