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NXP Semiconductors MVR5510AMBANESR2
- Part No.:
- MVR5510AMBANESR2
- Manufacturer:
- NXP Semiconductors
- Category:
- Power Management - Specialized
- Package:
- 56-VFQFN Exposed Pad
- Datasheet:
-
MVR5510AMBANESR2.pdf
- Description:
- SAFETY POWER MANAGEMENT IC, QFN5
- Quantity:
- Payment:
- Shipping:
Inventory:1,509
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Product details
Overview
MVR5510AMBANESR2 from NXP Semiconductors is an automotive-grade multi-output power management IC designed for domain controllers and telematics systems. It integrates a 60 V synchronous buck controller (VPRE), three low-voltage synchronous buck converters (BUCK1–BUCK3), one boost converter, three LDOs, and a high-voltage LDO (HVLDO). It supports ASIL B safety compliance, I²C interface (up to 3.4 MHz), and operates across –40 °C to 125 °C.
For engineers reviewing the MVR5510AMBANESR2 datasheet, MVR5510AMBANESR2 pinout, MVR5510AMBANESR2 application, or MVR5510AMBANESR2 equivalent, key selection criteria include its 56-pin QFN-EP package, dual-phase BUCK1/BUCK2 capability (7.2 A peak), fail-safe outputs (FS0B), and OTP-configurable power-up sequencing for S32G3/DDR3L platforms.
Technical Context
The MVR5510AMBANESR2 implements two independent state machines: a Main state machine managing power sequencing, standby/deep-sleep modes, and regulator enable/disable logic; and a Fail-Safe (FS) state machine handling ASIL B monitoring, fault collection via FCCU1/2 inputs, built-in self-test (ABIST/LBIST), and fail-safe output assertion (FS0B). Its safety architecture includes dedicated voltage monitors (VMON1–VMON4), VCOREMON input, and configurable watchdog windowing.
It supports external frequency synchronization (FIN/FOUT/AMUX), spread-spectrum modulation, slew-rate control, and manual frequency tuning to meet automotive EMC requirements per IEC 61967-4 and IEC 62132-4. The device uses OTP programming for configuration, with MVR5510AMBANESR2 specifically configured for S32G3/DDR3L reference designs and ASIL B safety level.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Input Voltage Range | VSUP1/2: 4.7 V to 36 V continuous; sustains 58 V load dump without external protection |
| Quiescent Current (Standby) | 35 μA typical with VPRE and HVLDO active - enables ultra-low-power always-on gateway functions |
| Output Rails | 1x VPRE controller (external MOSFETs), 3x integrated synchronous bucks (BUCK1–BUCK3), 1x boost, 3x LDOs, 1x HVLDO |
| Safety Certification | ASIL B compliant per ISO 26262; AEC-Q100 Grade 1 qualified (–40 °C to 125 °C ambient) |
| I²C Interface | Up to 3.4 MHz with CRC - ensures robust communication and error detection in noisy vehicle networks |
| Package | 8 mm × 8 mm, 56-pin QFN with exposed pad (wettable flank, MSL3) |
| Thermal Resistance | RθJA = 17 °C/W on 2s8p board - supports high-power density layout in compact ECU modules |
Pinout & Package
Package: 8 mm × 8 mm, 56-pin QFN-EP with wettable flank (ES suffix), MSL3, lead-free, RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| PWRON1 / PWRON2 | Power Enable Inputs | Asynchronous wake-up triggers; PWRON1 initiates main power-up, PWRON2 enables Deep Sleep entry |
| STBY / STBY_PGOOD | Standby Control & Status | STBY toggles standby mode; STBY_PGOOD signals S32G-specific standby readiness |
| FS0B | Fail-Safe Output | Active-low open-drain output asserting during safety faults - directly interfaces with MCU fault-handling logic |
| VCOREMON | Core Voltage Monitor Input | Mandatory connection to BUCK1 output (or BUCK1/2 dual-phase node) for real-time core supply supervision |
| PGOOD / RSTB | Power Good & Reset Outputs | PGOOD indicates all rails in regulation; RSTB provides active-low reset to MCU with external fault detection capability |
| FCCU1/WDI / FCCU2 | Fault Collection Unit Inputs | Dedicated pins for MCU-driven fault reporting and watchdog initiation - essential for ASIL B system partitioning |
