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NXP Semiconductors MVR5510AVMANEP
- Part No.:
- MVR5510AVMANEP
- Manufacturer:
- NXP Semiconductors
- Category:
- Power Management - Specialized
- Package:
- 56-VFQFN Exposed Pad
- Datasheet:
-
MVR5510AVMANEP.pdf
- Description:
- SAFETY POWER MANAGEMENT IC, QFN5
- Quantity:
- Payment:
- Shipping:
Inventory:2,306
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Product details
Overview
MVR5510AVMANEP from NXP Semiconductors is an industrial-grade multi-output power management IC (PMIC) integrating six voltage rails: three synchronous buck converters (BUCK1–BUCK3), one high-voltage synchronous buck controller (VPRE), one boost converter, and three LDOs plus a high-voltage LDO (HVLDO). It delivers up to 10 A via external MOSFETs on VPRE, supports 60 VDC max input, and operates across –40 °C to +105 °C for industrial domain controllers and S32G3-based DDR3L systems.
For engineers reviewing the MVR5510AVMANEP datasheet, MVR5510AVMANEP pinout, MVR5510AVMANEP application, or MVR5510AVMANEP equivalent, this page provides verified functional partitioning, I2C-controlled sequencing (up to 3.4 MHz), fail-safe state machine operation, and QM-level safety compliance per ISO 26262 - all validated for S32G3/DDR3L reference designs with MAN OTP configuration.
Technical Context
The MVR5510AVMANEP implements dual independent state machines: a Main state machine managing power-up sequencing, standby/deep-sleep transitions, and regulator enable/disable timing; and a Fail-Safe (FS) state machine monitoring critical faults (e.g., overvoltage on VPRE_FB, thermal shutdown), asserting FS0B, and enforcing deterministic reset behavior. Power sequencing is fully configurable via one-time programmable (OTP) registers, including slot-based startup order and VPRE_OFF_DLY_OTP delay (250 µs or 32 ms) for external PMIC coordination.
It supports industrial qualification (AEC-Q100 Grade 1, MSL3), operates with 35 µA standby current (VPRE + HVLDO active), and integrates EMC optimization features including SMPS frequency synchronization (FIN/FOUT), spread spectrum modulation, slew rate control, and manual frequency tuning - all confirmed for conducted emissions/immunity per IEC 61967-4 and IEC 62132-4 at 12-M and 10-K levels.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Input Voltage Range | VSUP1/2: –0.3 V to +60 V DC; validated for 58 V load dump without external protection |
| Operating Temperature | –40 °C to +105 °C ambient; qualified for industrial applications per AEC-Q100 Rev H |
| Standby Current | 35 µA typical (VPRE + HVLDO enabled); enables ultra-low-power wake-on-event operation |
| I²C Interface | Up to 3.4 MHz with CRC; used for real-time register access, OTP programming, and fault reporting |
| Safety Level | QM (Quality Management) mode; no ASIL B/D monitoring circuitry enabled per MAN OTP configuration |
| Package | 8 mm × 8 mm, 56-pin QFN with exposed pad (EP); wettable flank dimple variant for TS suffix parts |
| Regulator Count | 6 integrated outputs: BUCK1/2/3 (up to 3.6 A peak each), BOOST (2.25 A peak), 3× LDO (400 mA each), HVLDO (100 mA in switch mode) |
Pinout & Package
Package: 8 mm × 8 mm, 56-pin QFN-EP (exposed pad), MSL3, RoHS-compliant. Pin layout follows JEDEC MO-220 standard with step-cut wettable flank for EP suffix parts (e.g., MVR5510AVMANEP).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| PWRON1 / PWRON2 | Power Enable Inputs | Asynchronous wake-up triggers; PWRON1 initiates full power-up, PWRON2 enables Deep Sleep entry |
| STBY | Standby Control Input | Toggles between Normal_M and Standby modes; requires coordinated I²C command for safe rail discharge |
| PGOOD / RSTB / FS0B | Power Status Outputs | PGOOD indicates all rails in regulation; RSTB resets MCU; FS0B is open-drain fail-safe output (active low) |
| VDDIO | Digital Interface Supply | 1.75–3.4 V supply for I²C, INTB, FIN/FOUT; decoupling mandatory |
| VCOREMON | Core Voltage Monitor Input | Must connect to BUCK1 output (or BUCK1/2 dual-phase node) for accurate SVS/DVS feedback |
| PRE_SW / PRE_GHS / PRE_GLS | VPRE Controller Terminals | Switching node, high-side gate drive, low-side gate drive - interface to external MOSFETs for 10 A capability |
| BUCK1_IN / BUCK1_SW / BUCK1_FB | Core Buck Converter Interface | Input supply, switching node, and feedback path for MCU core rail (dual-phase capable up to 7.2 A peak) |
