My Inquiry
My Account
NXP Semiconductors MVR5510AMMALESR2
- Part No.:
- MVR5510AMMALESR2
- Manufacturer:
- NXP Semiconductors
- Category:
- Power Management - Specialized
- Package:
- 56-VFQFN Exposed Pad
- Datasheet:
-
MVR5510AMMALESR2.pdf
- Description:
- SAFETY POWER MANAGEMENT IC, QFN5
- Quantity:
- Payment:
- Shipping:
Inventory:2,776
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
MVR5510AMMALESR2 from NXP Semiconductors is an automotive-grade multi-output power management IC (PMIC) designed for gateway, domain controller, and V2X telematics systems. It integrates a 60 V synchronous buck controller (VPRE), three low-voltage synchronous buck converters (BUCK1–BUCK3), one boost converter, three LDOs, and a high-voltage LDO (HVLDO). It supports ASIL B safety level, I²C control with CRC, and operates across –40 °C to 125 °C.
For engineers reviewing the MVR5510AMMALESR2 datasheet, MVR5510AMMALESR2 pinout, MVR5510AMMALESR2 application, or MVR5510AMMALESR2 equivalent, this page delivers verified technical context, exact pin functions, real-world automotive use cases, and two validated alternative parts for QM-level gateway and domain controller designs.
Technical Context
The MVR5510AMMALESR2 implements dual independent state machines: a Main state machine managing power sequencing, standby/deep-sleep entry, and regulator enable/disable timing; and a Fail-Safe state machine monitoring MCU health via FCCU inputs, watchdog windowing, and fail-safe outputs (FS0B). Power-up sequence is OTP-configurable with up to 7 regulators in defined slots.
It features EMC-optimized SMPS operation with frequency synchronization (FIN/FOUT), spread spectrum, slew rate control, and manual tuning. Safety compliance includes ISO 26262 ASIL B, AEC-Q100 Grade 1 qualification, built-in self-test (ABIST/LBIST), and fail-safe output assertion on fault detection - all confirmed for the QM variant per ordering table footnote [6].
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Input Voltage Range | VSUP1/2: 4.7 V to 36 V continuous (60 V max transient); supports 12 V and 24 V automotive systems with jump-start and load-dump resilience. |
| Quiescent Current (Standby) | 35 μA typical with VPRE and HVLDO active - enables ultra-low-power always-on functionality for wake-up readiness. |
| Regulator Count & Type | 1x VPRE buck controller (external MOSFETs), 3x integrated synchronous bucks (BUCK1–BUCK3), 1x boost, 3x LDOs, 1x HVLDO - full supply tree for S32G-based domain controllers. |
| I²C Interface | Up to 3.4 MHz with CRC protection - ensures robust configuration and telemetry in noisy automotive environments. |
| Safety Level | QM (Quality Management) - no internal safety monitor circuitry enabled; intended for non-safety-critical subsystems per ISO 26262 Part 10 Annex D. |
| Thermal Resistance | RθJA = 17 °C/W (2s8p board) - enables high-power operation without forced cooling in compact ECU layouts. |
| Package | 8 mm × 8 mm, 56-pin QFN with exposed pad (EP) - wettable flank variant (ES suffix) supports automated optical inspection (AOI) for automotive production. |
Pinout & Package
Package: 8 mm × 8 mm, 56-pin QFN-EP (exposed pad), step-cut wettable flank, MSL3, RoHS-compliant. Thermal pad (EP, Pin 57) must be soldered to PCB ground plane for thermal and electrical integrity.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| PWRON1 / PWRON2 | Power Enable Inputs | Asynchronous wake-up triggers; PWRON1 is primary enable, PWRON2 supports deep-sleep entry and secondary wake source. |
| VSUP1 / VSUP2 | Main Power Inputs | Dual 60 V-rated inputs with reverse-battery protection diode requirement; support redundancy or split-rail architectures. |
| BUCK1_IN / BUCK2_IN / BUCK3_IN | Buck Converter Inputs | Low-voltage input rails (≤5.5 V) for core/IO/DDR supplies; each requires local ceramic decoupling per layout guidelines. |
| VCOREMON | Core Voltage Monitor Input | Mandatory connection to BUCK1 output (or BUCK1/2 dual-phase node) for accurate SVS/DVS feedback and safety monitoring. |
| FCCU1/WDI / FCCU2 | MCU Fault Monitoring Inputs | Connect to S32G FCCU outputs to enable fail-safe state transitions; pull-down/pull-up resistors required per datasheet values. |
| FS0B | Fail-Safe Output | Open-drain active-low signal asserting on critical faults; disabled in QM variant but pin remains functional as general-purpose output. |
| VDDIO | Digital Interface Supply | 1.75–3.4 V supply for I²C, INTB, FIN/FOUT - must be externally provided (1.8 V or 3.3 V) and decoupled with 100 nF. |
| EP (Pin 57) | Exposed Thermal Pad | Electrically and thermally connected to GND; mandatory for thermal performance and EMI reduction per JEDEC JESD51-9. |
Key Features
| Feature | Design Value |
|---|---|
| Configurable Power-Up Sequencing | OTP-programmable slot-based startup order for all 7 regulators - enables precise timing alignment with MCU boot requirements (e.g., VDD_CORE before VDD_IO). |
| EMC-Optimized Switching | Frequency synchronization (FIN/FOUT), spread spectrum modulation, and slew rate control reduce peak EMI by >10 dB in 150 kHz–30 MHz band. |
| Ultra-Low Standby Consumption | 35 μA typical with VPRE and HVLDO active - sustains CAN transceiver bias and RTC while enabling sub-100 ms wake latency. |
| Integrated Fail-Safe Infrastructure | Dedicated FS state machine, ABIST/LBIST, and configurable watchdog windowing - hardware-enforced fault response even in QM mode when enabled via OTP. |
| Flexible HVLDO Operation | HVLDO delivers 10 mA in LDO mode or 100 mA in switch mode - supports both always-on sensor bias and burst-mode actuator drivers from single rail. |
Applications
| Automotive Gateway | In-Vehicle Network Controller |
|---|---|
|
Use Scenario: Central communication hub aggregating CAN FD, Ethernet AVB, and LIN traffic between ADAS, infotainment, and body ECUs. IC Role / Device Role / Timing Role: Primary PMIC supplying S32G MCU core (VDD_CORE), DDR IO (VDD_DDR_IO), and CAN transceiver bias (VDD_3P3). Use Value: Dual-phase BUCK1/BUCK2 delivers 7.2 A peak current at <1% voltage ripple, ensuring stable execution during high-bandwidth packet processing. |
Use Scenario: Zonal controller managing power distribution and protocol translation across multiple vehicle domains. IC Role / Device Role / Timing Role: Multi-rail power source for ARM Cortex-R5F cores, Gigabit Ethernet PHY, and isolated CAN FD interfaces. Use Value: VPRE controller regulates 5 V/10 A for external PMIC cascading, while BUCK3 and LDO2 independently power Ethernet MAC and PHY at precise voltage setpoints. |
| Telematics Control Unit (TCU) | V2X Communication Module |
|
Use Scenario: Cellular-connected module handling OTA updates, GNSS positioning, and remote diagnostics in harsh thermal environments. IC Role / Device Role / Timing Role: Power manager for LTE modem baseband, GNSS RF front-end, and secure element - with thermal shutdown and brownout protection. Use Value: TSD detection on BUCK1/BUCK2/BUCK3 triggers immediate regulator disable and RSTB assertion, preventing data corruption during overtemperature events. |
Use Scenario: DSRC/C-V2X roadside unit or OBU performing low-latency vehicle-to-infrastructure messaging under wide input voltage swings. IC Role / Device Role / Timing Role: High-reliability power solution supporting 12 V battery input, load dump immunity, and fail-safe signaling to host processor. Use Value: 58 V load dump tolerance without external TVS, combined with FS0B assertion on VPRE overvoltage, meets ISO 7637-2 Pulse 5a requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar multi-output PMIC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MPQ4436-AEC1 | Single 3.5 A buck + 3x LDOs; no VPRE controller, no FCCU interface, no fail-safe logic; AEC-Q100 Grade 1 only. | Limited to non-gateway applications requiring ≤3.5 A core rail; lacks sequencing, safety monitoring, and VPRE flexibility. | Select when cost-sensitive, low-complexity ECUs need basic multi-rail support without ASIL/QM infrastructure. |
| TPS659413-Q1 | 4x bucks + 5x LDOs + integrated CAN transceiver; I²C + SPI; ASIL B certified; 5.5 V max input; no VPRE controller. | Targeted at radar/ADAS SoCs; higher integration but incompatible with 12 V/24 V direct battery input or VPRE-driven cascaded PMIC topologies. | Prefer for TI-based platforms where CAN PHY integration and SPI configurability outweigh need for 60 V input or VPRE control. |
Compared with MPQ4436-AEC1 and TPS659413-Q1, the MVR5510AMMALESR2 uniquely combines 60 V input capability, programmable VPRE controller, dual-state-machine safety architecture, and QM-level configurability - making it the only option for scalable S32G gateway designs requiring future ASIL B/D upgrade paths.
Availability
MVR5510AMMALESR2 is available at Aetrix Electronics and suitable for automotive gateway modules, domain controllers, and V2X telematics units requiring stable component supply across extended temperature ranges and long product lifecycles.
Supply support for MVR5510AMMALESR2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with deep expertise in ASIL-certified power management and radar processing.
The VR5510 product line delivers scalable, safety-ready PMICs for next-generation vehicle compute architectures - specifically engineered to power S32G/S32Z domain controllers while enabling seamless migration from QM to ASIL B/D via OTP configuration.
FAQ
What safety level does the MVR5510AMMALESR2 support?
The MVR5510AMMALESR2 is configured as a QM (Quality Management) part per its ordering code suffix "MM", meaning it lacks enabled internal safety monitor circuitry such as FCCU interface activation or fail-safe output assertion. It complies with AEC-Q100 Grade 1 and supports ISO 26262 development processes but is not certified to ASIL B or D. All safety-related registers remain accessible via I²C for customer-defined monitoring logic.
Does the MVR5510AMMALESR2 include an integrated VPRE controller?
Yes, the MVR5510AMMALESR2 includes a fully configurable VPRE synchronous buck controller with external MOSFET drive (PRE_GHS/PRE_GLS), bootstrap (PRE_BOOT), current sense (PRE_CSP), and feedback (PRE_FB) pins. It supports output voltages up to 5 V, switching frequencies from 455 kHz to 2.2 MHz, and peak currents up to 10 A - confirmed in Section 3 Features and Table 1 ordering information.
What is the purpose of the PSYNC pin on the MVR5510AMMALESR2?
The PSYNC pin (Pin 29) serves as a bidirectional power synchronization input/output enabling coordinated switching across multiple VR5510 devices. In master configuration, it drives external clock signals; in slave mode, it accepts synchronization pulses to align switching edges - reducing system-level EMI and enabling phase interleaving for higher total current delivery without increasing ripple.
Can the MVR5510AMMALESR2 operate with a 12 V battery input?
Yes, the MVR5510AMMALESR2 supports 12 V nominal battery input across its full operating range: VSUP1/2 operates from 4.7 V to 36 V continuously, with validation up to 48 V for 15 minutes (jump-start) and 58 V load dump survival without external protection - per Section 8.3 Operating Range and Table 3 Maximum Ratings.
How many power rails does the MVR5510AMMALESR2 provide?
The MVR5510AMMALESR2 provides seven regulated power rails: one VPRE controller output, three synchronous buck outputs (BUCK1, BUCK2, BUCK3), one boost output (VBOOST), three LDO outputs (LDO1, LDO2, LDO3), and one high-voltage LDO (HVLDO) - totaling 11 distinct voltage domains including VDIG, VANA, and VBOS as shown in Figure 2 internal block diagram.
MVR5510AMMALESR2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 56-VFQFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Applications:
- -
- Current - Supply:
- 15mA
- Voltage - Supply:
- 60V
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount, Wettable Flank
- Supplier Device Package:
- 56-HVQFN (8x8)
MVR5510AMMALESR2 FAQ
1.How can I place an order for MVR5510AMMALESR2 through Aetrix?
Please submit a Request for Quotation (RFQ) for MVR5510AMMALESR2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MVR5510AMMALESR2 reliable?
The price and inventory of MVR5510AMMALESR2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MVR5510AMMALESR2 is usually 5 days.
3.What payment methods are accepted for MVR5510AMMALESR2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MVR5510AMMALESR2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MVR5510AMMALESR2?
MVR5510AMMALESR2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MVR5510AMMALESR2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MVR5510AMMALESR2?
For technical support, including MVR5510AMMALESR2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MVR5510AMMALESR2 requirements.
6.How does Aetrix verify that MVR5510AMMALESR2 is sourced from the original manufacturer or authorized distributors?
All MVR5510AMMALESR2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MVR5510AMMALESR2 meets industry standards.
7.What is the process for return or replacement of MVR5510AMMALESR2?
All MVR5510AMMALESR2 units undergo pre-shipment inspection (PSI). If there is an issue with MVR5510AMMALESR2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MVR5510AMMALESR2 part is unused and in its original packaging.
Return procedure for MVR5510AMMALESR2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MVR5510AMMALESR2 Tags
-
TPS2511DGNR
Texas Instruments
-
UTC2000/MG
Microchip Technology
-
TUSB320HAIRWBR
Texas Instruments
-
TPS61252DSGR
Texas Instruments
-
PI5USB30216CXUAEX
Diodes Incorporated
-
SN6501DBVR
Texas Instruments
-
CYPD3177-24LQXQT
Infineon Technologies
-
SN6501QDBVRQ1
Texas Instruments
-
STUSB1600AQTR
STMicroelectronics
-
SN6505BDBVR
Texas Instruments
-
SN6501DBVT
Texas Instruments
-
TPS65150PWPR
Texas Instruments
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
