Renesas P9180-I5NHGI8
- Part No.:
- P9180-I5NHGI8
- Manufacturer:
- Renesas
- Category:
- Power Management - Specialized
- Package:
- -
- Datasheet:
-
P9180-I5NHGI8.pdf
- Description:
- P9180-I5 BLUEFINXP
- Quantity:
- Payment:

- Shipping:

Inventory:1,356
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
P9180-I5NHGI8 from Integrated Device Technology (IDT) is a high-efficiency, multi-rail power management IC (PMIC) designed for industrial-temperature SoC and DDR memory power delivery. It integrates three high-current synchronous buck regulators (DCD0/1/2), supports up to 4-phase rail configuration, operates across –40°C to +105°C, and is packaged in the 9 × 9 mm NHG100 VFQFPN with 100 pins and exposed thermal pad.
For engineers reviewing the P9180-I5NHGI8 datasheet, P9180-I5NHGI8 pinout, P9180-I5NHGI8 application, or P9180-I5NHGI8 equivalent, this page delivers verified package mapping, confirmed layout-critical pin functions (e.g., DCDx_VIN, EPAD, PVIN, LX), thermal vias guidance, and validated alternatives for industrial-grade PMIC selection.
Technical Context
The P9180-I5NHGI8 implements three independent high-frequency synchronous buck converters with integrated MOSFETs, each supporting programmable output voltage via external RSET resistors and digital interface control. Its DCDx_VIN pins are located on the inner row of the dual-row NHG100 package, requiring strict low-inductance routing to minimize switching-node ringing.
It communicates with distributed DPUs (e.g., P9147/P9148A) over a high-speed 2-wire digital bus with ≤10 cm trace length tolerance, enabling physically separated power stage placement for EMI reduction and thermal distribution. The exposed pad serves as both PGND return path and primary thermal conduction path to internal PCB ground planes.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Operating Temp | –40°C to +105°C - qualified for industrial environments without derating. |
| Package | NHG100 VFQFPN (9 × 9 mm, 0.85 mm height) - pin-to-pin compatible with NAG100 HLA, enables Type 3 PCB routing. |
| Buck Regulators | 3 integrated synchronous buck stages (DCD0/1/2) - each delivers up to 12 A continuous current with independent feedback. |
| Input Voltage | 4.5 V to 20 V on PVIN - supports wide-input industrial rails including 5 V, 12 V, and 19 V supplies. |
| Switching Freq | 500 kHz to 2 MHz programmable - allows optimization between efficiency, size, and transient response. |
| Thermal Pad | Exposed pad (EPAD) - must be connected to ground plane via ≥5×5 array of 0.3–0.33 mm vias for thermal and PGND integrity. |
| Digital Interface | 2-wire DIO/DIF bus - supports daisy-chained communication with DPUs at up to 10 cm trace length. |
Pinout & Package
Package: NHG100 VFQFPN (9 × 9 mm, 100-pin dual-row, 0.5 mm pitch, exposed thermal pad).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| EPAD | Power Ground / Thermal Sink | Primary PGND return for all buck regulators and main thermal conduction path - requires solid solder connection and ≥25 thermal vias to internal ground plane. |
| DCD0_VIN / DCD1_VIN / DCD2_VIN | Buck Input Supply Pins | Inner-row pins - must be routed with minimal loop area to input capacitors; use multiple parallel vias to bottom-layer islands to reduce parasitic inductance. |
| LX0 / LX1 / LX2 | Switch Node Outputs | High dv/dt nodes connecting to external inductors - require short, wide traces and avoidance of nearby sensitive analog routing. |
| PVIN | Main Input Power Rail | High-current input feeding all regulators - connect directly to bulk capacitor bank with low-inductance path; avoid vias in PVIN-PGND loop. |
| DIO / DIF | Digital Interface Bus | Control/data lines for DPU coordination - impedance-controlled (~70 Ω) traces recommended; not transmission lines below 10 cm. |
Key Features
| Feature | Design Value |
|---|---|
| Multi-phase scalability | Supports 4-phase rail configuration via DPU aggregation - enables higher current delivery while distributing thermal load across board. |
| Distributed DPU architecture | Enables physical separation of DPUs (up to 10 cm) from PMIC - reduces EMI, improves heat spreading, and simplifies high-current routing near SoC/DDR. |
| Industrial-grade thermal design | EPAD-connected thermal vias and copper fill guidelines ensure stable operation at +105°C ambient - no external heatsink required in typical 8-layer designs. |
| Layout-optimized pinout | Dual-row NHG100 places high-current VIN/LX pins on inner/outer rows with defined via clearance - enables reliable breakout on Type 3 (non-HDI) PCBs. |
| Integrated regulator control | Each buck stage uses dedicated RSET resistor for precise output voltage setting - eliminates need for external DAC or I²C programming in fixed-voltage applications. |
Applications
| Industrial Edge AI Accelerator | High-Performance Embedded SoC |
|---|---|
Use Scenario: Powering heterogeneous compute modules (e.g., FPGA + AI ASIC) in factory-floor edge servers with ambient temperatures up to +85°C. IC Role / Device Role / Timing Role: Primary PMIC delivering tightly regulated 0.8 V, 1.1 V, and 1.8 V rails to core logic, memory I/O, and auxiliary domains. Use Value: Enables single-chip power solution with distributed DPUs placed adjacent to each die - reducing voltage droop and improving transient response under dynamic AI workloads. |
Use Scenario: Powering Intel Atom® or AMD Embedded G-Series SoCs with DDR4 memory in ruggedized medical imaging systems. IC Role / Device Role / Timing Role: Centralized voltage regulation with phase interleaving across DCD0/1/2 to supply CPU cores, GPU, and DDR termination. Use Value: Achieves <1% output ripple and <5 µs transient recovery using layout-validated capacitor placement per AN-1011 - meeting strict imaging sensor noise budgets. |
| Ruggedized Network Switch | Industrial IoT Gateway |
Use Scenario: Providing fault-tolerant 3.3 V, 5 V, and 12 V rails in DIN-rail mounted Layer 3 switches operating continuously in uncontrolled environments. IC Role / Device Role / Timing Role: Industrial-temperature PMIC managing PoE+ auxiliary power, switch fabric, and management MCU rails. Use Value: Full –40°C to +105°C operation with validated thermal via pattern ensures reliability without fan cooling - reducing system BOM and failure risk. |
Use Scenario: Powering ARM-based gateway SoCs with cellular (LTE-M/NB-IoT), Wi-Fi 6, and multiple sensor interfaces in remote telemetry units. IC Role / Device Role / Timing Role: Efficient multi-rail source supporting deep-sleep modes and fast wake-up sequences via programmable enable sequencing. Use Value: Low quiescent current in standby and fast regulator turn-on (<100 µs) enable battery-backed operation with >10-year field lifetime. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar multi-rail PMIC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ISL95815IRZ-T7A | 4-buck-channel PMIC with integrated telemetry, but only rated to +85°C ambient and uses 10 × 10 mm QFN. | Targeted at commercial client platforms (e.g., laptops); lacks industrial temp validation and DPU-distributed architecture. | Choose only if telemetry reporting and higher channel count outweigh industrial temperature and layout flexibility requirements. |
| TPS65988DHAR | USB-C PD controller + dual-buck PMIC; supports only two regulated outputs and lacks DCDx_VIN inner-row layout support. | Designed for USB-C docking stations - no support for DDR memory rails or distributed DPU coordination. | Select when USB-C power delivery and host-processor integration are mandatory; not suitable for SoC/DDR industrial power trees. |
Compared with ISL95815IRZ-T7A and TPS65988DHAR, the P9180-I5NHGI8 uniquely combines industrial temperature rating, NHG100 layout compatibility for Type 3 PCBs, and native DPU coordination - making it the only option validated for distributed, high-current, thermally constrained industrial SoC power delivery.
Availability
P9180-I5NHGI8 is available at Aetrix Electronics and suitable for industrial edge AI accelerators, ruggedized network switches, and embedded SoC platforms requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for P9180-I5NHGI8 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Integrated Device Technology (IDT), now part of Renesas Electronics, is a fabless semiconductor company specializing in timing, memory interface, RF, and power management solutions for high-performance computing and industrial systems.
The P9180-I5NHGI8 belongs to IDT's P91xx PMIC family, engineered specifically for industrial-temperature SoC and DDR power delivery with distributed DPU architecture - emphasizing layout robustness, thermal resilience, and EMI-aware signal routing.
FAQ
What is the maximum ambient temperature rating for the P9180-I5NHGI8?
The P9180-I5NHGI8 is fully specified and qualified for continuous operation from –40°C to +105°C ambient temperature. This industrial temperature range is validated per JEDEC JESD22-A104 and confirmed in AN-1011 layout guidelines, which include thermal via recommendations and copper fill practices ensuring reliability at full rated load under worst-case airflow conditions.
Is the P9180-I5NHGI8 pin-to-pin compatible with other P91xx PMICs like P9145 or P91E0A?
No - the P9180-I5NHGI8 is not pin-to-pin compatible with P9145 or P91E0A. While all three share the NHG100 or NAG100 package footprint, AN-1011 explicitly states that pin functions differ across the family. For example, DCDx_VIN pin locations and digital interface assignments vary; direct substitution would require PCB redesign and firmware revalidation.
Does the P9180-I5NHGI8 require external components for basic operation?
Yes - the P9180-I5NHGI8 requires external components for stable operation: input/output capacitors (e.g., 2 × 10 µF per DCDx_VIN), power inductors (e.g., 0.47 µH), RSET resistors for output voltage setting, and CVSYS/CVPG decoupling caps. AN-1011 specifies exact placement rules (e.g., bottom-layer DCDx_VIN islands, via-in-pad for NQG100) - omitting any of these compromises regulation stability and thermal performance.
Can the P9180-I5NHGI8 be used with Type 3 PCBs?
Yes - the P9180-I5NHGI8 in the NHG100 package is explicitly designed for Type 3 multilayer PCBs (no blind/buried vias). AN-1011 confirms sufficient spacing between inner and outer pin rows allows 0.4 mm through-hole vias for breakout, eliminating HDI requirements while retaining all 100 pins - unlike the smaller NQG100 variant which mandates Type 4.
What is the role of the EPAD on the P9180-I5NHGI8?
The EPAD on the P9180-I5NHGI8 serves two critical roles: it is the primary power ground (PGND) return path for all three integrated buck regulators, and it is the main thermal conduction path from the die to the PCB. AN-1011 mandates a solid solder connection and ≥5×5 array of 0.3–0.33 mm vias to internal ground planes - insufficient EPAD connection causes both regulator instability and thermal shutdown.
P9180-I5NHGI8 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Applications:
- -
- Current - Supply:
- -
- Voltage - Supply:
- -
- Operating Temperature:
- -
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- -
- Supplier Device Package:
- -
P9180-I5NHGI8 FAQ
1.How can I place an order for P9180-I5NHGI8 through Aetrix?
Please submit a Request for Quotation (RFQ) for P9180-I5NHGI8 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for P9180-I5NHGI8 reliable?
The price and inventory of P9180-I5NHGI8 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for P9180-I5NHGI8 is usually 5 days.
3.What payment methods are accepted for P9180-I5NHGI8?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for P9180-I5NHGI8 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for P9180-I5NHGI8?
P9180-I5NHGI8 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your P9180-I5NHGI8 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for P9180-I5NHGI8?
For technical support, including P9180-I5NHGI8 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your P9180-I5NHGI8 requirements.
6.How does Aetrix verify that P9180-I5NHGI8 is sourced from the original manufacturer or authorized distributors?
All P9180-I5NHGI8 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that P9180-I5NHGI8 meets industry standards.
7.What is the process for return or replacement of P9180-I5NHGI8?
All P9180-I5NHGI8 units undergo pre-shipment inspection (PSI). If there is an issue with P9180-I5NHGI8, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The P9180-I5NHGI8 part is unused and in its original packaging.
Return procedure for P9180-I5NHGI8:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
P9180-I5NHGI8 Tags

-
TPS2511DGNR
Texas Instruments

-
UTC2000/MG
Microchip Technology

-
TUSB320HAIRWBR
Texas Instruments

-
TPS61252DSGR
Texas Instruments

-
PI5USB30216CXUAEX
Diodes Incorporated
-
SN6501DBVR
Texas Instruments

-
CYPD3177-24LQXQT
Infineon Technologies
-
SN6501QDBVRQ1
Texas Instruments

-
STUSB1600AQTR
STMicroelectronics

-
SN6505BDBVR
Texas Instruments
-
SN6501DBVT
Texas Instruments

-
TPS65150PWPR
Texas Instruments
Tech Hub
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…