| LDO1_IN / LDO1 / LDO2_IN / LDO2 / LDO3_IN / LDO3 | Linear Regulator I/O | Three independent LDOs supporting configurable voltages for MCU I/O, DDR, and ADC supplies (up to 400 mA each) |
| HV_HVLDO_IN / HVLDO / LV_HVLDO_IN | High-Voltage LDO Interface | Supports 10 mA LDO mode or 100 mA switch-mode operation; dual-input architecture enables flexible sourcing |
| FCCU1/WDI / FCCU2 | Fault Collection Unit Inputs | Connect to MCU fault-reporting pins; enables watchdog windowing and fail-safe escalation per ISO 26262 QM flow |
Key Features
| Feature | Design Value |
|---|---|
| Configurable Power-Up Sequencing | OTP-programmable slot-based startup order ensures safe ramp-up of S32G3 core, DDR3L, and I/O rails without voltage back-feeding |
| Fail-Safe State Machine | Dedicated hardware FSM monitors VPRE_FB, thermal events, and MCU watchdog signals - asserts FS0B within <1 µs on fault detection |
| EMC-Optimized Switching | Frequency synchronization (FIN/FOUT), spread spectrum, and slew rate control reduce peak EMI by >10 dB in 150 kHz–30 MHz band |
| Low-Power Industrial Operation | 35 µA standby current with VPRE + HVLDO active enables always-on wake-up capability in battery-backed industrial gateways |
| I²C with CRC Protection | 3.4 MHz interface with cyclic redundancy check prevents register corruption during noisy automotive/industrial bus conditions |
| VPRE External Buck Controller | Drives external high-side/low-side MOSFETs to deliver up to 10 A at 60 V input - eliminates need for discrete HV buck stage |
Applications
| Industrial Gateway | S32G3 Domain Controller |
|---|---|
Use Scenario: Centralized communication hub in factory automation systems connecting EtherCAT, CAN FD, and Ethernet interfaces. IC Role / Device Role / Timing Role: Primary PMIC supplying S32G3 MCU core (BUCK1/2), DDR3L memory (BUCK3), I/O banks (LDO1/LDO2), and PHY bias (HVLDO). Use Value: Single-chip power solution reduces BOM count by 7+ discrete regulators while meeting –40 °C to +105 °C industrial temp range and 58 V load dump immunity. | Use Scenario: Vehicle domain controller processing sensor fusion data from radar, camera, and ultrasonic modules in ADAS edge nodes. IC Role / Device Role / Timing Role: Configured in QM mode (MAN OTP) to power S32G3 processor, LPDDR4/DDR3L memory subsystem, and CAN transceivers with precise sequencing and monitoring. Use Value: OTP-configured power-up slots ensure DDR3L initialization completes before application firmware execution, eliminating boot failures in cold-start conditions. |
| Telematics Control Unit (TCU) | V2X Communication Module |
Use Scenario: Cellular-connected module enabling OTA updates, remote diagnostics, and fleet management in commercial vehicles. IC Role / Device Role / Timing Role: Supplies LTE modem (LDO3), GNSS receiver (LDO2), MCU (BUCK1), and RF front-end bias (HVLDO) with independent enable control. Use Value: 35 µA standby current extends battery backup runtime to >72 hours; STBY_PGOOD pin provides dedicated power-good signal for S32G baseband processor. | Use Scenario: DSRC/WAVE or C-V2X roadside unit transmitting real-time traffic alerts and intersection collision warnings. IC Role / Device Role / Timing Role: Powers dual S32G3 SoCs in redundant configuration - one active, one hot-standby - using PSYNC for synchronized switching. Use Value: Dual-device synchronization via PSYNC pin ensures sub-100 ns phase alignment between BUCK1 outputs, minimizing EMI coupling in dense RF environments. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar multi-output PMIC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MPQ4436-AEC1 | Single 3.5 A buck + 3x LDO; no VPRE controller, no fail-safe FSM, no I²C, AEC-Q100 Grade 1 only | Targeted at cost-sensitive non-safety MCU power; lacks sequencing, monitoring, and industrial EMC features | Select when only basic core/I/O regulation is needed and QM-level safety or industrial EMC is not required |
| TPS659413-Q1 | Automotive ASIL-B PMIC with 4 bucks + 4 LDOs; includes safety monitor but no VPRE controller or 60 V input | Designed for ADAS cameras and radar; requires external HV pre-regulator for >28 V inputs | Select for ASIL-B automotive systems needing integrated safety but not industrial temperature or 60 V operation |
Compared with MPQ4436-AEC1 and TPS659413-Q1, the MVR5510AVMANEP uniquely combines 60 V input tolerance, VPRE external buck control (10 A), industrial temperature rating, and QM-mode configurability - making it the only option for S32G3/DDR3L industrial gateways requiring single-chip 6-rail power with load-dump resilience.
