Diodes Incorporated PDR5G-13

Overview

PDR5G-13 from Diodes Incorporated is a 5A, 400V glass passivated power rectifier in PowerDI⁵ surface-mount package, designed for single-phase half-wave AC/DC conversion in industrial power supplies and auxiliary rail generation. Confirmed parameters: V_RRM = 400 V, I_O = 5 A, V_F = 0.92 V (typ) @ 5 A, t_rr = 3.3 ms, R_θJA = 45 °C/W (with optimized cathode pad).

For engineers reviewing the PDR5G-13 datasheet, PDR5G-13 pinout, PDR5G-13 application, or PDR5G-13 equivalent, this device serves as a high-reliability, AEC-Q101-qualified rectifier where low forward drop, robust surge handling (I_FSM = 100 A), and thermal performance on polyimide PCBs are critical selection criteria.

Technical Context

This rectifier employs glass-passivated die construction to minimize leakage and enhance long-term stability under thermal cycling. Its unidirectional conduction path supports resistive/inductive loads at 60 Hz, with defined derating for capacitive loads (–20% I_O).

Thermal design is tightly coupled to PCB layout: R_θJA varies from 75 °C/W (FR-4, min pad) to 45 °C/W (polyimide, enlarged cathode pad), confirming its dependence on copper area and material. Polarity is fixed - anode and cathode are assigned to left and right terminals respectively, requiring external PCB trace connection between pins.

Key Specifications

Pinout & Package

Package: PowerDI⁵, surface-mount, molded plastic case (UL 94V-0), with exposed cathode and anode terminals on opposite sides of the body. Pins must be electrically connected externally on PCB.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-current, medium-voltage rectifier applications.

Compared with SB540-E3/54 and ES5J-M3/57T, PDR5G-13 uniquely balances 400 V ruggedness, 5 A capacity, and PowerDI⁵ thermal efficiency-making it optimal for space-constrained, thermally demanding 50/60 Hz rectification where fast recovery is unnecessary.

Availability

PDR5G-13 is available at Aetrix Electronics and suitable for industrial AC/DC power supplies, automotive auxiliary power modules, and appliance control board power requiring stable component supply and AEC-Q101 compliance.

Supply support for PDR5G-13 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, specializing in high-reliability power management, signal integrity, and protection solutions.

The PDR5G-13 belongs to Diodes' PowerDI⁵ rectifier product line, engineered for high-current, low-profile surface-mount rectification in thermally constrained environments where traditional through-hole packages are impractical.

FAQ

What is the maximum allowable junction temperature for PDR5G-13?

The absolute maximum junction temperature is +150°C, as specified in the Thermal Characteristics table. Operation beyond this limit risks irreversible degradation of the glass-passivated junction and accelerated leakage growth. Derating curves (Figure 4) define safe I_O limits versus ambient temperature based on PCB thermal design.

Can PDR5G-13 be used in full-wave bridge configurations?

No - PDR5G-13 is a single-anode/single-cathode device intended for half-wave rectification. It lacks internal bridge topology or dual-diode integration. For full-wave operation, four discrete PDR5G-13 units may be assembled into a discrete bridge, but dedicated bridge rectifiers (e.g., GBPC series) are more space- and thermally efficient.

Is the PowerDI⁵ package lead-free and RoHS compliant?

Yes - PDR5G-13 uses matte tin annealed over copper leadframe and complies with RoHS Directive 2011/65/EU, including exemptions for high-temperature solder and glass under Annexes 5 and 7. Moisture sensitivity level is rated J-STD-020C Level 1, permitting standard reflow without baking.

How does PCB material affect thermal performance?

Thermal resistance varies significantly: R_θJA = 75 °C/W on FR-4 (2 oz Cu), 65 °C/W on polyimide (2 oz Cu), and 45 °C/W on polyimide with enlarged cathode pad (9.4 mm × 7.2 mm). This confirms that both substrate thermal conductivity and copper area critically determine steady-state junction temperature.