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NXP Semiconductors MVR5510AMDANESR2
- Part No.:
- MVR5510AMDANESR2
- Manufacturer:
- NXP Semiconductors
- Category:
- Power Management - Specialized
- Package:
- 56-VFQFN Exposed Pad
- Datasheet:
-
MVR5510AMDANESR2.pdf
- Description:
- SAFETY POWER MANAGEMENT IC, QFN5
- Quantity:
- Payment:
- Shipping:
Inventory:3,923
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Product details
Overview
MVR5510AMDANESR2 from NXP Semiconductors is an automotive-grade multi-output power management IC (PMIC) designed for domain controllers and V2X communication systems. It integrates a 60 V synchronous buck controller (VPRE), three low-voltage synchronous buck converters (BUCK1–BUCK3), one boost converter, three LDOs, and a high-voltage LDO (HVLDO). It supports ASIL D safety compliance, I²C configuration (up to 3.4 MHz), and operates across –40 °C to 125 °C.
For engineers reviewing the MVR5510AMDANESR2 datasheet, MVR5510AMDANESR2 pinout, MVR5510AMDANESR2 application, or MVR5510AMDANESR2 equivalent, key selection criteria include its 56-pin QFN-EP package, fail-safe output (FS0B), dual-phase BUCK1/BUCK2 capability up to 7.2 A peak, standby quiescent current of 35 µA, and OTP-programmable power-up sequencing for S32G3/DDR3L reference designs.
Technical Context
The MVR5510AMDANESR2 implements two independent state machines: a Main state machine managing power-up sequencing, standby/deep-sleep transitions, and regulator control; and a Fail-Safe (FS) state machine handling ASIL D monitoring, built-in self-test (ABIST/LBIST), fault collection via FCCU inputs, and fail-safe output assertion. Power sequencing is fully configurable via one-time programmable (OTP) memory.
It supports external frequency synchronization (FIN/FOUT/PSYNC), spread-spectrum modulation, slew-rate control, and manual frequency tuning to meet automotive EMC requirements per IEC 61967-4 and IEC 62132-4. The device features dedicated voltage monitoring inputs (VMON1–VMON4), VCOREMON feedback, and dual wake-up detection pins (PWRON1/PWRON2).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Input Voltage Range | VSUP1/2: 4.7 V to 36 V continuous (60 V max transient); supports 12 V and 24 V automotive systems with load-dump resilience. |
| Quiescent Current (Standby) | 35 µA at Tj = 25 °C with VPRE and HVLDO active - enables ultra-low-power always-on gateway functions. |
| Output Rails | 1x VPRE controller (external MOSFETs), 3x integrated synchronous bucks (BUCK1–BUCK3), 1x boost, 3x LDOs, 1x HVLDO - delivers full SoC power tree for S32G3 processors. |
| Safety Certification | ISO 26262 ASIL D compliant; AEC-Q100 Grade 1 qualified; includes fail-safe output FS0B, ABIST/LBIST, FCCU interface, and dual watchdog logic. |
| I²C Interface | Up to 3.4 MHz with CRC protection - enables robust, high-speed configuration and real-time telemetry in noisy vehicle networks. |
| Package | 8 mm × 8 mm, 56-pin QFN with exposed pad (EP); wettable flank (ES suffix) - ensures reliable solder joint inspection for automotive manufacturing. |
Pinout & Package
Package: 8 mm × 8 mm, 56-pin QFN-EP (exposed pad), step-cut wettable flank (per ordering info footnote [4]). Thermal resistance RθJA = 27 °C/W (2s2p board) and 17 °C/W (2s8p board).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| PWRON1 / PWRON2 | Power enable inputs | Dual independent wake-up triggers; support hardware- or MCU-initiated power-up with configurable debounce and auto-retry. |
| STBY / STBY_PGOOD | Standby control & status | STBY pin initiates safe entry into standby mode; STBY_PGOOD signals dedicated PGOOD for S32G SoC coordination. |
| FS0B | Fail-safe output | Active-low open-drain output asserting on critical faults (TSD, overvoltage, ABIST failure); directly drives MCU reset or safety controller. |
| VCOREMON | Core voltage monitor input | Mandatory connection to BUCK1 output (or BUCK1/2 dual-phase node) for closed-loop core supply supervision and fault detection. |
