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NXP Semiconductors MVR5510AMDANES
- Part No.:
- MVR5510AMDANES
- Manufacturer:
- NXP Semiconductors
- Category:
- Power Management - Specialized
- Package:
- 56-VFQFN Exposed Pad
- Datasheet:
-
MVR5510AMDANES.pdf
- Description:
- SAFETY POWER MANAGEMENT IC, QFN5
- Quantity:
- Payment:
- Shipping:
Inventory:2,540
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Product details
Overview
MVR5510AMDANES from NXP Semiconductors is an automotive-grade multi-output power management IC (PMIC) designed for S32G3/DDR3L-based domain controllers and V2X gateways. It integrates a 60 V synchronous buck controller (VPRE), three low-voltage synchronous buck converters (BUCK1–BUCK3), one boost converter, three LDOs, and a high-voltage LDO (HVLDO), all supporting ASIL D safety compliance per ISO 26262 and AEC-Q100 Grade 1 qualification.
For engineers reviewing the MVR5510AMDANES datasheet, MVR5510AMDANES pinout, MVR5510AMDANES application, or MVR5510AMDANES equivalent, this page delivers verified technical context, safety-configured regulator sequencing, fail-safe output behavior, I²C-controlled configuration with CRC, and validated EMC performance for automotive gateway and telematics systems.
Technical Context
The MVR5510AMDANES implements dual independent state machines: a Main state machine managing power-up sequencing, standby/deep-sleep transitions, and regulator enable/disable timing; and a Fail-Safe (FS) state machine enforcing ASIL D-compliant monitoring of voltage rails, thermal events, and MCU fault signals via FCCU1/2 inputs. Power-up order is OTP-programmable, with HVLDO configurable as first-to-start regulator.
It supports external frequency synchronization (FIN/FOUT), spread-spectrum modulation, slew-rate control, and manual frequency tuning to meet stringent automotive conducted emissions (IEC 61967-4) and immunity (IEC 62132-4) requirements. The device features built-in ABIST/LBIST, fail-safe outputs (FS0B), and dedicated STBY_PGOOD for S32G integration.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Input Voltage Range | VSUP1/2: 4.7 V to 36 V continuous (60 V max transient); supports 12 V & 24 V automotive systems with jump-start and load-dump resilience. |
| Quiescent Current (Standby) | 35 μA typical with VPRE and HVLDO active - enables ultra-low-power always-on functionality in vehicle wake-up networks. |
| Regulator Outputs | 1x VPRE controller (external MOSFETs, up to 10 A), 3x integrated synchronous bucks (BUCK1–BUCK3, up to 3.6 A each), 1x boost (2.25 A), 3x LDOs (400 mA), 1x HVLDO (100 mA switch mode). |
| Safety Certification | ISO 26262 ASIL D compliant; AEC-Q100 Grade 1 (−40 °C to +125 °C ambient); includes fail-safe outputs, BIST, watchdog, and dedicated FCCU monitoring interface. |
| Interface & Control | I²C up to 3.4 MHz with CRC; OTP-programmable power-up sequence, voltage settings, and safety thresholds; PSYNC for dual-device synchronization. |
| Package | 8 mm × 8 mm, 56-pin QFN-EP with wettable flank (ES suffix); RθJA = 17 °C/W on 2s8p board - optimized for automotive thermal constraints. |
Pinout & Package
Package: 8 mm × 8 mm, 56-pin QFN with exposed thermal pad (EP), wettable flank (ES variant), RoHS-compliant, MSL3 per J-STD-020.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| PWRON1 / PWRON2 | Power Enable Inputs | Asynchronous wake-up triggers; support configurable power-on sources and auto-retry logic during fault recovery. |
| VSUP1 / VSUP2 | Main Power Inputs | 60 V-rated inputs with reverse-battery protection diode requirement; feed internal regulators and VPRE controller. |
| BUCK1_IN / BUCK1_SW / BUCK1_FB | Core Buck Converter Interface | Supports dual-phase operation (with BUCK2) for up to 7.2 A peak to S32G3 core; FB pin enables precise SVS/DVS tracking. |
| HVLDO / HV_HVLDO_IN / LV_HVLDO_IN | High-Voltage LDO Interface | Configurable 10 mA LDO or 100 mA switch-mode output; supplies CAN PHY or sensor bias with low dropout and fast transient response. |
| FS0B | Fail-Safe Output | Open-drain, active-low ASIL D fail-safe signal; asserts on detected overvoltage, thermal shutdown, or FCCU fault - directly drives MCU reset or safety controller. |
| STBY_PGOOD | Dedicated Standby Monitor | Asserts when all non-standby rails are stable and discharged; specifically tied to S32G3 reference design timing requirements. |
| I²C (SCL/SDA) | Digital Configuration Interface | 3.4 MHz capable with CRC; used for runtime reconfiguration, fault logging, and OTP programming in engineering mode. |
| VCOREMON | Core Voltage Monitoring Input | Mandatory connection to BUCK1 output (or BUCK1/2 dual-phase node); enables real-time core supply supervision for safety-critical diagnostics. |
Key Features
| Feature | Design Value |
|---|---|
| ASIL D Fail-Safe Architecture | Dedicated FS state machine with independent monitoring, ABIST/LBIST, fail-safe outputs (FS0B), and FCCU1/2 fault collection - enables partitioning into safety-critical subsystems. |
| Configurable Power-Up Sequencing | OTP-programmable startup order and timing slots; supports HVLDO-first boot for CAN PHY initialization prior to MCU wake-up. |
| EMC-Optimized Switching | Frequency synchronization (FIN/FOUT), spread spectrum, slew-rate control, and manual tuning - reduces peak EMI across 150 kHz–108 MHz band per CISPR 25 Class 5. |
| Low-Power Standby Mode | 35 μA quiescent current with VPRE and HVLDO active - sustains CAN bus wake capability and sensor bias without draining battery. |
| Integrated Safety Diagnostics | Voltage monitoring (VMON1–VMON4), thermal shutdown (TSD), overcurrent limiting (ILIM), and built-in self-test - meets ASIL D diagnostic coverage targets. |
Applications
| Automotive Gateway | In-Vehicle Network Controller |
|---|---|
|
Use Scenario: Centralized communication hub connecting CAN FD, Ethernet AVB, and LIN buses in modern E/E architectures. IC Role / Device Role: Primary PMIC supplying S32G3 processor core (VDD_CORE), DDR3L memory (VDD_DDR_IO), and CAN transceivers (HVLDO). Use Value: Enables deterministic power sequencing, fail-safe shutdown on bus fault detection, and <35 μA standby current for always-on network monitoring. |
Use Scenario: Domain-level controller managing ADAS sensor fusion, OTA updates, and vehicle security modules. IC Role / Device Role: Multi-rail power source with ASIL D monitoring for S32G3 safety island, secure enclave, and PCIe interface power domains. Use Value: Provides independent voltage supervision (VMON1–VMON4), fail-safe output (FS0B), and I²C-accessible fault logs for ISO 21434 threat analysis. |
| Telematics Control Unit (TCU) | V2X Communication Module |
|
Use Scenario: Cellular-connected module handling GNSS, LTE/5G, and cloud telemetry in connected vehicles. IC Role / Device Role: Regulates power to modem baseband, RF front-end, and GPS receiver - including boost for antenna LNA bias. Use Value: Supports 60 V load-dump survival, spread-spectrum switching to avoid interference with GNSS bands, and deep-sleep mode for battery longevity. |
Use Scenario: DSRC/C-V2X roadside unit or OBU performing real-time vehicle-to-vehicle coordination. IC Role / Device Role: Supplies VDD_3P3, VDD_1P8_DDR, and CAN PHY (via HVLDO) while meeting ISO 11898-2 EMC requirements. Use Value: Delivers fail-safe assertion (FS0B) on V2X link failure, synchronized switching to reduce radiated emissions near 5.9 GHz band, and STBY_PGOOD for S32G3-VNP-RDB3 compatibility. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar multi-output PMIC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MVR5510AMDAHES | Same VR5510 silicon; configured for S32G-VNP-RDB2 reference design with DAH OTP report - different power-up sequence and voltage setpoints. | Targeted at S32G-VNP-RDB2 hardware; not validated for S32G3/DDR3L timing or DAN-specific sequencing. | Select only if using RDB2 platform; requires revalidation of BUCK1/2 dual-phase timing and STBY_PGOOD behavior. |
| MVR5510AMDA6ES | Same VR5510 silicon; OTP programmed for S32G/DDR3L with DA6 report - differs in VPRE frequency (2.2 MHz vs. 455 kHz) and thermal derating profile. | Validated for 12 V systems with 26 V jump-start; lower max continuous input (18 V) vs. MVR5510AMDANES (36 V). | Prefer for cost-sensitive 12 V telematics designs where 36 V operation is unnecessary; verify load-dump margin against ISO 7637-2 Pulse 5a. |
Compared with MVR5510AMDAHES and MVR5510AMDA6ES, the MVR5510AMDANES offers the highest continuous input voltage rating (36 V), is OTP-validated for S32G3/DDR3L timing, and provides the most direct fit for S32G-VNP-RDB3-based V2X modules requiring STBY_PGOOD alignment and dual-phase BUCK1/2 operation.
Availability
MVR5510AMDANES is available at Aetrix Electronics and suitable for automotive gateway, domain controller, and V2X communication applications requiring stable component supply, ASIL D safety certification, and long-term automotive lifecycle support.
Supply support for MVR5510AMDANES includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on automotive, industrial, and IoT applications, delivering secure, energy-efficient, and scalable silicon solutions.
The VR5510 product line is engineered for next-generation automotive domain controllers and vehicle-to-everything (V2X) systems, integrating functional safety, multi-rail power management, and robust EMC performance in a single package.
FAQ
What safety certifications does the MVR5510AMDANES hold?
The MVR5510AMDANES is certified to ISO 26262 ASIL D for functional safety and qualified per AEC-Q100 Grade 1 (−40 °C to +125 °C). It includes fail-safe outputs (FS0B), built-in self-test (ABIST/LBIST), dedicated FCCU monitoring inputs, and voltage/thermal supervision circuits - all validated for automotive safety-critical applications.
How does the MVR5510AMDANES support S32G3 processor power requirements?
The MVR5510AMDANES supplies the S32G3 processor via BUCK1 (core), BUCK2 (dual-phase extension), BUCK3 (IO), LDO1/LDO2 (DDR/ADC), and HVLDO (CAN PHY). Its OTP configuration (DAN report) ensures correct sequencing, SVS/DVS tracking on VCOREMON, and STBY_PGOOD alignment with S32G-VNP-RDB3 reference timing.
What is the purpose of the STBY_PGOOD pin on the MVR5510AMDANES?
The STBY_PGOOD pin on the MVR5510AMDANES is a dedicated open-drain output that asserts high only when all non-standby regulators have stabilized and discharged below 100 mV - confirming safe entry into standby mode. It is specifically designed for S32G3 integration and replaces generic PGOOD for precise domain-controller sleep-state validation.
Can the MVR5510AMDANES operate with a 60 V load dump without external protection?
Yes - the MVR5510AMDANES sustains a 58 V load dump without external protection when VPRE operates at 455 kHz. This is validated per ISO 7637-2 Pulse 5a for 24 V systems. At 2.2 MHz VPRE operation (e.g., MVR5510AMDA6ES), the limit drops to 35 V, requiring external clamping for full load-dump compliance.
Does the MVR5510AMDANES support dual-device synchronization?
Yes - the MVR5510AMDANES supports dual-device synchronization via the PSYNC pin, enabling coordinated switching frequency and phase alignment between two VR5510 ICs. This reduces system-level ripple and improves EMI performance in high-current applications such as multi-core domain controllers.
MVR5510AMDANES Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 56-VFQFN Exposed Pad
- Packaging:
- Tray
- Product Status:
- Active
- Applications:
- -
- Current - Supply:
- 15mA
- Voltage - Supply:
- 60V
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount, Wettable Flank
- Supplier Device Package:
- 56-HVQFN (8x8)
MVR5510AMDANES FAQ
1.How can I place an order for MVR5510AMDANES through Aetrix?
Please submit a Request for Quotation (RFQ) for MVR5510AMDANES on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MVR5510AMDANES reliable?
The price and inventory of MVR5510AMDANES are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MVR5510AMDANES is usually 5 days.
3.What payment methods are accepted for MVR5510AMDANES?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MVR5510AMDANES transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MVR5510AMDANES?
MVR5510AMDANES orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MVR5510AMDANES order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MVR5510AMDANES?
For technical support, including MVR5510AMDANES datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MVR5510AMDANES requirements.
6.How does Aetrix verify that MVR5510AMDANES is sourced from the original manufacturer or authorized distributors?
All MVR5510AMDANES products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MVR5510AMDANES meets industry standards.
7.What is the process for return or replacement of MVR5510AMDANES?
All MVR5510AMDANES units undergo pre-shipment inspection (PSI). If there is an issue with MVR5510AMDANES, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MVR5510AMDANES part is unused and in its original packaging.
Return procedure for MVR5510AMDANES:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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