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NXP Semiconductors MVR5510AMBANES
- Part No.:
- MVR5510AMBANES
- Manufacturer:
- NXP Semiconductors
- Category:
- Power Management - Specialized
- Package:
- 56-VFQFN Exposed Pad
- Datasheet:
-
MVR5510AMBANES.pdf
- Description:
- SAFETY POWER MANAGEMENT IC, QFN5
- Quantity:
- Payment:
- Shipping:
Inventory:3,479
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Product details
Overview
MVR5510AMBANES from NXP Semiconductors is an automotive-grade multi-output power management IC (PMIC) designed for S32G3/DDR3L-based domain controllers and telematics systems. It integrates a 60 V synchronous buck controller (VPRE), three low-voltage synchronous buck converters (BUCK1–BUCK3), one boost converter, three LDOs, and a high-voltage LDO (HVLDO). It delivers ASIL B safety compliance per ISO 26262 and supports fail-safe outputs for vehicle-to-x (V2X) gateway applications.
For engineers reviewing the MVR5510AMBANES datasheet, MVR5510AMBANES pinout, MVR5510AMBANES application, or MVR5510AMBANES equivalent, key selection criteria include its OTP-configurable power-up sequencing for S32G3, dual-phase BUCK1/2 operation up to 7.2 A peak, 35 μA standby current with VPRE and HVLDO active, and I²C-controlled fail-safe state machine with CRC-protected interface.
Technical Context
The MVR5510AMBANES implements two independent state machines: a Main state machine managing power sequencing, standby/deep-sleep entry, and regulator control; and a Fail-Safe (FS) state machine handling safety monitoring, ABIST, watchdog windowing, FCCU inputs, and fail-safe output (FS0B) assertion. Its architecture supports configurable OTP-based startup order, voltage supervision across six monitoring inputs (VMON1–VMON4, VCOREMON, VBOS), and synchronized switching via FIN/FOUT pins to reduce system EMI.
It features dedicated hardware-level safety mechanisms including built-in self-test (ABIST/LBIST), fail-safe output driver, STBY-safe discharge logic, and dual-device synchronization via PSYNC. The device operates across –40 °C to 125 °C ambient, qualified to AEC-Q100 Grade 1, and supports deep fail-safe recovery with auto-retry timeout (4 s or 100 ms) and configurable retry count (1–15 or infinite).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Input Voltage Range | VSUP1/2: 4.7 V to 36 V continuous (60 V max transient); supports 12 V and 24 V automotive battery systems with load dump resilience. |
| Standby Quiescent Current | 35 μA typical at Tj = 25 °C with VPRE and HVLDO enabled - enables always-on functionality in low-power gateway wake-up paths. |
| Output Rails | 1x VPRE controller (external MOSFETs), 3x integrated synchronous bucks (BUCK1–BUCK3), 1x boost, 3x LDOs (LDO1–LDO3), 1x HVLDO - covers full MCU core, DDR, IO, analog, and CAN PHY supply needs. |
| Safety Certification | ASIL B compliant per ISO 26262; includes fail-safe output FS0B, dedicated FCCU1/2 monitoring inputs, and ABIST/LBIST for diagnostic coverage. |
| Interface | I²C up to 3.4 MHz with CRC protection; supports OTP programming, real-time register access, and fail-safe command arbitration. |
| Package | 8 mm × 8 mm, 56-pin QFN-EP with wettable flank (ES suffix); RθJA = 17 °C/W on 2s8p board - optimized for automotive thermal cycling and solder joint reliability. |
Pinout & Package
Package: 8 mm × 8 mm, 56-pin QFN with exposed thermal pad (EP), step-cut wettable flank (ES variant), RoHS-compliant, MSL3 per J-STD-020.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| PWRON1 / PWRON2 | Power enable inputs | Asynchronous wake-up triggers; support dual-source power-on (e.g., ignition + CAN bus activity) with configurable gate enable OTP. |
| VPRE_FB / PRE_SW / PRE_GHS / PRE_GLS | VPRE controller interface | Feedback, switching node, and high-/low-side gate drive outputs - enables external 60 V buck stage for pre-regulation of MCU core supplies. |
| BUCK1_IN / BUCK1_SW / BUCK1_FB | Core buck converter interface | Input, switch node, and feedback for primary MCU core rail; supports dual-phase operation with BUCK2 for up to 7.2 A peak current. |
| LDO1 / LDO2 / LDO3 | Linear regulator outputs | Configurable 1.8 V / 3.3 V / 1.1 V outputs for DDR, MCU IO, and ADC supplies; each rated up to 400 mA with tight load regulation. |
| FS0B | Fail-safe output | Open-drain active-low signal asserting MCU reset or system shutdown upon detected fault (TSD, OV, UV, ABIST failure). |