Key Features
| Feature | Design Value |
|---|---|
| Dual-phase BUCK1/BUCK2 operation | Extends peak current capability to 7.2 A for demanding S32G3 MCU core supplies while maintaining tight voltage regulation |
| Configurable VPRE controller | Supports up to 10 A output with external MOSFETs and programmable switching frequency - ideal for pre-regulating 12 V/24 V battery to intermediate rails |
| HVLDO with switch-mode capability | Delivers 100 mA in switch mode or 10 mA in LDO mode - reduces heat dissipation when powering high-current analog subsystems |
| EMC optimization suite | Includes frequency synchronization, spread spectrum, and slew-rate control - simplifies compliance with CISPR 25 Class 5 in automotive ECU designs |
| OTP-based configuration | Enables project-specific power-up sequencing, safety thresholds, and functional behavior without hardware changes - accelerates S32G3/DDR3L development |
Applications
| Automotive Domain Controller | In-Vehicle Telematics |
|---|---|
Use Scenario: Centralized vehicle control unit managing ADAS sensor fusion, OTA updates, and CAN FD/Ethernet gateway functions. IC Role / Device Role: Primary PMIC supplying S32G3 MCU core (VDD_CORE), DDR3L memory (VDD_DDR_IO), and auxiliary IO (VDD_3P3). Use Value: Dual-phase BUCK1/BUCK2 delivers stable 1.2 V @ 7.2 A peak; OTP-configured sequencing ensures deterministic boot timing for safety-critical firmware. | Use Scenario: Cellular-connected telematics control unit (TCU) requiring always-on LTE modem, GNSS receiver, and secure boot support. IC Role / Device Role: Power manager enabling ultra-low-quiescent (35 μA) standby mode while maintaining VPRE and HVLDO for wake-on-LTE functionality. Use Value: 35 μA standby current extends battery life during ignition-off; FS0B output alerts host MCU of undervoltage or thermal faults before system failure. |
| V2X Communication Module | Gateway ECU |
Use Scenario: DSRC/C-V2X roadside unit or OBU performing real-time vehicle-to-infrastructure message exchange. IC Role / Device Role: Multi-rail power source for S32G3 processor, 5 GHz WiFi/BT coexistence RF front-end, and isolated CAN transceivers. Use Value: Three independent LDOs (LDO1–LDO3) provide noise-isolated 1.8 V, 3.3 V, and 5 V supplies for RF/analog sections; BOOST converter powers external PA bias. | Use Scenario: High-bandwidth automotive gateway bridging Ethernet AVB, CAN FD, LIN, and FlexRay networks. IC Role / Device Role: Safety-aware power hub delivering regulated rails to multiple SoCs, PHYs, and fail-safe monitoring circuitry. Use Value: ASIL B certification and dedicated FCCU inputs allow integration into ISO 26262-compliant gateway architectures; PGOOD/RSTB/FS0B outputs coordinate safe shutdown across domains. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar multi-output PMIC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MVR5510AMDAHESR2 | ASIL D certified; includes enhanced monitoring (dual FCCU, extended ABIST), additional fail-safe outputs, and S32G-VNP-RDB2 reference design support | Required for full ASIL D domain controllers where fault containment boundaries mandate higher diagnostic coverage | Select when functional safety requirements exceed ASIL B - not drop-in compatible due to stricter monitoring and OTP structure |
| MVR5510AMBA4ESR2 | ASIL B certified but configured for S32G/LPDDR4 memory interface; different OTP programming (BA4 report), identical pinout and electrical specs | Optimized for S32G processors with LPDDR4 memory instead of DDR3L; same safety level and thermal performance | Choose for LPDDR4-based S32G designs; requires revalidation of power-up timing but no PCB change |
Compared with MVR5510AMBANESR2, MVR5510AMDAHESR2 adds ASIL D diagnostics at higher cost and complexity, while MVR5510AMBA4ESR2 offers identical ASIL B safety with LPDDR4-optimized sequencing - both share the same 56-pin QFN package and core regulator architecture.
