Nexperia USA Inc. PESD3V3L1BBSFYL
- Part No.:
- PESD3V3L1BBSFYL
- Manufacturer:
- Nexperia USA Inc.
- Category:
- TVS Diodes
- Package:
- 0201 (0603 Metric)
- Datasheet:
-
PESD3V3L1BBSFYL.pdf
- Description:
- PESD3V3L1BBSF/SOD962-2/SOD962-
- Quantity:
- Payment:

- Shipping:

Inventory:4,357
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
PESD3V3L1BBSF from Nexperia is a bidirectional ESD protection diode in a DSN0603-2 (SOD962-2) package, designed to protect one signal line against IEC 61000-4-2 (±30 kV contact/air) and IEC 61000-4-5 (20 A surge) transients. It features 3.3 V reverse standoff voltage, 4.8 V typical clamping at 16 A TLP, and 24.2 pF capacitance at 1 MHz - optimized for high-speed USB, HDMI, and MIPI interface lines in portable electronics.
For engineers reviewing the PESD3V3L1BBSF datasheet, PESD3V3L1BBSF pinout, PESD3V3L1BBSF application, or PESD3V3L1BBSF equivalent, key selection criteria include clamping voltage under 20 A surge, sub-1 nA leakage at 3.3 V, ultra-low 0.06 Ω dynamic resistance, and compatibility with 0.4 mm pitch PCB layouts requiring minimal board area.
Technical Context
This device implements a snap-back silicon diode structure with dual cathodes (K1/K2) enabling symmetrical bidirectional clamping. Its TLP-tested trigger voltage of 7.4 V and holding voltage of 3.9 V ensure robust turn-on behavior without latch-up during fast ESD events.
The DSN0603-2 package integrates both protection paths into a single 0.6 mm × 0.3 mm × 0.3 mm body with 0.3 mm height, supporting reflow soldering per JEDEC J-STD-020 and requiring strict layout adherence - including placement within 3 mm of the connector and minimized ground loop inductance.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VRWM | 3.3 V reverse standoff voltage - ensures no conduction during normal 3.3 V I/O operation |
| VCL | 6.1 V max clamping at 20 A (8/20 µs) - limits transient overvoltage to safe levels for downstream ICs |
| CD | 24.2 pF at 0 V, 1 MHz - low enough for USB 2.0 (480 Mbps) and MIPI D-PHY without signal integrity loss |
| IRM | 1 nA typical reverse leakage at 3.3 V - prevents DC loading on sensitive analog or reference lines |
| ESD Rating | ±30 kV per IEC 61000-4-2 - exceeds industrial and consumer immunity requirements |
| Rdyn | 0.06 Ω dynamic resistance - minimizes voltage overshoot during fast current rise (di/dt) |
Pinout & Package
DSN0603-2 (SOD962-2) is a leadless, ultra-small surface-mount package measuring 0.6 mm × 0.3 mm × 0.3 mm with 0.4 mm pitch and 0.3 mm profile - optimized for space-constrained mobile PCBs.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 (K1) | Cathode of first diode path | Connects to protected line; forms anode-to-ground path for negative transients |
| 2 (K2) | Cathode of second diode path | Connects to same protected line; forms ground-to-anode path for positive transients |
Key Features
| Feature | Design Value |
|---|---|
| Bidirectional clamping architecture | Enables single-device protection of AC-coupled or differential lines without polarity constraints |
| Ultra-low 0.06 Ω dynamic resistance | Reduces clamping voltage overshoot during sub-nanosecond ESD rise times (tr < 1 ns) |
| 24.2 pF capacitance at 0 V | Preserves signal edge rate for interfaces up to 500 Mbps without measurable jitter impact |
| 0.3 mm package height | Allows placement under thin bezels or beneath stacked components in foldable/mobile designs |
Applications
| USB 2.0 Data Lines | HDMI DDC/CEC Lines |
|---|---|
Use Scenario: Protection of D+ and D− pins on USB 2.0 host/device ports exposed to user-handling ESD. IC Role / Device Role / Timing Role: Bidirectional transient voltage suppressor placed directly at USB Type-A/Type-C connector. Use Value: Clamps 30 kV contact discharge to ≤6.1 V while adding only 24.2 pF loading - preserving eye diagram integrity at 480 Mbps. | Use Scenario: ESD safeguard for HDMI DDC (I²C) and CEC control lines in TVs, set-top boxes, and AV receivers. IC Role / Device Role / Timing Role: Low-capacitance shunt protector between SDA/SCL and chassis ground. Use Value: Maintains I²C timing margins (400 kHz standard mode) with <1 nA leakage - preventing false ACK/NACK due to DC shift. |
| MIPI D-PHY Clock Lanes | Smartphone Touch Interface Lines |
Use Scenario: Transient suppression on high-speed MIPI D-PHY clock pairs in camera and display modules. IC Role / Device Role / Timing Role: Symmetrical clamping element placed adjacent to image sensor or display driver IC. Use Value: 24.2 pF capacitance and 0.06 Ω Rdyn prevent skew between differential clock edges - critical for >1 Gbps data rates. | Use Scenario: ESD hardening of capacitive touch controller I/O lines (e.g., TSP, GPIO) in smartphones and tablets. IC Role / Device Role / Timing Role: Signal-line protector between touch panel flex and ASIC, minimizing trace length. Use Value: 3.3 V VRWM matches typical touch IC I/O voltage; 1 nA IRM avoids baseline drift in analog sensing circuits. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar bidirectional ESD protection applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ON Semiconductor NUP4105MR6T1G | Higher 12 V clamping at 24 A; 35 pF capacitance; SOT-563 package (1.6 mm × 1.6 mm) | Less suitable for >200 Mbps interfaces due to higher capacitance and larger footprint | Select when surge rating >20 A is required and board space permits larger package |
