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Texas Instruments O917A133TRGZRQ1
- Part No.:
- O917A133TRGZRQ1
- Manufacturer:
- Texas Instruments
- Category:
- Power Management - Specialized
- Package:
- -
- Datasheet:
-
O917A133TRGZRQ1.pdf
- Description:
- PMU FOR PROCESSOR
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Product details
Overview
O917A133TRGZRQ1 from Texas Instruments is an automotive-grade power management unit (PMU) integrating five step-down SMPS regulators (including dual-phase 3.5-A/3.5-A configurable to 7-A), five LDOs, a 12-bit sigma-delta GPADC with eight channels, thermal monitoring, and programmable power sequencing - designed for processor core, memory, and I/O rail supply in automotive digital clusters and ADAS systems.
For engineers reviewing the O917A133TRGZRQ1 datasheet, O917A133TRGZRQ1 pinout, O917A133TRGZRQ1 application, or O917A133TRGZRQ1 equivalent, key selection criteria include AEC-Q100 Grade 2 qualification (–40°C to +105°C), OTP-configurable power-up/down sequences, dynamic voltage scaling support in SMPS1/SMPS2/SMPS3, differential remote sensing capability, and dual I²C + SPI control interfaces.
Technical Context
The O917A133TRGZRQ1 implements a hierarchical power architecture: five independent SMPS regulators (SMPS1–SMPS5) with internal 2.2-MHz clock synchronization and external clock sync via GPIO_3 (SYNCDCDC); two of those (SMPS1/SMPS2) support dual-phase interleaving with differential feedback (SMPS1_FDBK/SMPS2_FDBK) and output current measurement. Its OTP-based sequencer defines startup/shutdown order, SLEEP↔ACTIVE transitions, and GPIO default states without host software intervention.
Control is implemented through one dedicated DVS I²C interface, one general-purpose I²C interface, and one SPI port - all supporting register-level configuration of voltages, timing, interrupt masking, and ADC channel selection. The integrated 12-bit GPADC monitors two external analog inputs (ADCIN1/ADCIN2), internal supply rails, die temperature, and SMPS output currents using on-chip references and programmable conversion sequences.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Operating Temp Range | AEC-Q100 Grade 2: –40°C to +105°C ambient - qualified for under-hood and instrument cluster mounting locations. |
| SMPS Output Current | SMPS1 & SMPS2: 3.5 A each; configurable as dual-phase 7-A output with differential remote sensing and current sharing. |
| LDO Count & Capabilities | Five LDOs: two 300-mA (LDO1/LDO2, bypass mode enabled), one 100-mA low-noise (LDO5), two 200-mA (LDO3/LDO4). |
| ADC Resolution & Inputs | 12-bit sigma-delta GPADC with eight total channels: two external (ADCIN1/ADCIN2), six internal (VCC_SENSE, temperature, SMPS currents, etc.). |
| Control Interfaces | One SPI, two I²C ports - one reserved exclusively for DVS control, enabling real-time voltage scaling during processor DVFS transitions. |
| Power Sequencing | OTP-programmed power-up/down and SLEEP↔ACTIVE sequences - enables boot without host firmware initialization. |
| Package | VQFN-48 (RGZ), 7.0 mm × 7.0 mm, 0.5-mm pitch, exposed thermal pad - supports high-power dissipation in compact automotive PCB layouts. |
Pinout & Package
Package: VQFN-48 (RGZ), 7.0 mm × 7.0 mm body, 0.5-mm pitch, thermally enhanced with exposed PGND pad.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| SMPS1_FDBK / SMPS2_FDBK | Differential feedback inputs | Enable precise regulation and current balancing in dual-phase SMPS1+SMPS2 configuration; require Kelvin-sense routing. |
| GPIO_3 | Multi-function terminal | Configurable as SYNCDCDC input (external clock sync), ENABLE2, or REGEN1 - critical for multi-PMU EMC coordination. |
| BOOT | Boot configuration ball | Tri-level input (ground/VRTC/floating) selects primary power-up sequence stored in OTP - determines default rail enable order. |
| INT | Interrupt output | Open-drain signal indicating thermal warning, short-circuit event, ADC threshold breach, or power-good failure - connects directly to processor IRQ line. |
| VCC_SENSE | Analog system supply monitor | High-impedance input measuring VSYS voltage for brown-out detection and adaptive sequencing - referenced to internal bandgap. |
