Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

NXP Semiconductors MVR5510AMDALESR2

Part No.:
MVR5510AMDALESR2
Manufacturer:
NXP Semiconductors
Category:
Power Management - Specialized
Package:
56-VFQFN Exposed Pad
Datasheet:
AetrixMVR5510AMDALESR2.pdf
Description:
SAFETY POWER MANAGEMENT IC, QFN5
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,715

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

MVR5510AMDALESR2 from NXP Semiconductors is an automotive-grade multi-output power management IC (PMIC) designed for gateway, domain controller, and V2X telematics systems. It integrates a 60 V synchronous buck controller (VPRE), three low-voltage synchronous buck converters (BUCK1–BUCK3), one boost converter, three LDOs, and one high-voltage LDO (HVLDO). It supports ASIL D safety compliance per ISO 26262 and operates across –40 °C to 125 °C.

For engineers reviewing the MVR5510AMDALESR2 datasheet, MVR5510AMDALESR2 pinout, MVR5510AMDALESR2 application, or MVR5510AMDALESR2 equivalent, key selection criteria include its 56-pin QFN-EP package, I²C-controlled configuration with CRC, fail-safe outputs (FS0B), dual-phase BUCK1/BUCK2 support up to 7.2 A peak, and standby quiescent current of 35 μA with VPRE and HVLDO active.

Technical Context

The MVR5510AMDALESR2 implements two independent state machines: a Main state machine managing power sequencing, standby/deep-sleep entry, and regulator control; and a Fail-Safe (FS) state machine handling ASIL D monitoring, built-in self-test (ABIST/LBIST), FCCU interface, and fail-safe output assertion. Its safety architecture includes dedicated monitoring circuitry, fail-safe ground (GNDFS), and configurable watchdog windowing.

It features external frequency synchronization (FIN/FOUT/AMUX), spread-spectrum modulation, slew-rate control, and manual frequency tuning to optimize EMC performance. The device supports OTP-programmable power-up sequencing, voltage thresholds, and safety configurations - including STBY_SAFE_DIS_OTP, VPRE_OFF_DLY_OTP, and AUTORETRY_EN_OTP - enabling tailored deployment for S32G-based vehicle networks.

Key Specifications

ParameterValue and Actual Design Meaning
Input Voltage RangeVSUP1/2: 4.7 V to 36 V continuous; validated to 48 V (15 min) for jump-start; withstands 58 V load dump without external protection
Quiescent Current (Standby)35 μA at Tj = 25 °C with VPRE and HVLDO enabled - enables ultra-low-power always-on vehicle network nodes
Output Rails1x VPRE controller (external MOSFETs), 3x integrated synchronous bucks (BUCK1–BUCK3), 1x boost, 3x LDOs, 1x HVLDO - supports full MCU core, DDR, IO, analog, and CAN PHY supply chains
Safety CertificationISO 26262 ASIL D compliant; AEC-Q100 Grade 1 qualified; includes ABIST, LBIST, dual watchdog, FCCU1/2 interfaces, and fail-safe output FS0B
InterfaceI²C up to 3.4 MHz with CRC; supports OTP programming, real-time register access, and interrupt-driven fault reporting via INTB
Thermal ResistanceRθJA = 17 °C/W on 2s8p board - enables high-power operation in compact automotive modules without forced airflow
Package8 mm × 8 mm, 56-pin QFN with exposed pad (EP); wettable flank (ES suffix); MSL3 per J-STD-020

Pinout & Package

Package: 8 mm × 8 mm, 56-pin QFN-EP with step-cut wettable flank (ES suffix), MSL3, lead-free, RoHS-compliant. Exposed pad (Pin 57) must be soldered to PCB ground for thermal and electrical integrity.

Pin/TerminalCircuit RoleDesign Meaning
PWRON1 / PWRON2Power enable inputsAsynchronous wake-up triggers; support dual-source power-on (e.g., ignition + CAN bus wakeup)
STBYStandby mode controlHardware-controlled entry into low-power standby; requires verification of regulator discharge before transition
PGOOD / RSTB / FS0BPower-good, reset, fail-safe outputsOpen-drain signals with dedicated fail-safe ground (GNDFS); RSTB resets MCU; FS0B asserts during safety-critical faults
VCOREMONCore voltage monitor inputMust connect to BUCK1 output (or BUCK1/2 dual-phase node) for accurate SVS/DVS feedback and safety monitoring
FIN / FOUT/AMUXFrequency sync I/OEnables system-wide SMPS synchronization to reduce beat frequencies and improve conducted/radiated EMC
VDDIODigital interface supplyAccepts 1.75–3.4 V; powers I²C, INTB, FIN/FOUT - decoupled separately from power rails for noise immunity
VSUP1 / VSUP2Main power inputs60 V tolerant; require external reverse-battery diodes; support redundant input paths for high-availability gateways
GNDFSFail-safe groundDedicated ground return for FS0B, RSTB, PGOOD - electrically isolated from main GND to prevent fault propagation