| VCOREMON | Core voltage monitor input | Mandatory connection to BUCK1 output (or BUCK1/2 combined node) for accurate core voltage supervision and fail-safe triggering. |
Key Features
| Feature | Design Value |
|---|---|
| Configurable Power-Up Sequencing | OTP-programmable startup order across all rails - ensures correct S32G3/DDR3L initialization without external sequencer logic. |
| Dual-Phase BUCK1/2 Operation | Enables 7.2 A peak current delivery to MCU core with interleaved switching - reduces input/output ripple and eases thermal design vs. single-phase 3.6 A solution. |
| EMC Optimization | Frequency synchronization (FIN/FOUT), spread spectrum, slew rate control, and manual tuning - meets Class A conducted immunity per IEC 62132-4 and emissions per IEC 61967-4. |
| HVLDO Dual-Mode Operation | Switch-mode (100 mA) or LDO-mode (10 mA) selectable via OTP - balances efficiency and noise for always-on sensor or CAN transceiver biasing. |
| Fail-Safe State Machine | Dedicated hardware FSM with ABIST, watchdog windowing, FCCU inputs, and FS0B output - provides autonomous safety response without MCU intervention. |
Applications
| Automotive Gateway | In-Vehicle Network Controller |
|---|---|
Use Scenario: Centralized communication hub aggregating CAN FD, Ethernet, and LIN traffic between ADAS ECUs and cloud interfaces. IC Role / Device Role / Timing Role: Primary PMIC supplying S32G3 processor core (VDD_CORE), DDR3L memory (VDD_DDR_IO), and CAN PHY (VDD_3P3_LP) with precise sequencing and fail-safe monitoring. Use Value: Enables ASIL B-compliant power domain partitioning and eliminates need for discrete supervisors or sequencers in gateway BOM. | Use Scenario: Domain controller managing body electronics, lighting, and HVAC via multiple CAN clusters and local microcontrollers. IC Role / Device Role / Timing Role: Multi-rail power source delivering 1.1 V (LDO3), 1.8 V (LDO1), and 3.3 V (LDO2) to mixed-signal peripherals while maintaining <100 mV discharge during STBY entry. Use Value: Reduces system standby current to ≤35 μA with VPRE+HVLDO active - extends battery life during parking mode without sacrificing wake-up responsiveness. |
| Telematics Control Unit (TCU) | V2X Communication Module |
Use Scenario: Cellular-connected module enabling OTA updates, remote diagnostics, and fleet management in commercial vehicles. IC Role / Device Role / Timing Role: Power manager for S32G3 host MCU and LTE modem, providing 5 V VPRE pre-regulation and 3.3 V BOOST for RF front-end biasing. Use Value: Supports 60 V load dump survival and 48 V jump-start validation - ensures uninterrupted operation during harsh automotive electrical events. | Use Scenario: DSRC or C-V2X module transmitting real-time traffic, hazard, and cooperative awareness messages to nearby vehicles and infrastructure. IC Role / Device Role / Timing Role: Safety-critical power subsystem with fail-safe output (FS0B) tied to V2X application processor reset, monitored by FCCU1/2 for fault collection. Use Value: Achieves ISO 26262 ASIL B compliance through hardware ABIST, dual watchdog windows, and independent FS state machine - required for functional safety certification. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar multi-output PMIC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MPQ4436-AEC1 | Single 60 V buck with 3.5 A output; no integrated LDOs, no fail-safe outputs, no I²C interface. | Targeted at non-safety MCU pre-regulation only; lacks ASIL support, sequencing, or multi-rail integration. | Select when only high-voltage buck conversion is needed and safety certification is not required. |
| TPS659422-Q1 | 12-channel PMIC with 4 bucks + 8 LDOs; supports ASIL B but uses SPI instead of I²C; no VPRE controller; different OTP architecture. | Designed for Jacinto 7 processors; optimized for vision/AI workloads, not S32G3/DDR3L memory interface. | Choose for TI ecosystem designs requiring higher channel count but lower voltage input range (max 5.5 V). |
Compared with MPQ4436-AEC1 and TPS659422-Q1, the MVR5510AMBANES uniquely combines 60 V VPRE controller capability, ASIL B-certified fail-safe logic, S32G3-specific OTP configuration (BAN report), and integrated DDR3L-compatible LDOs - making it the only drop-in power solution for NXP S32G3 domain controllers requiring automotive safety and memory interface compliance.
