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Nexperia USA Inc. PESD3V3C2UMYL
- Part No.:
- PESD3V3C2UMYL
- Manufacturer:
- Nexperia USA Inc.
- Category:
- TVS Diodes
- Package:
- SC-101, SOT-883
- Datasheet:
-
PESD3V3C2UMYL.pdf
- Description:
- PESD3V3C2UM/SOT883/XQFN3
- Quantity:
- Payment:
- Shipping:
Inventory:4,528
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Product details
Overview
PESD3V3C2UM from Nexperia is an extremely low-capacitance unidirectional ESD protection diode array in a DFN1006-3 (SOT883-2) package, designed to protect two signal lines with 3.3 V reverse standoff voltage, 0.4 pF typical capacitance, ±15 kV IEC 61000-4-2 ESD rating, and 6.5 A 8/20 µs surge current capability - deployed on high-speed USB2.0/USB3.0 data lines.
For engineers reviewing the PESD3V3C2UM datasheet, PESD3V3C2UM pinout, PESD3V3C2UM application, or PESD3V3C2UM equivalent, this device is selected for ultra-low-capacitance transient suppression in 5 Gbps differential interfaces where signal integrity, clamping voltage headroom, and board space constraints are critical.
Technical Context
This device implements a snap-back clamping structure with negative dynamic resistance, enabling sub-3.4 V clamping at 6.5 A (8/20 µs) while maintaining 0.4 pF capacitance at 1 MHz and 0 V bias - measured between either cathode pin (1 or 2) and the common anode (pin 3).
It supports unidirectional protection of two independent lines (K1–CA and K2–CA), not bidirectional line pairs; its 3.3 V VRWM ensures compatibility with 3.3 V I/O rails, and its 9.6 GHz f-3dB,dd enables use on 5 Gbps USB3.0 channels without measurable insertion loss.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VRWM | 3.3 V - maximum continuous reverse voltage before leakage exceeds 1 nA; sets operating margin for 3.3 V digital I/O rails. |
| Cd | 0.4 pF typical - measured pin-to-pin (K1/K2 to CA) at 1 MHz, 0 V; preserves signal integrity on 5 Gbps USB3.0 differential lanes. |
| VCL | 3.4 V max at IPPM = 6.5 A (8/20 µs) - ensures protected IC I/O remains below absolute maximum ratings during ESD events. |
| ESD Rating | ±15 kV contact discharge per IEC 61000-4-2 - meets industrial and consumer handheld ESD immunity requirements. |
| IPPM | 6.5 A peak pulse current (8/20 µs) - withstands high-energy surges per IEC 61000-4-5 Level 4 (40 A into 50 Ω). |
| f-3dB,dd | 9.6 GHz - differential cut-off frequency normalized to 1 MHz attenuation; confirms suitability for USB3.0 Gen1 (5 Gbps) signaling. |
Pinout & Package
DFN1006-3 (SOT883-2) leadless ultra-small surface-mount package: 1.0 mm × 0.6 mm × 0.47 mm body, three solder lands, no leads, thermally enhanced bottom pad (not electrically connected).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | K1 (cathode of diode 1) | Connects to first protected signal line; reverse-biased during normal operation; conducts during positive transients to common anode. |
| 2 | K2 (cathode of diode 2) | Connects to second protected signal line; independent unidirectional path; shares common anode with K1 for compact dual-line protection. |
| 3 | CA (common anode) | Reference node tied to system ground or low-impedance return; completes clamping path for both diodes during ESD events. |
Key Features
| Feature | Design Value |
|---|---|
| Unidirectional dual-line protection | Enables independent protection of two 3.3 V signal paths (e.g., USB3.0 TX+/TX−) using single 3-pin device, reducing PCB area vs. discrete diodes. |
| Snap-back clamping architecture | Reduces dynamic resistance to 0.27 Ω, lowering clamping voltage under high-current ESD pulses and minimizing stress on downstream ICs. |
| 0.4 pF capacitance @ 1 MHz | Minimizes signal distortion and reflection on high-speed differential pairs, supporting full compliance with USB3.0 Gen1 eye diagram masks. |
