Infineon Technologies ND104N12KHPSA1

Overview

ND104N12KHPSA1 from Semikron is a dual-arm press-pack rectifier diode module rated for 1200 V repetitive peak reverse voltage (VRRM), 104 A average on-state current (IFAVM) per arm at TC = 100°C, and 160 A RMS on-state current (IFRMSM). It features silicon pellet with AlN internal insulation, designed for high-reliability industrial AC/DC conversion in medium-power three-phase bridge (B6) and two-phase bridge (B2) configurations.

For engineers reviewing the ND104N12KHPSA1 datasheet, ND104N12KHPSA1 pinout, ND104N12KHPSA1 application, or ND104N12KHPSA1 equivalent, key selection criteria include junction-to-case thermal resistance (0.185 °C/W per arm, DC), surge current capability (2900 A, 10 ms), on-state voltage (1.4 V max at 300 A, Tvj = 150°C), and pressure-contact mechanical interface requiring 4 Nm terminal torque.

Technical Context

This dual-arm module integrates two independent high-voltage diode arms in a single press-pack housing, enabling B2 and B6 rectifier topologies without external paralleling. Each arm supports up to 150°C maximum junction temperature and delivers 1.4 V forward voltage drop at full-rated conduction current under worst-case thermal conditions.

Thermal performance is defined by analytical transient impedance models (ZthJC) with seven R-τ elements per arm, supporting precise loss and temperature prediction in forced-air (KM14/Papst 4650) and natural convection (KM14/50W) cooling setups. Isolation rating is 3.0 kV RMS (1 sec, 50 Hz).

Key Specifications

Pinout & Package

ND104N12KHPSA1 uses a press-pack module package with two isolated anode/cathode pairs (one per arm), housed in a metal baseplate with AlN ceramic isolation. Mechanical mounting uses M1 screws (4 Nm ±15%), electrical terminals use M2 screws (4 Nm ±10%). Weight: 160 g. Creepage distance: 15 mm.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-voltage rectifier module applications.

Compared with DD104N12KHPSA1, ND104N12KHPSA1 offers identical electrical specs but differs in mechanical marking and revision-level qualification; versus SKD104/12, it provides higher IFAVM and lower RthJC, enabling tighter thermal design margins in space-constrained enclosures.

Availability

ND104N12KHPSA1 is available at Aetrix Electronics and suitable for industrial motor drives, uninterruptible power supplies, railway traction converters, and medium-voltage solar inverters requiring stable component supply and long-term lifecycle support.

Supply support for ND104N12KHPSA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Semikron is a German power semiconductor manufacturer specializing in high-reliability modules for industrial, energy, and transportation applications since 1951.

This part belongs to the DD/ND104N series of press-pack rectifier modules, engineered for high-current, high-voltage AC/DC conversion in harsh-environment applications where wirebond-free construction and thermal robustness are critical.

FAQ

What is the maximum allowable case temperature for ND104N12KHPSA1?

The maximum case temperature is not independently specified; instead, the device is rated for 104 A average current at TC = 100°C. The absolute maximum junction temperature is 150°C, and thermal design must ensure that junction temperature remains within this limit under all operating conditions using the provided RthJC = 0.185 °C/W and transient ZthJC models.

Does ND104N12KHPSA1 support parallel operation of arms?

No - the two arms are electrically isolated but share a common baseplate and thermal path; they are intended for independent AC phase connections in B2/B6 topologies, not for current sharing. Parallel operation of arms would cause unbalanced thermal stress and is not supported by the datasheet's derating curves or mechanical design.

What is the recommended heatsink mounting procedure?

Mount the module onto a flat, clean, and thermally conductive heatsink surface using M1 screws torqued to 4 Nm ±15%. Apply uniform pressure across the baseplate; avoid tilting or eccentric loading. Use thermal interface material compatible with AlN ceramics, and verify flatness tolerance ≤0.05 mm over the mounting area to prevent localized hot spots.

Is ND104N12KHPSA1 RoHS compliant?

Yes - Semikron confirms RoHS compliance for the ND104N12KHPSA1 series per Directive 2011/65/EU, including exemption 7a for lead in high-melting-temperature solder. Full compliance documentation, including substance declarations and test reports, is available upon request from Aetrix Electronics for qualified customers.