Availability
MVR5510AMBANES is available at Aetrix Electronics and suitable for automotive gateway, telematics control unit, and V2X communication module designs requiring stable component supply, long-term lifecycle support, and AEC-Q100 Grade 1 qualification.
Supply support for MVR5510AMBANES includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with leadership in radar, V2X, and automotive processors.
The VR5510 product line is engineered specifically for next-generation automotive domain controllers and vehicle-to-everything (V2X) systems, delivering integrated power management with functional safety, high-voltage resilience, and processor-specific OTP configurations.
FAQ
What safety level does the MVR5510AMBANES support, and how is it implemented?
The MVR5510AMBANES supports ASIL B per ISO 26262. It achieves this through a dedicated Fail-Safe state machine with ABIST/LBIST, FCCU1/2 fault monitoring inputs, fail-safe output FS0B, and hardware-enforced power-down sequences. Its OTP configuration (BAN report) is validated for S32G3/DDR3L systems, and it is qualified to AEC-Q100 Grade 1. The MVR5510AMBANES does not support ASIL D - that requires variants like MVR5510AMDAHES.
How does the MVR5510AMBANES handle power sequencing for S32G3/DDR3L systems?
The MVR5510AMBANES uses one-time programmable (OTP) memory to configure precise power-up and power-down sequences tailored to S32G3/DDR3L requirements. The BAN Report defines startup order, timing delays, and rail dependencies - for example, enabling VPRE first, then BUCK1 for VDD_CORE, followed by LDO2 for VDD_3P3 and LDO3 for 1.1 V DDR termination. This eliminates external sequencing ICs and ensures robust boot reliability.
What is the role of the VPRE controller in the MVR5510AMBANES, and what external components are required?
The VPRE controller in the MVR5510AMBANES is a 60 V synchronous buck controller driving external high-side and low-side MOSFETs to generate a pre-regulated voltage (e.g., 5 V) for downstream converters. Required external components include bootstrap capacitor (PRE_BOOT), compensation network (PRE_COMP), current sense resistor (PRE_CSP), and gate drivers (PRE_GHS/PRE_GLS). The MVR5510AMBANES does not integrate power FETs for VPRE - they must be selected per application voltage/current needs.
Can the MVR5510AMBANES operate in deep sleep mode, and what rails remain active?
Yes, the MVR5510AMBANES supports Deep Sleep Mode (DSM) entered via PWRON2 pin toggle or I²C command. In DSM, only the HVLDO remains active - delivering up to 100 mA in switch mode or 10 mA in LDO mode - while all SMPS and other LDOs are disabled. Quiescent current drops to 15–25 μA, enabling ultra-low-power wake-up capability for telematics and V2X modules during vehicle parking.
Does the MVR5510AMBANES support frequency synchronization, and how is it configured?
Yes, the MVR5510AMBANES supports bidirectional frequency synchronization via FIN (input) and FOUT/AMUX (output) pins. It allows alignment of switching frequencies across multiple VR5510 devices or with external clocks to minimize beat frequencies and improve EMC performance. Configuration is done via OTP or real-time I²C register writes to enable/disable sync, select master/slave mode, and adjust phase offset - critical for multi-PMIC gateway designs.
MVR5510AMBANES Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 56-VFQFN Exposed Pad
- Packaging:
- Tray
- Product Status:
- Active
- Applications:
- -
- Current - Supply:
- 15mA
- Voltage - Supply:
- 60V
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount, Wettable Flank
- Supplier Device Package:
- 56-HVQFN (8x8)
MVR5510AMBANES FAQ
1.How can I place an order for MVR5510AMBANES through Aetrix?
Please submit a Request for Quotation (RFQ) for MVR5510AMBANES on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MVR5510AMBANES reliable?
The price and inventory of MVR5510AMBANES are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MVR5510AMBANES is usually 5 days.
3.What payment methods are accepted for MVR5510AMBANES?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MVR5510AMBANES transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MVR5510AMBANES?
MVR5510AMBANES orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MVR5510AMBANES order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MVR5510AMBANES?
For technical support, including MVR5510AMBANES datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MVR5510AMBANES requirements.
6.How does Aetrix verify that MVR5510AMBANES is sourced from the original manufacturer or authorized distributors?
All MVR5510AMBANES products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MVR5510AMBANES meets industry standards.
7.What is the process for return or replacement of MVR5510AMBANES?
All MVR5510AMBANES units undergo pre-shipment inspection (PSI). If there is an issue with MVR5510AMBANES, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MVR5510AMBANES part is unused and in its original packaging.
Return procedure for MVR5510AMBANES:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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