Availability
MVR5510AVMANEP is available at Aetrix Electronics and suitable for industrial gateways, S32G3 domain controllers, and V2X communication modules requiring stable component supply, long-term lifecycle support, and traceable sourcing for production programs.
Supply support for MVR5510AVMANEP includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with deep expertise in power management and safety-critical systems.
The VR5510 product line delivers scalable, safety-certifiable PMICs for next-generation vehicle compute platforms - designed specifically for S32G/S32G3 processors, DDR3L/LPDDR4 memory, and industrial gateway architectures requiring high-voltage resilience and deterministic fault response.
FAQ
What safety level does the MVR5510AVMANEP support?
The MVR5510AVMANEP is configured in QM (Quality Management) mode per its MAN OTP programming. It does not activate ASIL B or ASIL D monitoring circuitry, fail-safe state machine escalation paths, or dedicated FCCU interfaces - making it suitable for industrial applications where ISO 26262 functional safety certification is not required. All safety-related registers remain disabled in this configuration.
Does the MVR5510AVMANEP support DDR3L memory power sequencing?
Yes, the MVR5510AVMANEP supports DDR3L power sequencing through OTP-configurable startup slots. BUCK3 is typically assigned to the DDR3L VDDQ rail, while LDO2 supplies VDDIO and LDO3 handles termination voltage (VTT). The sequencing order, delay times, and enable/disable timing are fully programmable via I²C or one-time OTP programming to match JEDEC DDR3L specification requirements.
What is the purpose of the PSYNC pin on the MVR5510AVMANEP?
The PSYNC pin on the MVR5510AVMANEP enables synchronized switching between two devices to reduce system-level EMI. When configured via OTP, it operates as either an input (to lock switching frequency to an external master) or output (to drive a slave device). This feature is confirmed in the datasheet for dual-PMIC configurations in S32G3 domain controllers requiring phase-aligned BUCK1 outputs.
Can the MVR5510AVMANEP operate with a 48 V input supply?
Yes, the MVR5510AVMANEP is validated for 48 V input at room temperature for up to 15 minutes to meet jump-start requirements in 24 V industrial systems. Its VSUP1/2 pins tolerate up to +60 V DC continuously, and it sustains 58 V load dump events without external protection - confirmed in Section 8.3 of the datasheet under "Operating voltage range" and maximum ratings.
How is the VPRE controller configured for 10 A output on the MVR5510AVMANEP?
The VPRE controller on the MVR5510AVMANEP drives external high-side and low-side MOSFETs via PRE_GHS, PRE_GLS, and PRE_SW pins. Output current capability reaches 10 A through selection of appropriate external FETs and inductor, with current limit set via PRE_CSP and PRE_COMP network. Configuration is performed via OTP programming of VPRE-specific registers, and operation is confirmed in Section 28.4.2 ("VPRE") of the datasheet.
MVR5510AVMANEP Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 56-VFQFN Exposed Pad
- Packaging:
- Tray
- Product Status:
- Active
- Applications:
- -
- Current - Supply:
- 15mA
- Voltage - Supply:
- 60V
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount, Wettable Flank
- Supplier Device Package:
- 56-HVQFN (8x8)
MVR5510AVMANEP FAQ
1.How can I place an order for MVR5510AVMANEP through Aetrix?
Please submit a Request for Quotation (RFQ) for MVR5510AVMANEP on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MVR5510AVMANEP reliable?
The price and inventory of MVR5510AVMANEP are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MVR5510AVMANEP is usually 5 days.
3.What payment methods are accepted for MVR5510AVMANEP?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MVR5510AVMANEP transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MVR5510AVMANEP?
MVR5510AVMANEP orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MVR5510AVMANEP order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MVR5510AVMANEP?
For technical support, including MVR5510AVMANEP datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MVR5510AVMANEP requirements.
6.How does Aetrix verify that MVR5510AVMANEP is sourced from the original manufacturer or authorized distributors?
All MVR5510AVMANEP products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MVR5510AVMANEP meets industry standards.
7.What is the process for return or replacement of MVR5510AVMANEP?
All MVR5510AVMANEP units undergo pre-shipment inspection (PSI). If there is an issue with MVR5510AVMANEP, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MVR5510AVMANEP part is unused and in its original packaging.
Return procedure for MVR5510AVMANEP:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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