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Home > Products > Integrated Circuits (ICs) > Linear > Audio Amplifiers

Diodes Incorporated PAM8019EFS-7

Name: PAM8019EFS-7
Brand: Diodes Incorporated
SKU: PAM8019EFS-7
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: PAM8019EFS-7

Manufacturer:: Diodes Incorporated

Category:: Audio Amplifiers

Package:: 20-UFQFN Exposed Pad

Datasheet:: PAM8019EFS-7.pdf

Description:: AUDIO CLASS D ANALOG INP U-QFN30

Quantity:: RFQ Add To RFQ list

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Product details

Overview

PAM8019EFS-7 from Diodes Incorporated is a stereo 4W Class-D audio power amplifier with integrated 88mW Class-AB headphone driver, adjustable 62-step DC volume control (–60 dB to +20 dB), auto gain control (AGC), and spread-spectrum modulation (SSM) for EMI suppression. It operates from 2.5V to 6.0V, delivers 4W into 4Ω at 5.8V (THD+N = 10%), and supports speaker/headphone mode switching via HP/SPK pin - used in portable speakers and all-in-one computing audio subsystems.

For engineers reviewing the PAM8019EFS-7 datasheet, PAM8019EFS-7 pinout, PAM8019EFS-7 application, or PAM8019EFS-7 equivalent, key selection criteria include dual-mode output architecture, SSM-enabled EMI compliance with ferrite-bead-only filtering, AGC programmable power limiting, startup open/short detection, and thermal/auto-recovery protection under real-world load transients.

Technical Context

The PAM8019EFS-7 integrates two independent Class-D half-bridge outputs per channel (ROUTP/ROUTN, LOUTP/LOUTN) with PWM modulation and SSM toggling via dedicated SSM pin, plus a fully differential Class-AB headphone driver (HPLOUT/HPROUT) with 32Ω load capability. Its analog input stage accepts differential signals (RIN/LIN) with 10 kΩ input resistance in speaker mode and 44 kΩ in headphone mode.

Control logic includes EN for global shutdown, Mute for output Hi-Z assertion, HP/SPK for output path selection, Volume for 62-step DC gain setting (0–5.8V range), and AGC for dynamic compression reference (0–1.6V). Protection circuitry performs speaker open/short detection during startup, thermal shutdown at +150°C with +30°C hysteresis, and short-circuit/undervoltage/DC-input fault handling.

Key Specifications

Parameter	Value and Actual Design Meaning
Supply Voltage	2.5 V to 6.0 V - Enables direct Li-ion battery (3.0–4.2 V) or USB-powered operation without LDO pre-regulation.
Class-D Output Power	4 W @ 5.8 V, 4 Ω, THD+N = 10% - Delivers full-range audio to compact stereo speakers with minimal heatsinking.
Headphone Output Power	88 mW @ 5.8 V, 32 Ω, THD+N = 1% - Drives standard consumer headphones with low distortion and A-weighted noise ≤15 µV.
Volume Control Range	–60 dB to +20 dB in 62 steps - Replaces mechanical potentiometer and external DAC, reducing BOM count and PCB area.
SSM Frequency Range	234 kHz to 534 kHz - Spreads spectral energy to reduce peak EMI emissions, enabling compliance with CISPR 22/32 using only FB-C filters.
AGC Reference Input	0 V to 1.6 V - Sets programmable output power limit (e.g., 1.4 V ≈ 2.5 W into 4 Ω), preventing speaker damage during bass-heavy content.
Thermal Shutdown	+150 °C with +30 °C hysteresis - Ensures safe recovery after overload without manual reset or system-level intervention.

Pinout & Package

Package: U-QFN3030-20 (3.0 mm × 3.0 mm, 0.4 mm pitch, exposed thermal pad).

