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Texas Instruments O919A14CTRGZTQ1
- Part No.:
- O919A14CTRGZTQ1
- Manufacturer:
- Texas Instruments
- Category:
- Power Management - Specialized
- Package:
- 48-VFQFN Exposed Pad
- Datasheet:
-
O919A14CTRGZTQ1.pdf
- Description:
- O919A14CTRGZTQ1
- Quantity:
- Payment:
- Shipping:
Inventory:3,282
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Product details
Overview
TPS65919-Q1 from Texas Instruments is an AEC-Q100 Grade 2 automotive power management unit (PMU) integrating four step-down SMPS regulators (two 3.5-A, one 3-A, one 1.5-A), four LDOs (300-mA, 300-mA, 100-mA, 200-mA), a 12-bit sigma-delta GPADC with 8 channels, thermal monitoring, and configurable power sequencing - used to supply processor cores, memory, I/O, and LDO preregulation in digital clusters.
For engineers reviewing the TPS65919-Q1 datasheet, TPS65919-Q1 pinout, TPS65919-Q1 application, or TPS65919-Q1 equivalent, key selection considerations include dual-phase SMPS capability (7-A combined), OTP-configurable startup/shutdown sequences, differential remote sensing on 3.5-A SMPS rails, dynamic voltage scaling support via SPI/I²C, and integrated 32-kHz RC oscillator with PLL clock generation.
Technical Context
The TPS65919-Q1 implements a hierarchical power architecture: four independent buck converters operate at 2.2 MHz (internally synchronized or externally programmable 1.7–2.7 MHz), with two capable of dual-phase interleaving for reduced ripple and higher current delivery. Each SMPS includes hardware/software Eco-mode, soft-start, short-circuit protection, and power-good indication with overcurrent detection.
Power sequencing is controlled by factory-programmed OTP memory supporting configurable transitions between OFF, SLEEP, and ACTIVE states; three digital outputs can be embedded in startup sequences. The 12-bit GPADC monitors external voltages (ADCIN1/ADCIN2), internal supplies, output currents, and die temperature - feeding real-time health data to the host processor via interrupt-driven event handling.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Operating Temp Range | –40°C to +105°C ambient (AEC-Q100 Grade 2 qualified) |
| SMPS Output Current | Two 3.5-A rails (dual-phase capable → 7-A), one 3-A, one 1.5-A |
| LDO Output Current | Two 300-mA (bypass mode), one 100-mA (low-noise ≤50 mA), one 200-mA |
| GPADC Resolution | 12-bit sigma-delta with 8 input channels (2 external, 6 internal) |
| Control Interfaces | SPI + two I²C ports (one dedicated to DVS, one general-purpose) |
| Power Sequencing | OTP-programmed startup/shutdown and SLEEP↔ACTIVE transitions |
| Quiescent Current | 20 μA in Off Mode; 90 μA in Sleep Mode with two SMPS active |
Pinout & Package
TPS65919-Q1 is housed in a 7.0 mm × 7.0 mm VQFN-48 package with 0.5-mm pitch and exposed thermal pad (PGND). Pin functions are validated per TI SLVSDM1A datasheet Section 3.1–3.2.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| SMPS1_IN / SMPS2_IN / SMPS3_IN / SMPS4_IN | Input supply for respective buck regulator | Accepts 3.135–5.25 V system rail; enables independent input domain partitioning |
| SMPS1_FDBK / SMPS2_FDBK | Differential feedback inputs (dual-phase) | Enable precise remote sensing across high-side/low-side FETs to reject PCB IR drop |
| LDO12_IN / LDO4_IN / LDO5_IN | LDO input voltage sources | Allow cascaded regulation (e.g., SMPS → LDO) or direct battery tie for noise-sensitive domains |
| GPIO_3 | Multi-function terminal | Configurable as SYNCDCDC input (external clock sync), ENABLE2, or REGEN1 output |
| INT / RESET_OUT / POWERGOOD | System status signaling | Open-drain interrupt output, active-low reset signal, and combined power-good/short-circuit indicator |
Key Features
| Feature | Design Value |
|---|---|
| Dual-phase SMPS configuration | Enables 7-A output from two 3.5-A rails with interleaved switching to halve input/output ripple |
| Differential remote sensing | Compensates for PCB trace resistance in high-current paths, maintaining ±1% output accuracy under load |
| OTP-based power sequencing | Eliminates need for external firmware bootstrapping; supports fail-safe startup without host CPU intervention |
| Integrated GPADC with thermal monitoring | Measures die temperature directly and triggers thermal shutdown at 150°C junction, plus warning at 125°C |
| Hardware Eco-mode | Automatically engages pulse-skipping at light loads to maintain >85% efficiency down to 1 mA output current |
Applications
| Automotive Digital Cluster | ADAS Sensor Fusion Module |
|---|---|
Use Scenario: Centralized instrument cluster with TFT display, microcontroller, CAN transceivers, and backlight drivers. IC Role / Device Role / Timing Role: Primary PMU supplying core SoC (1.0–1.2 V), DDR memory (1.2–1.35 V), I/O (3.3 V), and analog peripherals (1.8 V, 2.8 V) with coordinated sequencing. Use Value: OTP-configured power-up ensures deterministic boot order; dual-phase SMPS delivers stable 7-A core rail while minimizing EMI in confined dashboard space. |
Use Scenario: Multi-camera radar fusion ECU requiring low-noise analog supplies, precise voltage scaling, and thermal-aware operation. IC Role / Device Role / Timing Role: Power manager for vision processor, ISP, radar MMIC bias, and ADC reference domains - with LDO5 providing <15 μVrms noise for analog front-end. Use Value: GPADC continuously monitors die temperature and camera rail currents; thermal warning interrupts allow graceful degradation before shutdown. |
| Automotive Navigation Head Unit | In-Vehicle Infotainment (IVI) Gateway |
Use Scenario: Touchscreen navigation system with GPS, cellular modem, audio codec, and USB connectivity. IC Role / Device Role / Timing Role: Single-chip power solution delivering 1.1 V core, 1.8 V memory, 3.3 V I/O, 5 V USB VBUS, and RTC backup (LDOVRTC). Use Value: Four independent SMPS enable dynamic voltage scaling during map rendering vs. idle; LDOVANA powers audio DAC with <10 μVrms noise floor. |
Use Scenario: Domain controller bridging CAN FD, Ethernet AVB, and LIN networks with secure boot and OTA update capability. IC Role / Device Role / Timing Role: System-level PMU managing secure enclave supply (isolated LDO), communication PHYs, and watchdog-triggered safe state entry. Use Value: Watchdog timer and OTP bit-integrity check prevent undefined behavior during firmware updates; POWERHOLD input enables controlled brownout recovery. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar PMU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TPS65917-Q1 | Three 3-A SMPS (no dual-phase), no GPADC, fewer GPIOs, same 48-pin VQFN | Lacks thermal monitoring and analog telemetry; suitable for cost-sensitive ADAS cameras without sensor fusion | Select when full 7-A dual-phase capability and die temperature feedback are not required |
| MAX20029ATG/V+T | Three 3-A SMPS, integrated CAN transceiver, no OTP sequencing, different pinout (24-pin TQFN) | Targets gateway ECUs needing native CAN PHY; lacks GPADC and multi-rail sequencing flexibility | Choose for compact CAN-connected modules where integrated transceiver reduces BOM count |
Compared with TPS65919-Q1, TPS65917-Q1 offers lower integration but reduced cost and footprint, while MAX20029ATG/V+T trades sequencing depth and ADC capability for embedded CAN interface - making TPS65919-Q1 optimal for complex, thermally constrained digital clusters requiring full telemetry and deterministic power control.
Availability
TPS65919-Q1 is available at Aetrix Electronics and suitable for automotive digital clusters, ADAS sensor fusion modules, and navigation head units requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for TPS65919-Q1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor company headquartered in Dallas, Texas, designing analog ICs, embedded processors, and power management solutions for automotive, industrial, and communications markets.
The TPS65919-Q1 belongs to TI's automotive-grade PMU product line, engineered specifically for infotainment and driver-assistance systems demanding AEC-Q100 compliance, robust thermal management, and flexible software-configurable power sequencing.
FAQ
What automotive qualification level does the TPS65919-Q1 meet?
The TPS65919-Q1 is AEC-Q100 qualified at Grade 2, supporting ambient operating temperatures from –40°C to +105°C. It also meets HBM Class 2 (±2 kV) and CDM Class C4B (±500 V) ESD requirements, ensuring reliability in harsh automotive environments including engine compartments and dashboard assemblies where thermal cycling and electrical noise are prevalent.
Does the TPS65919-Q1 support dynamic voltage scaling (DVS) for processor cores?
Yes, the TPS65919-Q1 supports DVS through dedicated I²C and SPI interfaces. Voltage-scaling registers control output levels of the two 3.5-A SMPS rails and the 3-A SMPS rail in 10-mV or 20-mV steps, enabling real-time adjustment of core voltage based on processor workload - critical for optimizing power efficiency in automotive SoCs like Jacinto or S32 series.
How does the TPS65919-Q1 handle thermal protection?
The TPS65919-Q1 integrates a die-temperature sensor monitored by its 12-bit GPADC. When junction temperature reaches 125°C, it asserts a high-temperature warning interrupt; at 150°C, it initiates thermal shutdown by disabling all SMPS and LDO outputs. Recovery requires either a full power cycle or host-initiated reset via PWRON or RESET_IN, ensuring safe re-entry into operation.
Can the TPS65919-Q1 synchronize multiple PMUs to reduce system EMI?
Yes, the TPS65919-Q1 supports external clock synchronization via the GPIO_3 pin configured as SYNCDCDC input. It accepts an external clock signal between 1.7 MHz and 2.7 MHz, allowing multiple TPS65919-Q1 devices (or compatible TI PMUs) to align switching edges - significantly reducing broadband EMI peaks in multi-PMU systems such as zonal architectures or high-resolution display backlights.
What is the role of OTP memory in the TPS65919-Q1 power sequencing?
The OTP memory in the TPS65919-Q1 stores factory-programmed power-up/power-down sequences, default voltage settings, GPIO configurations, and bit-integrity checksums. This enables autonomous, software-free startup - essential for automotive systems requiring guaranteed boot behavior even before host firmware initialization. Users may override OTP defaults via SPI/I²C for custom configurations without altering the immutable base sequence.
O919A14CTRGZTQ1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- -
- Package/Case:
- 48-VFQFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Applications:
- Processor
- Current - Supply:
- -
- Voltage - Supply:
- 3.135V ~ 5.25V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-VQFN (7x7)
O919A14CTRGZTQ1 FAQ
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7.What is the process for return or replacement of O919A14CTRGZTQ1?
All O919A14CTRGZTQ1 units undergo pre-shipment inspection (PSI). If there is an issue with O919A14CTRGZTQ1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The O919A14CTRGZTQ1 part is unused and in its original packaging.
Return procedure for O919A14CTRGZTQ1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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