Key Features

FeatureDesign Value
Dual-phase BUCK1/BUCK2 operationExtends peak current capability to 7.2 A for S32G MCU core supply while maintaining tight voltage regulation and thermal distribution
VPRE synchronous buck controllerConfigurable up to 10 A output with external MOSFETs; supports 455 kHz or 2.2 MHz switching - enables flexible high-voltage pre-regulation for downstream rails
HVLDO with switch-mode capabilityDelivers 100 mA in switch mode or 10 mA in LDO mode - provides efficient bias for CAN transceivers or sensors without external DC-DC
I²C with CRC and OTP programmingEnsures robust communication integrity and enables project-specific configuration (e.g., sequencing, thresholds, safety settings) without hardware changes
EMC optimization suiteIncludes spread spectrum, slew rate control, and manual frequency tuning - reduces peak emissions by >10 dBμV in 150 kHz–30 MHz conducted bands
Deep Fail-Safe (DEEP-FS) stateImmediate halt on VPRE_FB_OV or TSD detection; auto-retry timeout configurable to 100 ms or 4 s - minimizes system downtime after transient overvoltage or thermal events

Applications

Automotive GatewayIn-Vehicle Network Controller

Use Scenario: Centralized communication hub aggregating CAN FD, Ethernet, LIN, and wireless (C-V2X) traffic in modern E/E architectures.

IC Role / Device Role / Timing Role: Primary PMIC supplying S32G processor core (VDD_CORE), DDR memory (VDD_DDR_IO), IO (VDD_3P3), and CAN PHY (via HVLDO).

Use Value: Integrated ASIL D safety monitoring and fail-safe outputs eliminate need for external safety monitors, reducing BOM count and layout area.

Use Scenario: Domain-level controller managing ADAS sensor fusion, OTA update coordination, and secure boot in zonal architectures.

IC Role / Device Role / Timing Role: Power manager with precise sequencing (OTP-configurable slots), SVS/DVS for BUCK1/BUCK2, and ultra-low-quiescent standby for always-on diagnostics.

Use Value: 35 μA standby current enables >10-year battery-backed operation in parked vehicle scenarios without compromising safety readiness.

Telematics Control Unit (TCU)V2X Communication Module

Use Scenario: Cellular-connected module handling GNSS positioning, remote diagnostics, and emergency call (eCall) services.

IC Role / Device Role / Timing Role: Multi-rail power source for application processor, cellular modem, GNSS receiver, and secure element - all under single safety umbrella.

Use Value: Built-in ABIST/LBIST and FCCU interface satisfy ISO 26262 diagnostic coverage requirements for ASIL D TCU functional safety goals.

Use Scenario: DSRC or C-V2X roadside unit (RSU) or onboard unit (OBU) exchanging real-time traffic, hazard, and infrastructure data.

IC Role / Device Role / Timing Role: High-reliability power subsystem with 58 V load-dump tolerance, EMC-optimized switching, and fail-safe assertion for radio shutdown during fault conditions.

Use Value: Spread-spectrum and frequency synchronization minimize interference with adjacent 5.9 GHz V2X radios, ensuring regulatory compliance and link robustness.

Equivalent & Alternatives

The following parts are listed as comparable options for similar multi-output automotive PMIC applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
MPQ4333-AEC1Single 3.5 A buck + 3x LDOs; no VPRE controller, no ASIL D certification, no fail-safe outputsSuitable for QM or ASIL B infotainment sub-systems; lacks safety monitoring and high-voltage pre-regulationSelect when safety-critical functions are handled externally and cost sensitivity outweighs integration needs.
TPS659413-Q14x bucks + 4x LDOs; ASIL B certified; no VPRE controller; lower max input (40 V); no DEEP-FS state or ABISTTargeted at ADAS domain controllers with moderate safety scope; limited for 48 V jump-start or 58 V load dumpChoose for TI ecosystem designs requiring I²C configurability and moderate safety, but not full ASIL D system partitioning.

Compared with MPQ4333-AEC1 and TPS659413-Q1, the MVR5510AMDALESR2 uniquely delivers ASIL D compliance with integrated VPRE controller, fail-safe outputs, and DEEP-FS recovery - making it the only option for safety-partitioned gateway architectures requiring zero hardware redundancy.

Availability

MVR5510AMDALESR2 is available at Aetrix Electronics and suitable for automotive gateway, domain controller, and V2X telematics applications requiring stable component supply, long-term lifecycle assurance, and AEC-Q100 Grade 1 qualification.

Supply support for MVR5510AMDALESR2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT markets, with deep expertise in functional safety and automotive-grade power management.

The VR5510 product line was engineered specifically for next-generation automotive domain controllers and vehicle-to-everything (V2X) systems, emphasizing ASIL D safety partitioning, ultra-low-power standby, and EMC-hardened multi-rail power delivery.

FAQ

What safety certifications does the MVR5510AMDALESR2 hold?