| FCCU1/WDI / FCCU2 | Fault Collection and Control Unit interfaces | Inputs for MCU-level fault reporting; enable bidirectional safety communication between PMIC and host processor per ISO 26262 decomposition. |
| PRE_GHS / PRE_GLS / PRE_SW / PRE_FB | VPRE controller terminals | Drive external high-side/low-side MOSFETs; support wide-input (60 V) pre-regulation for downstream rails with current sense and feedback. |
Key Features
| Feature | Design Value |
|---|---|
| Dual-phase BUCK1/BUCK2 operation | Enables 7.2 A peak current delivery to MCU core with interleaved switching - reduces input/output ripple and eases thermal design. |
| Configurable power-up sequencing | OTP-programmable slot-based startup order - ensures correct voltage ramping for DDR3L memory and S32G3 SoC boot requirements. |
| HVLDO operating modes | Switch-mode (100 mA) or LDO-mode (10 mA) - provides flexible low-noise bias for analog sensors or high-current wake-up circuitry. |
| EMC optimization suite | Frequency synchronization, spread spectrum, and slew-rate control - meets stringent automotive conducted emissions limits without external filtering. |
| Fail-safe state machine | Dedicated hardware block with ABIST, LBIST, and FCCU interface - isolates safety-critical monitoring from main power control logic per ASIL D partitioning. |
Applications
| Gateway Systems | In-Vehicle Networks |
|---|---|
Use Scenario: Centralized vehicle network hub aggregating CAN FD, Ethernet, and LIN traffic between domains. IC Role / Device Role: Primary power source for gateway MCU, transceivers, and buffer memory; supplies VDD_CORE, VDD_DDR_IO, and VDD_3P3 rails. Use Value: ASIL D fail-safe outputs and FCCU monitoring ensure deterministic shutdown during bus errors or voltage faults - maintaining network integrity. | Use Scenario: High-bandwidth backbone connecting ADAS, infotainment, and body control modules. IC Role / Device Role: Powers S32G3 processor cores, LPDDR4/DDR3L memory interfaces, and PCIe PHYs with tightly regulated, low-noise supplies. Use Value: Dual-phase BUCK1/BUCK2 and OTP-configurable sequencing guarantee stable core voltage during rapid load transients from Ethernet packet bursts. |
| Domain Controllers | V2X Communications |
Use Scenario: Zonal or central compute unit executing sensor fusion, motion planning, and actuator control. IC Role / Device Role: Delivers multiple independent, safety-monitored rails including VDD_CORE_STBY for low-power context preservation. Use Value: 35 µA standby current and deep-sleep mode (HVLDO only) extend battery life during vehicle sleep cycles without compromising wake latency. | Use Scenario: DSRC or C-V2X roadside unit or OBU requiring secure, interference-resilient wireless operation. IC Role / Device Role: Supplies RF front-end bias, baseband processor, and secure element with EMI-hardened SMPS and LDO outputs. Use Value: Spread-spectrum switching and synchronized FIN/FOUT reduce spectral peaks - easing FCC/ETSI certification for co-located radios. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar multi-rail automotive PMIC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MPQ4333-AEC1 | Single 3.5 A buck; no integrated LDOs, fail-safe logic, or ASIL compliance; 40 V max input. | Targeted at non-safety MCU peripherals; lacks voltage monitoring, FCCU, or fail-safe outputs. | Select when cost-sensitive, non-ASIL subsystems require compact high-efficiency conversion only. |
| TPS659413-Q1 | 4-buck + 4-LDO PMIC; ASIL B rated; no VPRE controller; 5.5 V max input; uses SPI not I²C. | Designed for radar/ADAS SoCs with lower input voltage; lacks 60 V resilience and fail-safe state machine. | Prefer for 5 V domain controllers where I²C is unavailable and ASIL D is not mandated. |
Compared with MPQ4333-AEC1 and TPS659413-Q1, the MVR5510AMDANESR2 uniquely combines ASIL D certification, 60 V VPRE controller, OTP-configurable sequencing for S32G3/DDR3L, and fail-safe state machine - making it the only option for safety-critical gateway and V2X domain controllers requiring full ISO 26262 compliance.