Pin/Terminal	Circuit Role	Design Meaning
1 ROUTN	Right Channel Class-D Negative Output	Drives negative side of bridged-tied load; requires low-inductance return path to PGND.
2 HPROUT	Right Channel Headphone Output	Differential output for stereo headphone jack; DC-coupled, no output capacitor needed.
3 EN	Global Enable Input	Active-high logic control: Low = chip shutdown (outputs Hi-Z, IQ < 1 µA); High = normal operation.
4 Bypass	Bias Voltage Output	Supplies internal bias for power stage; requires 2.2 µF ceramic capacitor to PGND for stability.
5 RIN	Right Channel Differential Input (–)	Negative input of speaker amplifier preamp; paired with LIN for balanced signal rejection.
6 GND	Analog Ground Reference	Reference for input stage and internal bandgap; must be star-connected to avoid noise coupling.
7 LIN	Left Channel Differential Input (–)	Negative input of left channel preamp; matched impedance to RIN ensures channel balance.
8 Volume	DC Gain Control Input	Analog voltage (0–VDD) sets 62-step volume; 0 V = max gain (+20 dB), VDD = min gain (–60 dB).
9 Mute	Mute Control I/O	High = outputs Hi-Z (pop-free mute); during startup, asserts high if speaker open/short detected.
10 HP/SPK	Output Mode Selection	High = headphone mode (HPLOUT/HPROUT active); Low = speaker mode (LOUTP/LOUTN/ROUTP/ROUTN active).
11 AGC	Auto Gain Control Reference	Voltage sets maximum output power limit; 0 V disables AGC, 1.6 V enables full compression range.
12 SSM	Spread Spectrum Modulation Control	Low = SSM enabled (EMI reduction); High = fixed-frequency PWM (higher efficiency, higher EMI peak).
13 VDD	Analog Supply Input	Main 2.5–6.0 V supply for analog core; decoupled with 0.1 µF + 10 µF capacitors near pin.
15 LOUTN	Left Channel Class-D Negative Output	Completes left bridge; routed with matched length to LOUTP to minimize EMI loop area.
16 LPVDD	Left Channel Power Supply	Dedicated supply for left channel power stage; improves channel separation vs. shared PVDD.
17 LOUTP	Left Channel Class-D Positive Output	Drives positive side of left bridged load; requires low-ESR output filter inductor.
19 ROUTP	Right Channel Class-D Positive Output	Paired with ROUTN to drive right speaker; layout symmetry critical for THD+N performance.
20 RPVDD	Right Channel Power Supply	Independent supply for right channel power stage; isolates supply noise between channels.
Thermal PAD	Power Ground Connection	Exposed copper pad on bottom; must be soldered to large PGND copper pour for thermal dissipation (θJC = 20 °C/W).

Key Features

Feature	Design Value
Pop-free startup/shutdown	Internal sequencing eliminates audible transients during power-up, mute toggle, and mode switching - no external soft-start circuitry required.
Speaker open/short detection	Performs impedance validation at power-on before enabling outputs, preventing damage from miswired or disconnected loads.
62-step DC volume control	Replaces digital interface (I²C/SPI) and external DAC; achieves ±0.5 dB step accuracy across full –60 dB to +20 dB range.
SSM-assisted EMI compliance	Reduces 200–1000 MHz radiated emissions by >10 dB, allowing pass/fail margin with single 0603 ferrite bead instead of LC filter.
Thermal auto-recovery	Shuts down at +150 °C junction temperature and resumes operation automatically after cooling ≥30 °C below trip point.

Applications

Portable Active Speakers

LCD Monitor Audio Subsystem

Use Scenario: Compact Bluetooth speaker with dual 4Ω drivers and battery-powered operation.

IC Role / Device Role / Timing Role: Dual-channel Class-D amplifier drives speakers; headphone driver enables auxiliary line-out; SSM minimizes RF interference with nearby Wi-Fi/BT antennas.

Use Value: 4W output sustains loudness at battery voltages down to 3.0V; 90% efficiency extends runtime; pop-free behavior ensures user experience consistency across power cycles.

Use Scenario: Integrated audio in 24-inch LCD monitor with HDMI/DP audio passthrough and 3.5mm headphone jack.

IC Role / Device Role / Timing Role: Processes PCM audio from display controller; switches between speaker and headphone modes via HP/SPK pin; AGC prevents clipping during video playback peaks.

Use Value: Single-chip solution replaces discrete amp + headphone buffer + volume IC; 105 dB channel separation prevents crosstalk in stereo imaging; thermal auto-recovery maintains reliability in enclosed chassis.

All-in-One PC Audio

Bone Conduction Headphones

Use Scenario: Fanless all-in-one desktop with front-panel speaker grilles and rear headphone port.

IC Role / Device Role / Timing Role: Amplifies stereo audio from SoC I²S; uses LPVDD/RPVDD rails to isolate left/right supply noise; Volume pin controlled by OS-level software mixer.

Use Value: 2.5V minimum supply allows operation during CPU power-save states; 40 µVrms Class-D noise prevents audible hiss in quiet office environments; compact U-QFN3030-20 saves motherboard space.

Use Scenario: Wearable bone conduction headset requiring low-impedance, high-SNR drive for transducer elements.

IC Role / Device Role / Timing Role: Class-AB headphone outputs drive 16–32Ω transducers; A-weighted 15 µV noise floor preserves speech clarity; DC volume control enables precise gain matching across units.

Use Value: Eliminates need for external output coupling capacitors (DC-coupled design); 88 mW output ensures sufficient SPL at transducer resonance; thermal shutdown protects against skin-contact overheating.