Key Features
| Feature | Design Value |
|---|---|
| Dual-phase SMPS capability | SMPS1 and SMPS2 combine into single 7-A output with interleaved switching, reduced ripple, and shared thermal load - eliminates need for external phase controllers. |
| OTP-based power sequencing | Factory-programmed startup/shutdown order and state-transition logic - ensures deterministic boot and safe power-down without host CPU involvement. |
| Dynamic voltage scaling (DVS) | Hardware-supported DVS on SMPS1/SMPS2/SMPS3 via dedicated I²C interface - enables real-time core voltage adjustment synchronized to processor frequency changes. |
| Integrated thermal protection | On-die temperature sensor + programmable high-temp warning + thermal shutdown at 150°C - prevents damage during sustained overload or poor heatsinking. |
| System health monitoring | GPADC continuously measures die temperature, SMPS output currents, supply voltages, and external analog signals - provides telemetry for predictive diagnostics and fault logging. |
Applications
| Automotive Digital Cluster | Automotive ADAS Camera Module |
|---|---|
Use Scenario: Powering LCD display controller, graphics processor, and touch interface in instrument panel with strict EMI and thermal constraints. IC Role / Device Role / Timing Role: Central PMU supplying core (SMPS1), memory (SMPS3), I/O (SMPS4), and low-noise analog (LDO5) rails; sequences boot within 100 ms of ignition. Use Value: Dual-phase SMPS1+SMPS2 delivers 7-A core power with <15 mVpp ripple at 2.2 MHz, meeting CISPR-25 Class 5 EMC limits without added filtering. | Use Scenario: Supplying image sensor, ISP, and Ethernet PHY in forward-facing camera with functional safety requirements. IC Role / Device Role / Timing Role: Safety-aware PMU providing ASIL-B compliant power sequencing, thermal shutdown, and fault reporting via INT pin to MCU watchdog. Use Value: OTP-configured power-up ensures camera subsystem powers rails in fail-safe order (e.g., LDOVRTC before SMPS), preventing latch-up during cold start. |
| Automotive Navigation Head Unit | Infotainment Application Processor Platform |
Use Scenario: Managing power for quad-core ARM SoC, DDR3 memory, audio codec, and GPS/GNSS receiver in center-stack unit. IC Role / Device Role / Timing Role: Multi-rail PMU delivering dynamically scaled core voltage (via DVS), fixed I/O voltage, and low-noise analog supply; supports SLEEP mode with 90-μA quiescent current. Use Value: SMPS3 (3-A) and SMPS4 (2-A) independently power DDR3 termination and audio codec, eliminating cross-rail noise coupling observed with single-rail solutions. | Use Scenario: Enabling rapid wake-from-sleep and adaptive performance scaling in connected vehicle infotainment systems. IC Role / Device Role / Timing Role: System-level PMU coordinating processor DVFS, memory retention, and peripheral enable/disable via GPIO-controlled REGEN outputs (REGEN1–REGEN3). Use Value: GPIO_5 POWERHOLD and GPIO_6 NSLEEP inputs allow hardware-gated sleep entry/exit - reducing software latency by >20 ms versus full register-based control. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar power management applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TPS65916Q1RSLRQ1 | Four SMPS (max 3-A each), no dual-phase capability; 10-bit GPADC; fewer GPIOs and LDOs. | Suitable for lower-power SoCs (e.g., single-core Cortex-A53); lacks 7-A core rail and differential sensing. | Select when system peak current < 5 A and cost sensitivity outweighs advanced sequencing/DVS needs. |
| MAX20029ATGB/V+T | Three SMPS (4-A/3-A/2-A), no OTP sequencing; SPI-only interface; no GPADC or thermal monitor. | Targeted at simpler ADAS domains (e.g., radar sensors); requires external sequencing logic and thermal IC. | Choose for cost-constrained modules where host MCU handles sequencing and health monitoring. |
Compared with TPS65916Q1RSLRQ1 and MAX20029ATGB/V+T, O917A133TRGZRQ1 uniquely combines dual-phase 7-A core supply, OTP-defined safety-critical sequencing, and integrated 12-bit telemetry - making it the only option for ASIL-B-compliant digital clusters requiring zero-software boot and real-time DVS.