Availability
MVR5510AMDANESR2 is available at Aetrix Electronics and suitable for automotive gateway systems, domain controllers, telematics units, and V2X communication modules requiring stable component supply under AEC-Q100 Grade 1 conditions.
Supply support for MVR5510AMDANESR2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company specializing in secure connectivity solutions for automotive, industrial, and IoT applications.
The VR5510 product line delivers scalable, safety-certified PMICs for next-generation automotive domain controllers and vehicle-to-everything (V2X) platforms - engineered to simplify ASIL D system partitioning and reduce software safety validation burden.
FAQ
What safety certifications does the MVR5510AMDANESR2 hold?
The MVR5510AMDANESR2 is certified to ISO 26262 ASIL D and qualified per AEC-Q100 Grade 1 (–40 °C to 125 °C). It includes a dedicated fail-safe state machine with ABIST/LBIST, FCCU interface, fail-safe output FS0B, and hardware-enforced power-down sequencing - all validated for use in safety-critical automotive gateways and domain controllers.
How is power-up sequencing configured on the MVR5510AMDANESR2?
Power-up sequencing on the MVR5510AMDANESR2 is configured via one-time programmable (OTP) memory. The OTP defines slot-based startup order for all regulators (VPRE, BUCK1–BUCK3, BOOST, LDOs, HVLDO), enabling precise alignment with S32G3/DDR3L boot requirements. Configuration files (e.g., DAN Report) are provided by NXP for engineering-mode programming.
What is the function of the VCOREMON pin on the MVR5510AMDANESR2?
The VCOREMON pin on the MVR5510AMDANESR2 is a mandatory analog input that monitors the actual output voltage of BUCK1 (or the combined BUCK1/BUCK2 dual-phase node). It feeds core voltage feedback into the internal safety monitor, enabling overvoltage/undervoltage detection and triggering fail-safe responses if regulation deviates beyond thresholds.
Does the MVR5510AMDANESR2 support external frequency synchronization?
Yes, the MVR5510AMDANESR2 supports full external frequency synchronization via FIN (input), FOUT/AMUX (output), and PSYNC (bidirectional sync pin). This allows system-wide clock alignment of all SMPS channels to suppress beat frequencies and meet stringent automotive EMC requirements per IEC 61967-4.
What package type and mounting features does the MVR5510AMDANESR2 use?
The MVR5510AMDANESR2 uses an 8 mm × 8 mm, 56-pin QFN package with exposed thermal pad (EP). It features step-cut wettable flank geometry (ES suffix), enabling automated optical inspection (AOI) of solder joints - a critical requirement for zero-defect automotive manufacturing and IPC-A-610 Class 3 compliance.
MVR5510AMDANESR2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 56-VFQFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Applications:
- -
- Current - Supply:
- 15mA
- Voltage - Supply:
- 60V
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount, Wettable Flank
- Supplier Device Package:
- 56-HVQFN (8x8)
MVR5510AMDANESR2 FAQ
1.How can I place an order for MVR5510AMDANESR2 through Aetrix?
Please submit a Request for Quotation (RFQ) for MVR5510AMDANESR2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MVR5510AMDANESR2 reliable?
The price and inventory of MVR5510AMDANESR2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MVR5510AMDANESR2 is usually 5 days.
3.What payment methods are accepted for MVR5510AMDANESR2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MVR5510AMDANESR2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MVR5510AMDANESR2?
MVR5510AMDANESR2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MVR5510AMDANESR2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MVR5510AMDANESR2?
For technical support, including MVR5510AMDANESR2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MVR5510AMDANESR2 requirements.
6.How does Aetrix verify that MVR5510AMDANESR2 is sourced from the original manufacturer or authorized distributors?
All MVR5510AMDANESR2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MVR5510AMDANESR2 meets industry standards.
7.What is the process for return or replacement of MVR5510AMDANESR2?
All MVR5510AMDANESR2 units undergo pre-shipment inspection (PSI). If there is an issue with MVR5510AMDANESR2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MVR5510AMDANESR2 part is unused and in its original packaging.
Return procedure for MVR5510AMDANESR2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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