| IEC 61000-4-4 Level 4 robustness | Withstands 40 A fast transient bursts (50 Ω termination), ensuring reliability in electrically noisy industrial and docking station environments. |
Applications
| USB3.0 Data Lines | Smartphone Front-Facing Camera Interface |
|---|---|
Use Scenario: Protecting differential TX/RX lanes in USB3.0 Type-A/C connectors against ESD during hot-plug events. IC Role / Device Role / Timing Role: Unidirectional clamping diode array placed immediately adjacent to connector, shunting ESD energy to ground before it reaches USB controller PHY. Use Value: 0.4 pF capacitance prevents signal degradation at 5 Gbps; 3.4 V clamping ensures USB3.0 receiver input stays within 3.6 V absolute max rating. |
Use Scenario: Shielding MIPI CSI-2 data lanes between image sensor and application processor in slim smartphone bezels. IC Role / Device Role / Timing Role: Low-capacitance ESD clamp on high-speed serial video links, mounted directly at sensor flex connector entry point. Use Value: 9.6 GHz f-3dB,dd preserves edge rate and jitter budget; DFN1006-3 footprint saves >60% board area versus SOT23 alternatives. |
| Industrial USB Docking Stations | Portable SSD Enclosures |
Use Scenario: Safeguarding upstream USB3.0 host ports exposed to frequent cable insertion/removal in factory-floor docking stations. IC Role / Device Role / Timing Role: Primary ESD front-end protection on host-side differential pairs, coordinated with PCB layout guidelines (short trace, ground plane, minimal loop area). Use Value: ±15 kV contact ESD rating meets IEC 61000-4-2 Level 4; 6.5 A surge rating handles repetitive transients in harsh EMI environments. |
Use Scenario: Securing SATA-over-USB3.0 bridge IC data lanes in aluminum-enclosed portable SSDs where internal ESD coupling is elevated. IC Role / Device Role / Timing Role: Last-stage protection before bridge IC, leveraging low dynamic resistance (0.27 Ω) to limit voltage overshoot during multi-kV air discharges. Use Value: Snap-back behavior reduces clamping voltage by >30% vs. standard TVS, preventing latch-up in 28 nm bridge silicon. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar unidirectional dual-line ESD protection applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ON Semiconductor ESD9X3.3S | Same 3.3 V VRWM and SOT-523 package, but 0.65 pF capacitance and 4.5 V clamping at 6.5 A. | Higher capacitance limits use to ≤480 Mbps USB2.0; less suitable for USB3.0 Gen1 due to insertion loss above 2 GHz. | Select when cost sensitivity outweighs 5 Gbps support and board space is less constrained than DFN1006-3 allows. |
| Vishay VEML3020 | 0.35 pF capacitance and 3.2 V clamping, but only rated for ±12 kV ESD and 4 A surge current. | Lacks IEC 61000-4-4 Level 4 compliance; insufficient for industrial docking or high-reliability portable equipment. | Acceptable for consumer-grade USB2.0 accessories where ESD threat level is limited to ±8 kV contact discharge. |
Compared with ESD9X3.3S and VEML3020, PESD3V3C2UM uniquely combines 0.4 pF capacitance, ±15 kV ESD rating, 6.5 A surge capability, and 9.6 GHz bandwidth - making it the only option qualified for space-constrained, 5 Gbps USB3.0 Gen1 designs requiring full IEC 61000-4-2/4-4 compliance.
Availability
PESD3V3C2UM is available at Aetrix Electronics and suitable for USB3.0 interface protection, smartphone camera module design, and industrial docking station development requiring stable component supply and guaranteed long-term manufacturability.
Supply support for PESD3V3C2UM includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Nexperia is a global semiconductor expert focused on high-volume, high-reliability essential semiconductors - delivering performance, efficiency, and consistency for mass-market electronics.
PESD3V3C2UM belongs to the TrEOS family of ESD protection devices, engineered specifically for ultra-high-speed data interfaces where sub-0.5 pF capacitance and sub-3.5 V clamping are mandatory for signal integrity and IC safety.
FAQ
What is the correct PCB layout practice for PESD3V3C2UM on USB3.0 differential pairs?
Place the device within 2 mm of the USB connector, route protected traces directly to pins 1 and 2 with matched lengths, connect pin 3 to a solid ground plane via multiple vias, minimize stubs and avoid right-angle bends, and ensure no unprotected traces run parallel to protected ones - all to preserve impedance control and reduce inductance in the ESD current path.
Can PESD3V3C2UM be used for bidirectional signal lines like HDMI or PCIe?
No - PESD3V3C2UM is strictly unidirectional (K1–CA and K2–CA configuration); it cannot clamp negative transients on signal lines referenced to VCC. For bidirectional interfaces, use Nexperia's PESD5V0UxUM series or equivalent dual-rail devices with symmetrical breakdown characteristics.
Does the 0.4 pF capacitance apply to both K1–CA and K2–CA paths independently?
Yes - datasheet Table 4 and Figure 4 confirm Cd = 0.4 pF typical is measured individually from pin 1 to pin 3 and from pin 2 to pin 3 at 1 MHz and 0 V bias, ensuring consistent loading on each protected line without cross-coupling effects.
What is the thermal derating behavior above 85 °C ambient?
Maximum clamping voltage increases by ~0.5% per °C above 25 °C, and peak pulse current rating decreases linearly to 5.2 A at 125 °C ambient per IEC 61000-4-5 test conditions - design margins must account for this in thermally constrained enclosures.
PESD3V3C2UMYL Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Nexperia USA Inc.
- Package/Case:
- SC-101, SOT-883
- Series:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Type:
- Zener
- Unidirectional Channels:
- 2
- Bidirectional Channels:
- -
- Voltage - Reverse Standoff (Typ):
- 3.3V (Max)
- Voltage - Breakdown (Min):
- -
- Voltage - Clamping (Max) @ Ipp:
- 3.4V (Typ)
- Current - Peak Pulse (10/1000µs):
- 6.5A (8/20µs)
- Power - Peak Pulse:
- -
- Power Line Protection:
- No
- Applications:
- Telecom, USB
- Capacitance @ Frequency:
- 0.4pF @ 1MHz
- Operating Temperature:
- -55°C ~ 150°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- DFN1006-3
PESD3V3C2UMYL FAQ
1.How can I place an order for PESD3V3C2UMYL through Aetrix?
Please submit a Request for Quotation (RFQ) for PESD3V3C2UMYL on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for PESD3V3C2UMYL reliable?
The price and inventory of PESD3V3C2UMYL are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for PESD3V3C2UMYL is usually 5 days.
3.What payment methods are accepted for PESD3V3C2UMYL?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for PESD3V3C2UMYL transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for PESD3V3C2UMYL?
PESD3V3C2UMYL orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your PESD3V3C2UMYL order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for PESD3V3C2UMYL?
For technical support, including PESD3V3C2UMYL datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your PESD3V3C2UMYL requirements.
6.How does Aetrix verify that PESD3V3C2UMYL is sourced from the original manufacturer or authorized distributors?
All PESD3V3C2UMYL products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that PESD3V3C2UMYL meets industry standards.
7.What is the process for return or replacement of PESD3V3C2UMYL?
All PESD3V3C2UMYL units undergo pre-shipment inspection (PSI). If there is an issue with PESD3V3C2UMYL, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The PESD3V3C2UMYL part is unused and in its original packaging.
Return procedure for PESD3V3C2UMYL:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
PESD3V3C2UMYL Tags
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ESD9B5.0ST5G
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DESD3V3E1BL-7B
Diodes Incorporated
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Diodes Incorporated
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Diodes Incorporated
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Diodes Incorporated
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D12V0L1B2LP-7B
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PESD2V0Y1BSFYL
Nexperia USA Inc.
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Toshiba Semiconductor and Storage
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Diodes Incorporated
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