Availability
O917A133TRGZRQ1 is available at Aetrix Electronics and suitable for automotive digital clusters, ADAS camera modules, and navigation head units requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for O917A133TRGZRQ1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor company specializing in analog, embedded processing, and automotive electronics - with leadership in power management innovation and AEC-Q100 qualification rigor.
O917A133TRGZRQ1 belongs to TI's automotive PMU product line, engineered specifically for high-reliability, multi-rail power delivery in processor-based automotive infotainment and driver-assistance systems.
FAQ
What is the AEC-Q100 qualification status of the O917A133TRGZRQ1?
The O917A133TRGZRQ1 is fully AEC-Q100 qualified as Grade 2, with device-level testing confirming operation from –40°C to +105°C ambient temperature, HBM ESD rating of Class 2 (±2 kV), and CDM rating of Class C4B (±1.25 kV). This qualification applies to the exact O917A133TRGZRQ1 part number and is documented in TI's official TPS65917-Q1 production data sheet (SLVSCO4D).
Does the O917A133TRGZRQ1 support dynamic voltage scaling (DVS) for processor cores?
Yes, the O917A133TRGZRQ1 supports hardware-accelerated DVS on SMPS1, SMPS2, and SMPS3 via its dedicated DVS I²C interface. Voltage steps are programmable in 10-mV or 20-mV increments across 0.7 V to 3.3 V, with slew rate control to prevent overshoot during transitions - enabling tight coordination with ARM big.LITTLE or similar DVFS-capable processors.
How is power sequencing controlled on the O917A133TRGZRQ1?
Power sequencing on the O917A133TRGZRQ1 is primarily controlled by factory-programmed one-time programmable (OTP) memory, defining power-up, power-down, and SLEEP↔ACTIVE transition orders. Default configurations - including rail enable timing, voltage levels, and GPIO states - execute autonomously at boot. Most parameters can be modified post-boot via SPI or I²C, but OTP remains the trusted source for fail-safe startup behavior.
Can the O917A133TRGZRQ1 synchronize its SMPS switching frequency to an external clock?
Yes, the O917A133TRGZRQ1 supports external clock synchronization via the GPIO_3 pin configured as SYNCDCDC. This allows multiple O917A133TRGZRQ1 devices (or other compatible TI PMUs) to operate with phase-aligned switching frequencies between 1.7 MHz and 2.7 MHz - significantly reducing system-level conducted and radiated EMI in multi-PMU automotive architectures.
What thermal protection features does the O917A133TRGZRQ1 include?
The O917A133TRGZRQ1 integrates a calibrated on-die temperature sensor feeding a 12-bit GPADC channel, enabling programmable high-temperature warnings and automatic thermal shutdown at 150°C. It also monitors SMPS FET temperatures indirectly via current-limit and overcurrent detection circuits - triggering POWERGOOD deassertion and INT assertion to alert the host processor before catastrophic failure.
O917A133TRGZRQ1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- -
- Package/Case:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Applications:
- -
- Current - Supply:
- -
- Voltage - Supply:
- -
- Operating Temperature:
- -
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- -
- Supplier Device Package:
- -
O917A133TRGZRQ1 FAQ
1.How can I place an order for O917A133TRGZRQ1 through Aetrix?
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6.How does Aetrix verify that O917A133TRGZRQ1 is sourced from the original manufacturer or authorized distributors?
All O917A133TRGZRQ1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that O917A133TRGZRQ1 meets industry standards.
7.What is the process for return or replacement of O917A133TRGZRQ1?
All O917A133TRGZRQ1 units undergo pre-shipment inspection (PSI). If there is an issue with O917A133TRGZRQ1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The O917A133TRGZRQ1 part is unused and in its original packaging.
Return procedure for O917A133TRGZRQ1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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