Availability
MVR5510AMBANESR2 is available at Aetrix Electronics and suitable for automotive domain controllers, telematics units, and V2X communication modules requiring stable component supply, long-term lifecycle support, and ASIL B-certified power management.
Supply support for MVR5510AMBANESR2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT applications.
The VR5510 product line delivers scalable, safety-certified PMICs for next-generation vehicle compute platforms - designed specifically for S32G/S32G3-based domain controllers, gateways, and telematics systems with stringent ASIL B/D requirements.
FAQ
What safety level does the MVR5510AMBANESR2 support?
MVR5510AMBANESR2 is certified to ASIL B per ISO 26262 and qualified to AEC-Q100 Grade 1 (–40 °C to 125 °C). It includes dedicated fail-safe outputs (FS0B), voltage monitors (VMON1–VMON4), FCCU inputs, and ABIST/LBIST for safety-oriented system partitioning. Its OTP configuration enables deployment in QM or ASIL B architectures without hardware modification.
How does the MVR5510AMBANESR2 manage power sequencing for S32G3/DDR3L systems?
MVR5510AMBANESR2 uses one-time programmable (OTP) memory to define precise power-up and power-down sequences tailored to S32G3/DDR3L reference designs. The OTP configuration (BAN report) sets startup order, timing delays, and rail dependencies - ensuring VPRE powers first, followed by BUCK1/BUCK2 for core, then DDR3L supplies (VDD_DDR_IO), and finally IO rails (VDD_3P3), all without external controllers.
What is the function of the VCOREMON pin on the MVR5510AMBANESR2?
The VCOREMON pin on MVR5510AMBANESR2 is a mandatory analog input that must be connected to the BUCK1 output (or the combined BUCK1/BUCK2 dual-phase node) to monitor the MCU core supply voltage in real time. This feedback enables dynamic voltage scaling (DVS), SVS detection, and fail-safe response if core voltage deviates beyond programmed thresholds.
Can the MVR5510AMBANESR2 operate in ultra-low-power standby mode?
Yes, MVR5510AMBANESR2 achieves 35 μA typical quiescent current in standby mode with only VPRE and HVLDO enabled - sufficient to maintain wake-on-LTE or CAN bus monitoring. It supports deep sleep (15 μA) and OFF modes, all controlled via STBY pin, PWRON2, or I²C commands, making it ideal for always-on automotive telematics applications.
What package type and thermal performance does the MVR5510AMBANESR2 use?
MVR5510AMBANESR2 uses an 8 mm × 8 mm, 56-pin QFN with exposed pad (wettable flank, ES suffix) and achieves RθJA = 17 °C/W on a 2s8p test board. Its low thermal resistance enables reliable operation at full load in compact, sealed ECU enclosures - validated up to 150 °C junction temperature per AEC-Q100 requirements.
MVR5510AMBANESR2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 56-VFQFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Applications:
- -
- Current - Supply:
- 15mA
- Voltage - Supply:
- 60V
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount, Wettable Flank
- Supplier Device Package:
- 56-HVQFN (8x8)
MVR5510AMBANESR2 FAQ
1.How can I place an order for MVR5510AMBANESR2 through Aetrix?
Please submit a Request for Quotation (RFQ) for MVR5510AMBANESR2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MVR5510AMBANESR2 reliable?
The price and inventory of MVR5510AMBANESR2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MVR5510AMBANESR2 is usually 5 days.
3.What payment methods are accepted for MVR5510AMBANESR2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MVR5510AMBANESR2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MVR5510AMBANESR2?
MVR5510AMBANESR2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MVR5510AMBANESR2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MVR5510AMBANESR2?
For technical support, including MVR5510AMBANESR2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MVR5510AMBANESR2 requirements.
6.How does Aetrix verify that MVR5510AMBANESR2 is sourced from the original manufacturer or authorized distributors?
All MVR5510AMBANESR2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MVR5510AMBANESR2 meets industry standards.
7.What is the process for return or replacement of MVR5510AMBANESR2?
All MVR5510AMBANESR2 units undergo pre-shipment inspection (PSI). If there is an issue with MVR5510AMBANESR2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MVR5510AMBANESR2 part is unused and in its original packaging.
Return procedure for MVR5510AMBANESR2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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