The MVR5510AMDALESR2 is certified to ISO 26262 ASIL D and qualified per AEC-Q100 Grade 1 (–40 °C to 125 °C). It includes ABIST, LBIST, dual watchdog timers, FCCU1/2 interfaces, and fail-safe output FS0B - all verified in the safety case for use in safety-critical automotive gateways and domain controllers.

How does the MVR5510AMDALESR2 support ultra-low-power standby operation?

The MVR5510AMDALESR2 achieves 35 μA quiescent current in standby mode with VPRE and HVLDO active, enabling extended parked-vehicle functionality. It supports deep sleep (15 μA) and OFF modes, all managed by hardware pins (STBY, PWRON2) and I²C commands - with automatic discharge verification before state transitions.

Can the MVR5510AMDALESR2 drive an external MOSFET for high-current pre-regulation?

Yes, the MVR5510AMDALESR2 includes the VPRE synchronous buck controller with dedicated gate drivers (PRE_GHS, PRE_GLS), bootstrap (PRE_BOOT), current sense (PRE_CSP), and compensation (PRE_COMP) pins - enabling direct control of external high-side and low-side MOSFETs for up to 10 A output at up to 60 V input.

What is the purpose of the GNDFS pin on the MVR5510AMDALESR2?

The GNDFS pin is the dedicated fail-safe ground for MVR5510AMDALESR2's safety-critical outputs (FS0B, RSTB, PGOOD). It must be connected to PCB ground separately from the main GND plane to prevent fault propagation and ensure isolation between functional and safety domains per ISO 26262 requirements.

Does the MVR5510AMDALESR2 support frequency synchronization across multiple PMICs?

Yes, the MVR5510AMDALESR2 supports system-level SMPS synchronization via FIN (input) and FOUT/AMUX (output) pins. This enables phase alignment or dithering across multiple MVR5510AMDALESR2 devices or other compatible ICs - reducing beat frequencies and improving conducted/radiated EMC in multi-PMIC automotive modules.

MVR5510AMDALESR2 Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Series:
-
Package/Case:
56-VFQFN Exposed Pad
Packaging:
Tape & Reel (TR)
Product Status:
Active
Applications:
-
Current - Supply:
15mA
Voltage - Supply:
60V
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount, Wettable Flank
Supplier Device Package:
56-HVQFN (8x8)

MVR5510AMDALESR2 FAQ

1.How can I place an order for MVR5510AMDALESR2 through Aetrix?

Please submit a Request for Quotation (RFQ) for MVR5510AMDALESR2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MVR5510AMDALESR2 reliable?

The price and inventory of MVR5510AMDALESR2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MVR5510AMDALESR2 is usually 5 days.

3.What payment methods are accepted for MVR5510AMDALESR2?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MVR5510AMDALESR2 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MVR5510AMDALESR2?

MVR5510AMDALESR2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MVR5510AMDALESR2 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MVR5510AMDALESR2?

For technical support, including MVR5510AMDALESR2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MVR5510AMDALESR2 requirements.

6.How does Aetrix verify that MVR5510AMDALESR2 is sourced from the original manufacturer or authorized distributors?

All MVR5510AMDALESR2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MVR5510AMDALESR2 meets industry standards.

7.What is the process for return or replacement of MVR5510AMDALESR2?

All MVR5510AMDALESR2 units undergo pre-shipment inspection (PSI). If there is an issue with MVR5510AMDALESR2, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MVR5510AMDALESR2 part is unused and in its original packaging.

Return procedure for MVR5510AMDALESR2:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

MVR5510AMDALESR2 Tags

  • MVR5510AMDALESR2
  • MVR5510AMDALESR2 PDF
  • MVR5510AMDALESR2 Datasheet
  • MVR5510AMDALESR2 Specifications
  • MVR5510AMDALESR2 Images
  • NXP Semiconductors
  • NXP Semiconductors MVR5510AMDALESR2
  • Buy MVR5510AMDALESR2
  • MVR5510AMDALESR2 Price
  • MVR5510AMDALESR2 Distributor
  • MVR5510AMDALESR2 Supplier
  • MVR5510AMDALESR2 Wholesale
Related Products
TPS2511DGNR
TPS2511DGNR

Texas Instruments

UTC2000/MG
UTC2000/MG

Microchip Technology

TUSB320HAIRWBR
TUSB320HAIRWBR

Texas Instruments

TPS61252DSGR
TPS61252DSGR

Texas Instruments

PI5USB30216CXUAEX
PI5USB30216CXUAEX

Diodes Incorporated

SN6501DBVR
SN6501DBVR

Texas Instruments

CYPD3177-24LQXQT
CYPD3177-24LQXQT

Infineon Technologies

SN6501QDBVRQ1
SN6501QDBVRQ1

Texas Instruments

STUSB1600AQTR
STUSB1600AQTR

STMicroelectronics

SN6505BDBVR
SN6505BDBVR

Texas Instruments

SN6501DBVT
SN6501DBVT

Texas Instruments

TPS65150PWPR
TPS65150PWPR

Texas Instruments

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER