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Texas Instruments O917A130TRGZRQ1

Part No.:
O917A130TRGZRQ1
Manufacturer:
Texas Instruments
Category:
Power Management - Specialized
Package:
48-VFQFN Exposed Pad
Datasheet:
AetrixO917A130TRGZRQ1.pdf
Description:
PMU FOR PROCESSOR
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,500

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Product details

Overview

TPS65917-Q1 from Texas Instruments is an AEC-Q100 Grade 2 automotive power management unit (PMU) integrating five step-down SMPS regulators (including dual-phase 7-A capability), five LDOs, a 12-bit sigma-delta GPADC, thermal monitoring, and configurable power sequencing. It operates from 3.135 V to 5.25 V input, delivers 20 µA off-mode current, and supports dynamic voltage scaling for processor core and memory rails in digital cluster systems.

For engineers reviewing the TPS65917-Q1 datasheet, TPS65917-Q1 pinout, TPS65917-Q1 application, or TPS65917-Q1 equivalent, key selection criteria include dual-phase SMPS synchronization, OTP-configurable power-up sequences, differential remote sensing on 3.5-A SMPS rails, and integrated ADC-based system health monitoring for safety-critical automotive domains.

Technical Context

The TPS65917-Q1 implements a hierarchical power architecture with one-time programmable (OTP) memory controlling startup/shutdown sequences and default voltage settings-enabling zero-software boot. Its five SMPS regulators use internal 2.2-MHz clocking or external synchronization via GPIO_3 (SYNCDCDC) to reduce system-level EMI.

Power sequencing integrates three digital outputs into startup control, while the 12-bit GPADC monitors two external voltages plus internal supply rails, die temperature, and output currents. Thermal shutdown, short-circuit detection per regulator, and watchdog timer provide layered fault response without host intervention.

Key Specifications

Parameter Value and Actual Design Meaning
Input Voltage Range 3.135 V to 5.25 V - supports direct connection to automotive battery rail with transient tolerance
SMPS Output Current Two 3.5-A SMPS with dual-phase 7-A mode - enables high-current core rail delivery with reduced ripple and thermal stress
LDO Count & Capacity Five LDOs: two 300-mA (bypass-capable), one 100-mA low-noise, two 200-mA - powers I/O, RTC, analog sensors, and noise-sensitive domains
ADC Resolution & Channels 12-bit sigma-delta GPADC with 8 channels (2 external) - enables real-time monitoring of supply health, temperature, and external sensor inputs
Control Interfaces SPI + two I²C ports (one dedicated to DVS) - allows simultaneous configuration, voltage scaling, and system telemetry without bus contention
Operating Temperature –40°C to +105°C ambient - qualified for automotive Grade 2 applications including ADAS and digital instrument clusters
Off-Mode Current 20 µA - minimizes battery drain during vehicle sleep states

Pinout & Package

TPS65917-Q1 is housed in a 7.0 mm × 7.0 mm, 48-pin VQFN package (RGZ) with 0.5-mm pitch and exposed thermal pad for enhanced thermal dissipation in automotive under-hood environments.

Pin/Terminal Circuit Role Design Meaning
SMPS1_IN / SMPS2_IN Primary input for dual-phase SMPS1/2 Accepts system supply (VSYS); enables combined 7-A output with differential remote sensing
SMPS1_FDBK / SMPS2_FDBK Differential feedback inputs Supports Kelvin-sense connections to minimize PCB trace resistance errors in high-current paths
GPIO_3 Multi-function pin Configurable as SYNCDCDC input to synchronize switching frequency across multiple PMUs for EMI reduction
BOOT Boot configuration ball Determines power-up sequence behavior; tied to VRTC or ground to select OTP-defined startup profile
INT Interrupt output Open-drain signal indicating thermal warning, short-circuit event, or ADC threshold violation to host processor

Key Features

Feature Design Value
Dual-phase SMPS capability Combines SMPS1 and SMPS2 into single 7-A rail with interleaved timing-reducing input/output capacitor size and thermal footprint
OTP-based power sequencing Factory-programmed startup/shutdown order eliminates boot firmware dependency and ensures deterministic power-up in cold-start conditions
DVS support via dedicated I²C Enables real-time voltage adjustment of processor core rails during runtime-reducing dynamic power consumption without software overhead
Integrated GPADC with external channels Monitors two user-defined analog signals (e.g., battery voltage, cabin temperature) alongside internal rails-eliminating need for external monitoring ICs
Thermal shutdown & warning Triggers automatic system shutdown at 150°C and asserts interrupt at 125°C-meeting ASIL-B functional safety requirements for automotive subsystems

Applications

Automotive Digital Cluster ADAS Domain Controller

Use Scenario: Powering multi-core SoC, TFT display, and CAN/FlexRay interface in instrument panel.

IC Role / Device Role / Timing Role: Central PMU managing sequenced rail activation, DVS for CPU cores, and ADC-based display backlight calibration.

Use Value: Reduces BOM count by integrating five SMPS, five LDOs, and ADC-while meeting AEC-Q100 Grade 2 thermal and reliability requirements.

Use Scenario: Supplying vision processor, radar preprocessor, and Ethernet switch in front-camera or surround-view ECU.

IC Role / Device Role / Timing Role: Provides isolated, low-noise LDOs for SerDes PHYs and synchronized dual-phase SMPS for AI accelerator cores.

Use Value: Dual-phase 7-A SMPS delivers stable core voltage under burst workloads; SYNCDCDC pin enables EMI-aligned switching with companion processors.