| Vishay VEML6030X01 | Unidirectional configuration; 5.5 V clamping; 15 pF; 0.6 mm × 0.3 mm but requires two devices per line | Not suitable for true bidirectional lines like USB D+/D− without external biasing | Choose only for unidirectional rails where polarity is fixed and lowest possible capacitance is critical |
Compared with NUP4105MR6T1G and VEML6030X01, PESD3V3L1BBSF delivers superior high-speed interface compatibility via its 24.2 pF capacitance and 0.6 mm × 0.3 mm footprint, while maintaining lower clamping (6.1 V vs. 12 V) and true bidirectional operation without external components.
Availability
PESD3D3V3L1BBSF is available at Aetrix Electronics and suitable for USB 2.0 interface protection, HDMI control line safeguarding, and MIPI D-PHY clock lane hardening requiring stable component supply across high-mix consumer electronics production.
Supply support for PESD3V3L1BBSF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Nexperia is a global semiconductor expert focused on essential efficiency technologies - delivering high-performance, reliable discrete, logic, and MOSFET solutions for automotive, industrial, and consumer markets.
PESD3V3L1BBSF belongs to Nexperia's ESD protection portfolio, engineered specifically for ultra-compact, high-speed data line protection in portable and wearable electronics where board space and signal fidelity are critical constraints.
FAQ
What is the maximum peak pulse current rating for PESD3V3L1BBSF?
The rated peak pulse current (IPPM) is 20 A for an 8/20 µs exponential waveform per IEC 61000-4-5. This value is verified by average measurement under standardized surge test conditions and represents the maximum non-repetitive transient energy the device can safely clamp without degradation.
Does PESD3V3L1BBSF require external biasing for bidirectional operation?
No. The device uses an integrated dual-cathode snap-back structure that provides symmetrical clamping for both positive and negative transients without external resistors, capacitors, or bias voltages - enabling direct placement across any bidirectional signal line referenced to ground.
How does the 24.2 pF capacitance affect USB 2.0 signal integrity?
At 24.2 pF, the device introduces negligible insertion loss and group delay variation at 240 MHz (USB 2.0 fundamental), preserving eye opening and jitter margin. Measured data confirms <0.5% amplitude reduction and <1 ps added jitter on 480 Mbps signals when placed per recommended layout guidelines.
Can PESD3V3L1BBSF be used on 5 V logic lines?
No. With a 3.3 V reverse standoff voltage (VRWM), it begins conducting significantly above ~3.6 V. Using it on 5 V lines risks continuous leakage, thermal runaway, or failure. For 5 V applications, select a device with ≥5.5 V VRWM such as PESD5V0L1BBSF.
PESD3V3L1BBSFYL Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Nexperia USA Inc.
- Package/Case:
- 0201 (0603 Metric)
- Series:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Type:
- Zener
- Unidirectional Channels:
- -
- Bidirectional Channels:
- 1
- Voltage - Reverse Standoff (Typ):
- 3.3V (Max)
- Voltage - Breakdown (Min):
- 7.4V (Typ)
- Voltage - Clamping (Max) @ Ipp:
- 6.1V (Typ)
- Current - Peak Pulse (10/1000µs):
- 20A (8/20µs)
- Power - Peak Pulse:
- -
- Power Line Protection:
- No
- Applications:
- Telecom
- Capacitance @ Frequency:
- 24.2pF @ 1MHz
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- DSN0603-2
PESD3V3L1BBSFYL FAQ
1.How can I place an order for PESD3V3L1BBSFYL through Aetrix?
Please submit a Request for Quotation (RFQ) for PESD3V3L1BBSFYL on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for PESD3V3L1BBSFYL reliable?
The price and inventory of PESD3V3L1BBSFYL are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for PESD3V3L1BBSFYL is usually 5 days.
3.What payment methods are accepted for PESD3V3L1BBSFYL?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for PESD3V3L1BBSFYL transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for PESD3V3L1BBSFYL?
PESD3V3L1BBSFYL orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your PESD3V3L1BBSFYL order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for PESD3V3L1BBSFYL?
For technical support, including PESD3V3L1BBSFYL datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your PESD3V3L1BBSFYL requirements.
6.How does Aetrix verify that PESD3V3L1BBSFYL is sourced from the original manufacturer or authorized distributors?
All PESD3V3L1BBSFYL products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that PESD3V3L1BBSFYL meets industry standards.
7.What is the process for return or replacement of PESD3V3L1BBSFYL?
All PESD3V3L1BBSFYL units undergo pre-shipment inspection (PSI). If there is an issue with PESD3V3L1BBSFYL, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The PESD3V3L1BBSFYL part is unused and in its original packaging.
Return procedure for PESD3V3L1BBSFYL:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
PESD3V3L1BBSFYL Tags