Equivalent & Alternatives

The following parts are listed as comparable options for similar stereo Class-D + headphone amplifier applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
MAX98357AETE+T	I²C-controlled Class-D only (no headphone driver); 3.2W output; no AGC or SSM; requires external volume DAC.	Suitable for speaker-only systems with digital control; lacks integrated headphone path and analog volume interface.	Select when digital audio interface (I²C) is mandatory and headphone output is handled separately.
TAS5711PAGRR	Pin-compatible 4W Class-D stereo amplifier with I²C volume/AGC/SSM; no integrated headphone driver; requires external Class-AB buffer.	Requires additional IC and PCB area for headphone function; offers more advanced digital features (EQ, DRC) but higher BOM cost.	Select when system already includes headphone amplifier or demands programmable digital audio processing beyond analog volume control.

Compared with MAX98357AETE+T and TAS5711PAGRR, the PAM8019EFS-7 uniquely integrates both Class-D speaker drive and Class-AB headphone output with analog volume control and SSM in one U-QFN3030-20 package - reducing component count, layout complexity, and total solution cost for dual-output audio endpoints.

Availability

PAM8019EFS-7 is available at Aetrix Electronics and suitable for portable active speakers, LCD monitor audio subsystems, and all-in-one PC designs requiring stable component supply, production-ready qualification, and long-term lifecycle support.

Supply support for PAM8019EFS-7 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global semiconductor company specializing in discrete, analog, and mixed-signal ICs for power management, signal integrity, and audio applications.

The PAM8019EFS-7 belongs to Diodes' PAM audio amplifier product line, designed specifically for space-constrained, battery-powered consumer audio devices requiring high efficiency, low noise, and integrated protection without external control interfaces.

FAQ

What is the purpose of the HP/SPK pin?

The HP/SPK pin selects between headphone and speaker output modes: logic high enables the Class-AB headphone driver (HPLOUT/HPROUT), while logic low activates the Class-D speaker outputs (LOUTP/LOUTN/ROUTP/ROUTN). This allows single-IC support for dual audio endpoints without external switching components, and the mode change is pop-free due to internal sequencing.

How does the AGC function protect speakers?

The AGC pin accepts a 0–1.6 V reference voltage that sets the maximum allowable output power limit. When output exceeds this threshold (e.g., during bass-heavy transients), the internal circuit reduces gain dynamically to prevent clipping and mechanical over-excursion. At 1.4 V, AGC limits output to ~2.5 W into 4 Ω - protecting 3 W-rated speakers from thermal or excursion damage.

Can the PAM8019EFS-7 operate from a single 3.7 V Li-ion cell?

Yes - the 2.5 V to 6.0 V supply range supports direct connection to a single-cell Li-ion battery (3.0–4.2 V nominal). At 3.6 V, it delivers 1.78 W per channel into 4 Ω (THD+N = 10%) with 88% efficiency, and quiescent current remains ≤8 mA in headphone mode, enabling >20-hour playback in portable designs with proper power management.

What layout guidance applies to the thermal pad?

The exposed thermal pad must be soldered to a solid PGND copper pour covering ≥25 mm², with ≥4 thermal vias (0.3 mm diameter) connecting to inner-layer ground planes. This achieves the specified θJC = 20 °C/W and prevents junction temperature exceeding +125 °C under 4 W continuous output - critical for sustained reliability in enclosed enclosures.

PAM8019EFS-7 Specifications

Product attributes: Attribute value

Manufacturer:: Diodes Incorporated

Series:: -

Package/Case:: 20-UFQFN Exposed Pad

Packaging:: Tape & Reel (TR)

Product Status:: Active

Type:: Class D

Output Type:: 2-Channel (Stereo) with Stereo Headphones

Max Output Power x Channels @ Load:: 4W x 2 @ 4Ohm; 1.78W x 2 @ 8Ohm

Voltage - Supply:: 2.5V ~ 6V

Features:: -

Mounting Type:: Surface Mount

Operating Temperature:: -40°C ~ 85°C (TA)

Grade:: -

Qualification:: -

Supplier Device Package:: U-QFN3030-20

PAM8019EFS-7 FAQ

1.How can I place an order for PAM8019EFS-7 through Aetrix?

Please submit a Request for Quotation (RFQ) for PAM8019EFS-7 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for PAM8019EFS-7 reliable?

The price and inventory of PAM8019EFS-7 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for PAM8019EFS-7 is usually 5 days.

3.What payment methods are accepted for PAM8019EFS-7?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for PAM8019EFS-7 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for PAM8019EFS-7?

PAM8019EFS-7 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your PAM8019EFS-7 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for PAM8019EFS-7?

For technical support, including PAM8019EFS-7 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your PAM8019EFS-7 requirements.

6.How does Aetrix verify that PAM8019EFS-7 is sourced from the original manufacturer or authorized distributors?

All PAM8019EFS-7 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that PAM8019EFS-7 meets industry standards.

7.What is the process for return or replacement of PAM8019EFS-7?

All PAM8019EFS-7 units undergo pre-shipment inspection (PSI). If there is an issue with PAM8019EFS-7, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The PAM8019EFS-7 part is unused and in its original packaging.

Return procedure for PAM8019EFS-7:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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