Automotive Navigation System In-Vehicle Infotainment (IVI)

Use Scenario: Powering GPS/GNSS SoC, cellular modem, and audio codec in head-unit navigation module.

IC Role / Device Role / Timing Role: Supplies clean 1.8-V and 3.3-V rails via bypass-capable LDOs; uses GPADC to monitor battery voltage and thermal margin.

Use Value: 100-mA low-noise LDO supports GNSS RF section; 20-µA off-mode current extends battery backup duration during ignition-off.

Use Scenario: Managing power for application processor, DDR memory, touchscreen controller, and amplifier in premium IVI head unit.

IC Role / Device Role / Timing Role: Sequences DDR termination, core, and I/O rails; uses SPI for runtime reconfiguration during OS suspend/resume transitions.

Use Value: Configurable OTP sequences eliminate bootloader dependencies; five independent SMPS allow independent rail scaling for multimedia subsystems.

Equivalent & Alternatives

The following parts are listed as comparable options for similar power management applications.

Alternative Part Technical Difference Application Difference Selection Advice
TPS65912-Q1 Four SMPS (max 3-A each), no dual-phase mode, identical LDO count and ADC Lacks 7-A dual-phase capability; suitable for lower-power ADAS cameras or telematics modules Select when total system current demand is below 5 A and board space constraints favor smaller 6-mm × 6-mm RGZ package
MAX20029ATGB/V+T Three 3-A SMPS, four LDOs, no integrated ADC, SPI-only interface No GPADC or thermal monitoring; requires external monitoring circuitry for safety-critical functions Choose for cost-sensitive infotainment displays where ADC functionality is handled externally and dual-phase operation is unnecessary

Compared with TPS65917-Q1, TPS65912-Q1 reduces peak current capability but retains OTP sequencing and automotive qualification, while MAX20029ATGB/V+T trades integration for lower unit cost-requiring additional components to match full system monitoring and sequencing features.

Availability

TPS65917-Q1 is available at Aetrix Electronics and suitable for automotive digital cluster, ADAS domain controller, and navigation system designs requiring stable component supply, long-term lifecycle support, and AEC-Q100-compliant power management.

Supply support for TPS65917-Q1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor company specializing in analog and embedded processing technologies, with leadership in automotive, industrial, and communications markets.

The TPS65917-Q1 belongs to TI's automotive-grade PMU product line, designed specifically to consolidate power delivery, sequencing, and system monitoring for next-generation automotive processors in safety-critical cockpit and ADAS applications.

FAQ

What is the maximum output current capability of the TPS65917-Q1 SMPS regulators?

The TPS65917-Q1 features two 3.5-A SMPS regulators (SMPS1 and SMPS2) that can be configured in dual-phase mode to deliver up to 7 A combined. The remaining three SMPS regulators support 3 A, 2 A, and 1.5 A respectively. All five SMPS include short-circuit protection and power-good indication. This current capability is confirmed in the Electrical Characteristics tables of the official TPS65917-Q1 datasheet (SLVSCO4D, Rev. D).

Does the TPS65917-Q1 support dynamic voltage scaling (DVS) for processor cores?

Yes, the TPS65917-Q1 supports hardware- and software-controlled DVS for its 3.5-A and 3-A SMPS regulators via dedicated I²C and SPI interfaces. Voltage steps are programmable in 10-mV or 20-mV increments across a 0.7-V to 3.3-V range. DVS registers enable real-time adjustment during processor load changes-critical for optimizing power efficiency in automotive SoCs. This functionality is documented in Section 1.1 Features and Section 5.4 of the datasheet.

How does the TPS65917-Q1 handle power sequencing during cold start?

The TPS65917-Q1 uses factory-programmed one-time programmable (OTP) memory to execute deterministic power-up and power-down sequences without host software. Sequences between ACTIVE, SLEEP, and OFF states-including timing delays and rail enable order-are stored in OTP. BOOT pin configuration selects among predefined profiles. This ensures reliable cold-start behavior in automotive environments where firmware may not yet be loaded. Details appear in Sections 1.1, 2.2, and 5.13 of the datasheet.

Can the TPS65917-Q1 monitor external analog signals?

Yes, the TPS65917-Q1 includes a 12-bit sigma-delta GPADC with eight input channels, two of which (ADCIN1 and ADCIN2) are designated for external analog signals such as battery voltage, thermistor readings, or sensor outputs. Internal channels measure supply rails, output currents, and die temperature. Conversion results are accessible via I²C or SPI. This capability is specified in Section 1.1 Features and Section 4.10 of the datasheet.

What package and thermal characteristics does the TPS65917-Q1 use?

The TPS65917-Q1 is packaged in a 7.0 mm × 7.0 mm, 48-pin VQFN (RGZ) with 0.5-mm pitch and an exposed thermal pad. Its thermal resistance (θJA) is 32.2°C/W under standard JEDEC 2-layer board conditions. The device includes thermal shutdown at 150°C and high-temperature warning at 125°C. These mechanical and thermal specifications are listed in Section 8 and Table 4.4 of the official datasheet.

O917A130TRGZRQ1 Specifications

Product attributes
Attribute value
Manufacturer:
Texas Instruments
Series:
-
Package/Case:
48-VFQFN Exposed Pad
Packaging:
Tape & Reel (TR)
Product Status:
Active
Applications:
Processor
Current - Supply:
-
Voltage - Supply:
3.135V ~ 5.25V
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
48-VQFN (7x7)

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1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The O917A130TRGZRQ1 part is unused and in its original packaging.

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2.Obtain a Return Material Authorization (RMA) from Aetrix.

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