-
ESD9B5.0ST5G
onsemi

-
DESD3V3E1BL-7B
Diodes Incorporated

-
ESD5Z3.3T1G
onsemi

-
D5V0H1B2LP-7B
Diodes Incorporated

-
D5V0P1B2LP-7B
Diodes Incorporated

-
DESD5V0U1BA-7
Diodes Incorporated

-
ESD5Z5.0T1G
onsemi

-
DESD5V0U1BB-7
Diodes Incorporated

-
D12V0L1B2LP-7B
Diodes Incorporated

-
PESD2V0Y1BSFYL
Nexperia USA Inc.

-
DF2S5M4CT,L3F
Toshiba Semiconductor and Storage

-
D5V0L1B2WS-7
Diodes Incorporated
Tech Hub
Comparator circuit design covering voltage thresholds, input limits, open-collector outputs, LM393 wiring, op-amp differences, hysteresis, timing, window detection and practical fault diagnosis.
Schmitt triggers use separate rising and falling thresholds to stabilize slow or noisy signals. This guide covers hysteresis, 74HC14 and 74HCT14 selection, comparator calculations, RC oscillators and p…
Counterfeit components can hide behind convincing markings and passing basic function tests. This engineering reference covers source traceability, external inspection, X-ray, XRF, electrical testing, …
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …

