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Texas Instruments O917A152TRGZRQ1
- Part No.:
- O917A152TRGZRQ1
- Manufacturer:
- Texas Instruments
- Category:
- Power Management - Specialized
- Package:
- 48-VFQFN Exposed Pad
- Datasheet:
-
O917A152TRGZRQ1.pdf
- Description:
- PMU FOR PROCESSOR - DEV
- Quantity:
- Payment:
- Shipping:
Inventory:3,148
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Product details
Overview
O917A152TRGZRQ1 from Texas Instruments is an automotive-grade power management unit (PMU) integrating five step-down SMPS regulators (including dual-phase 3.5-A/3.5-A configurable to 7-A), five LDOs, a 12-bit sigma-delta GPADC, thermal monitoring, and programmable power sequencing - designed for powering ADAS processors, digital clusters, and navigation systems with AEC-Q100 Grade 2 qualification (–40°C to +105°C).
For engineers reviewing the O917A152TRGZRQ1 datasheet, O917A152TRGZRQ1 pinout, O917A152TRGZRQ1 application, or O917A152TRGZRQ1 equivalent, key selection considerations include dual-phase SMPS capability, OTP-configurable power-up sequences, I²C/SPI dual-control interface, and integrated ADC-based system health monitoring.
Technical Context
The O917A152TRGZRQ1 implements a hierarchical power architecture: five independent SMPS regulators (SMPS1–SMPS5) support dynamic voltage scaling (DVS) on two rails, with SMPS1/SMPS2 configurable in synchronous dual-phase mode for 7-A output; three LDOs provide low-noise biasing (LDO5 supports ≤50 mA low-noise operation), while two bypass-capable LDOs (LDO1/LDO2) enable high-efficiency pass-through modes.
Power sequencing is controlled by factory-programmed one-time programmable (OTP) memory, enabling boot without host firmware; real-time reconfiguration is supported via SPI or I²C interfaces - one dedicated to DVS control, one general-purpose for resource configuration. The integrated 12-bit GPADC monitors two external voltages plus internal supply, current, and die temperature.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Operating Temp | AEC-Q100 Grade 2: –40°C to +105°C ambient - qualified for under-hood automotive environments. |
| SMPS Output Range | 0.7 V to 3.3 V in 10-mV or 20-mV steps - enables precise core/memory rail tuning for SoCs like Jacinto™. |
| Dual-Phase Capability | SMPS1 + SMPS2 combine into single 7-A output with differential remote sensing - reduces ripple and improves load transient response. |
| LDO Count & Types | Five LDOs: two 300-mA bypass-mode, one 100-mA low-noise (≤50 mA), two 200-mA - supports mixed-signal domain isolation. |
| ADC Resolution | 12-bit sigma-delta GPADC with 8 channels (2 external) - enables real-time monitoring of battery voltage, thermistors, and rail currents. |
| Control Interfaces | SPI + dual I²C (one DVS-dedicated, one general-purpose) - allows concurrent voltage scaling and system configuration without bus contention. |
| Package | 7 mm × 7 mm VQFN-48 (RGZ), 0.5-mm pitch - supports high-density automotive PCB layouts with exposed thermal pad. |
Pinout & Package
Package: 7 mm × 7 mm VQFN-48 (RGZ) with exposed thermal pad (PGND). Pinout validated per TI SLVSCO4D Rev D datasheet, Section 3.1–3.2.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| SMPS1_IN / SMPS2_IN | Primary input for dual-phase SMPS | Accepts 3.135–5.25 V system supply; shared input enables coordinated regulation. |
| SMPS1_FDBK / SMPS2_FDBK | Differential feedback inputs | Enable remote sensing across load - compensates for PCB trace IR drop to maintain ±1% output accuracy. |
| GPIO_3 | Multi-function terminal | Configurable as SYNCDCDC input (external clock sync), ENABLE2, or REGEN1 - supports system-level EMC coordination. |
| INT | Interrupt output | Open-drain signal indicating thermal warning, short-circuit event, or ADC threshold breach - triggers host processor fault handling. |
| BOOT | Boot configuration ball | Tri-level input (ground/VRTC/floating) selects OTP startup sequence - enables hardware-defined power-up without software dependency. |
Key Features
| Feature | Design Value |
|---|---|
| Dual-phase SMPS with remote sensing | Enables 7-A output with <±1% load regulation across PCB voltage drops - critical for high-current processor cores. |
| OTP-programmed power sequencing | Factory-configured startup/shutdown order eliminates boot firmware dependency - ensures safe SoC initialization in cold-start conditions. |
| Two external ADC inputs | Monitors battery voltage and NTC thermistors directly - replaces discrete sensing circuitry and reduces BOM count. |
| Hardware/software DVS control | Real-time voltage adjustment via I²C or GPIO-triggered events - synchronizes rail voltage with processor performance states. |
| Thermal shutdown + warning | Triggers hard shutdown at 150°C and asserts interrupt at 125°C - prevents silicon damage while enabling graceful degradation. |
Applications
| Automotive Digital Cluster | ADAS Camera Module |
|---|---|
Use Scenario: Powering TFT-LCD display controller, graphics processor, and touch interface in instrument clusters. IC Role / Device Role: Central PMU managing core (SMPS1/2), memory (SMPS3), I/O (SMPS4), and analog (LDO5) rails with OTP-defined sequencing. Use Value: Eliminates need for discrete DC/DCs and sequencers - reduces board area by >40% versus discrete solution. | Use Scenario: Supplying image sensor, ISP, and Ethernet PHY in front-facing camera ECU. IC Role / Device Role: Provides low-noise 1.2-V core (SMPS1), 1.8-V I/O (SMPS4), and 3.3-V analog (LDOVANA) with ADC-monitored thermal margin. Use Value: Integrated thermal monitoring prevents ISP throttling during sustained video capture - maintains frame rate stability. |
| Automotive Navigation System | In-Vehicle Infotainment (IVI) |
Use Scenario: Powering GPS/GNSS SoC, cellular modem, and audio codec in head-unit navigation modules. IC Role / Device Role: Delivers dynamically scaled core voltage (via DVS over I²C) and isolated low-noise LDO5 for RF section. Use Value: DVS reduces average power by 22% during GPS acquisition - extends battery backup runtime in stop/start cycles. | Use Scenario: Managing multi-rail power for application processor, DDR memory, display interface, and audio subsystem. IC Role / Device Role: Uses five SMPS + five LDOs to independently regulate 12+ voltage domains with synchronized switching. Use Value: External clock synchronization (via GPIO_3) aligns switching frequencies across multiple PMUs - lowers system-level EMI peaks by 15 dBμV. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar power management applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TPS65910A3RSLRQ1 | Four SMPS (max 3-A each), no dual-phase mode; 10-bit ADC; fewer GPIOs | Lacks 7-A capability and differential remote sensing - unsuitable for high-current ADAS SoCs | Select when lower current (≤3-A/core) and reduced feature set meet cost targets |
| MAX20029ATP/V+T | Three 4-A buck regulators, no integrated ADC or OTP sequencing; SPI-only interface | Requires external sequencer and ADC - increases design complexity and footprint | Select when external control flexibility outweighs integration benefits and thermal monitoring is handled elsewhere |
Compared with TPS65917-Q1, TPS65910A3RSLRQ1 offers lower integration and current capability but lower cost, while MAX20029ATP/V+T trades integrated features for higher per-regulator current and interface simplicity - neither provides OTP sequencing or dual-phase 7-A output.
Availability
O917A152TRGZRQ1 is available at Aetrix Electronics and suitable for automotive digital cluster, ADAS camera module, and navigation system designs requiring stable component supply across extended product lifecycles.
Supply support for O917A152TRGZRQ1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor company specializing in analog and embedded processing technologies, with leadership in automotive power management and signal chain solutions.
O917A152TRGZRQ1 belongs to the TPS659xx-Q1 automotive PMU family, engineered specifically to consolidate power delivery, sequencing, and system monitoring for Jacinto™ and similar ADAS processors - reducing design risk in safety-critical vehicle systems.
FAQ
What is the AEC-Q100 qualification status of the O917A152TRGZRQ1?
The O917A152TRGZRQ1 is AEC-Q100 qualified as Grade 2, with device-level testing confirming operation from –40°C to +105°C ambient temperature, HBM Class 2 ESD robustness, and CDM Class C4B tolerance - fully compliant for passenger compartment automotive applications per TI SLVSCO4D datasheet.
Does the O917A152TRGZRQ1 support dynamic voltage scaling (DVS) for processor cores?
Yes, the O917A152TRGZRQ1 supports hardware- and software-controlled DVS on SMPS1 and SMPS3 outputs via dedicated I²C interface or GPIO-triggered events; voltage steps are programmable in 10-mV or 20-mV increments from 0.7 V to 3.3 V - enabling real-time adaptation to processor workload states.
How does the OTP memory in the O917A152TRGZRQ1 affect system boot behavior?
The OTP memory in the O917A152TRGZRQ1 stores factory-configured power-up/down sequences, default voltage settings, and GPIO configurations - allowing full system boot without host processor firmware intervention; bit-integrity error detection halts startup if corruption is detected, preventing undefined system states.
Can the O917A152TRGZRQ1 synchronize its SMPS switching frequency to an external clock?
Yes, the O917A152TRGZRQ1 accepts an external synchronization signal on GPIO_3 (SYNCDCDC function), supporting clock inputs from 1.7 MHz to 2.7 MHz - enabling multi-PMU synchronization to reduce system-level EMI and simplify EMC filter design in complex automotive ECUs.
What thermal protection mechanisms are implemented in the O917A152TRGZRQ1?
The O917A152TRGZRQ1 integrates dual thermal thresholds: a high-temperature warning interrupt at 125°C and automatic thermal shutdown at 150°C; both are monitored continuously by on-die sensors and reported via the INT pin - providing fail-safe operation without external supervision.
O917A152TRGZRQ1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- -
- Package/Case:
- 48-VFQFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Applications:
- Processor
- Current - Supply:
- -
- Voltage - Supply:
- 3.135V ~ 5.25V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-VQFN (7x7)
O917A152TRGZRQ1 FAQ
1.How can I place an order for O917A152TRGZRQ1 through Aetrix?
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6.How does Aetrix verify that O917A152TRGZRQ1 is sourced from the original manufacturer or authorized distributors?
All O917A152TRGZRQ1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that O917A152TRGZRQ1 meets industry standards.
7.What is the process for return or replacement of O917A152TRGZRQ1?
All O917A152TRGZRQ1 units undergo pre-shipment inspection (PSI). If there is an issue with O917A152TRGZRQ1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The O917A152TRGZRQ1 part is unused and in its original packaging.
Return procedure for O917A152TRGZRQ1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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