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STMicroelectronics PM6670AS

Part No.:
PM6670AS
Manufacturer:
STMicroelectronics
Category:
Power Management - Specialized
Package:
24-VFQFN Exposed Pad
Datasheet:
AetrixPM6670AS.pdf
Description:
IC CTLR DDR2/3 MEM PS VFQFPN-24
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,853

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Product details

Overview

PM6670AS from STMicroelectronics is a complete DDR2/3 memory power supply controller integrating a constant-on-time (COT) buck controller for VDDQ, a 2 A sink/source LDO for VTT termination, and a ±15 mA low-noise buffered VTTREF. It delivers fixed 1.8 V (DDR2) or 1.5 V (DDR3) VDDQ outputs with ±1% accuracy, supports ceramic output capacitors, and enables S3/S4/S5 system sleep-state compliance. Used in DDR memory subsystems of digital TVs and embedded computing platforms.

For engineers reviewing the PM6670AS datasheet, PM6670AS pinout, PM6670AS application, or PM6670AS equivalent, key selection criteria include its dual-mode COT control architecture, RDS(ON)-based current sensing, negative current limit capability, non-tracking VDDQ discharge, and multilevel MODE/DDRSEL logic for DDR voltage and pulse-skip mode selection.

Technical Context

The PM6670AS implements a constant-on-time (COT) PWM control loop for the VDDQ buck stage, using VSNS for remote output sensing and COMP for DC error compensation via an embedded integrator that cancels ripple-induced DC offset. Its gate drivers feature anti-cross-conduction logic, 0.6–2.7 Ω on-resistance, and bootstrap (BOOT) biasing for high-side drive.

The VTT section integrates a foldback-limited 2 A linear regulator with VTTSNS remote sensing, high-Z output in S3 state, and tracking discharge behavior when LDOIN = VDDQ. The VTTREF buffer delivers 0.9 V (DDR2) or 0.75 V (DDR3) referenced to VSNS/2 with ±2% accuracy and 15 mA drive capability.

Key Specifications

Parameter Value and Actual Design Meaning
VDDQ Output Voltage 1.8 V (DDR2) or 1.5 V (DDR3), fixed; ±1% accuracy ensures JEDEC-compliant memory bus voltage stability.
VDDQ Input Range 4.5 V to 36 V; supports wide-input industrial and telecom power rails without pre-regulation.
VTT LDO Output 0.9 V (DDR2) or 0.75 V (DDR3); 2 A sink/source capability handles bidirectional SSTL/HSTL termination currents.
VTTREF Accuracy ±2% vs VSNS/2; enables precise VTT tracking across temperature and load for stable bus termination.
Switching Frequency Adjustable via VOSC resistor divider; typical 300–500 kHz range balances efficiency, EMI, and transient response.
Soft-Start Time Internally fixed at 3 ms; prevents inrush current during power-up while supporting multi-rail sequencing.
Protection Features Latched OVP/UVP, thermal shutdown, negative current limit, and programmable tracking/non-tracking discharge ensure robust DDR rail safety.

Pinout & Package

PM6670AS is housed in a VFQFPN-24 4×4 mm exposed-pad package, optimized for thermal dissipation in high-current memory power applications.

Pin/Terminal Circuit Role Design Meaning
1 VTTGND LDO power ground Low-impedance return path for VTT current; must connect to thermal pad and SGND plane for thermal and noise integrity.
2 VTTSNS VTT remote sense input Enables accurate VTT regulation at load point; requires short, low-noise PCB trace to DDR termination node.
3 DDRSEL DDR voltage mode selector Configures VDDQ output as 1.8 V (DDR2) or 1.5 V (DDR3); also selects pulse-skip modes when MODE < 3 V.
4 VTTREF Buffered reference output Provides low-noise 0.9 V/0.75 V reference for VTT; requires ≥22 nF ceramic bypass for stability.
5 SGND Analog ground reference Common ground for VTTREF, control logic, and analog circuitry; must tie to thermal pad and VTTGND.
6 AVCC +5 V logic supply Powers internal logic and reference circuits; requires RC filter to suppress digital noise coupling.
7 VREF 1.237 V precision reference Stable bandgap reference for multilevel pin thresholds; 50 μA drive capability supports external resistor networks.
8 VOSC Frequency setting input Resistor-divider tap sets switching frequency; floating prohibited-ensures deterministic COT timing.
9 VSNS VDDQ remote sense input Enables accurate VDDQ regulation at memory IC pins; also provides VDDQ/2 for VTTREF/VTT scaling.
10 MODE Operation mode selector High (>4 V): fixed VDDQ mode; Low (<4 V): adjustable mode with COMP feedback-defines control architecture.
11 COMP Error amplifier compensation Connects external RC network to stabilize COT loop; compensates for ceramic capacitor ESR zero.
12 DSCG Discharge mode control Selects tracking (fast) or non-tracking (soft) VDDQ/VTT discharge during S5 entry-critical for JEDEC S5 compliance.
13 S5 S5 system status input Enables full S0–S5 power management; forces shutdown and discharge activation when pulled low per ACPI spec.
14 S3 S3 system status input Places VTT in high-Z state during Suspend-to-RAM; preserves DDR data retention while minimizing leakage.
15 PG Power-Good open-drain output Asserts high when VDDQ is within ±10%; used for system power sequencing and fault monitoring.
16 PGND Switching section ground Separate ground for high-current buck stage; minimizes noise coupling into analog control circuitry.
17 LGATE Low-side MOSFET driver Drives synchronous rectifier with 0.6–2.1 Ω pull-down resistance; supports efficient light-load operation.
18 VCC Low-side gate driver supply +5 V supply for LGATE; bypassed with 100 nF capacitor to PGND for gate drive stability.
19 CSNS Current sense input Connects to MOSFET drain for RDS(ON) sensing-eliminates current-sense resistor and associated losses.
20 PHASE Switch node connection High dv/dt node linking HGATE/LGATE outputs and inductor; requires tight layout to minimize ringing.
21 HGATE High-side MOSFET driver Bootstrap-driven output with 1.8–3 Ω on-resistance; enables N-channel high-side switch without external charge pump.
22 BOOT Bootstrap capacitor connection Supplies floating gate drive for HGATE; requires 100 nF ceramic capacitor between BOOT and PHASE.
23 LDOIN VTT LDO input supply Accepts VDDQ or lower auxiliary rail; reduces LDO power dissipation when VDDQ > VTT by >0.5 V.
24 VTT VTT termination output 2 A sink/source linear regulator output; bypassed with 20 μF (2×10 μF MLCC) for low-ESR termination stability.

Key Features

Feature Design Value
RDS(ON) current sensing Eliminates external sense resistor-reduces BOM cost, board space, and conduction losses in high-current VDDQ paths.
Constant-on-time (COT) control Delivers sub-10 μs load transient response without complex loop compensation-ideal for DDR dynamic current demands.
Programmable pulse-skip modes Supports standard pulse-skip and no-audible (33 kHz) variants-enables light-load efficiency optimization without acoustic noise.
S3/S5 power state compliance Hardware-enforced VTT high-Z in S3 and coordinated VDDQ/VTT discharge in S5-meets JEDEC ACPI sleep-state requirements.
Output ripple compensation Embedded integrator cancels DC error from ceramic capacitor ripple-maintains ±1% VDDQ accuracy without electrolytic bulk caps.

Applications

DDR2 Memory Power Supply DDR3 Memory Power Supply

Use Scenario: Providing regulated 1.8 V VDDQ and 0.9 V VTT for DDR2 SDRAM in set-top boxes and media processors.

IC Role / Device Role / Timing Role: Dual-rail power controller managing VDDQ buck conversion and VTT linear termination with synchronized discharge sequencing.

Use Value: Enables JEDEC-compliant DDR2 bus operation with fast transient response to burst read/write cycles and S3/S5 state transitions.

Use Scenario: Delivering 1.5 V VDDQ and 0.75 V VTT for DDR3 modules in network-attached storage and industrial controllers.

IC Role / Device Role / Timing Role: Integrated power management IC handling VDDQ regulation, VTT termination, and VTTREF buffering with shared VSNS feedback.

Use Value: Reduces component count versus discrete solutions while maintaining ±1% VDDQ accuracy and 2 A bidirectional VTT current handling.

Digital TV System Power SSTL/HSTL Bus Termination

Use Scenario: Powering DDR2/DDR3 memory subsystems in digital TVs requiring low standby power and silent operation.

IC Role / Device Role / Timing Role: System-level memory power controller supporting no-audible pulse-skip mode and S3 high-Z VTT for ultra-low-power suspend states.

Use Value: Eliminates audible coil whine during light-load conditions and ensures rapid wake-from-suspend with controlled VDDQ ramp.

Use Scenario: Implementing JEDEC-compliant SSTL18, SSTL15, and HSTL termination in FPGA-based video processing boards.

IC Role / Device Role / Timing Role: Precision termination voltage generator providing matched VTT and VTTREF referenced to VSNS/2 for impedance-controlled signaling.

Use Value: Maintains signal integrity across high-speed parallel buses by minimizing VTT drift relative to VDDQ and reducing ground bounce.

Equivalent & Alternatives

The following parts are listed as comparable options for similar DDR memory power supply applications.

Alternative Part Technical Difference Application Difference Selection Advice
ISL6537IRZ Fixed 1.8 V/1.5 V VDDQ only; no integrated VTT LDO or VTTREF-requires external components for full DDR solution. Lacks S3/S5 support and VTT discharge control; suitable for simpler DDR2-only designs without deep-sleep requirements. Select when VTT/VTTREF are provided externally and system does not require hardware-managed sleep-state discharge.
TPS51200DRCR Integrated VTT LDO and VTTREF, but uses current-mode PWM-not COT-resulting in slower transient response and higher compensation complexity. Requires external RSENSE; less efficient at light load due to absence of no-audible pulse-skip mode. Prefer when design already uses TI ecosystem and prioritizes broad vendor support over fastest DDR transient performance.

Compared with ISL6537IRZ and TPS51200DRCR, the PM6670AS uniquely combines COT-based VDDQ control, integrated VTT/VTTREF, and hardware-enforced S3/S5 discharge in a single VFQFPN-24 package-reducing total solution size and simplifying JEDEC compliance validation.

Availability

PM6670AS is available at Aetrix Electronics and suitable for DDR2/3 memory power supplies, digital TV systems, and SSTL/HSTL bus termination applications requiring stable component supply and long-term industrial availability.

Supply support for PM6670AS includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader specializing in power management, microcontrollers, and automotive ICs, with strong focus on industrial and consumer power solutions.

The PM6670AS belongs to ST's DDR memory power controller product line, designed specifically to simplify JEDEC-compliant DDR2/DDR3 power delivery with integrated VDDQ, VTT, and VTTREF functions in a thermally enhanced package.

FAQ

What is the purpose of the VSNS pin and how should it be routed?

The VSNS pin provides remote sensing of the VDDQ output voltage at the memory IC load point, enabling accurate regulation despite PCB trace IR drop. It must be routed as a short, low-noise, dedicated trace directly from the DDR VDDQ pin to VSNS, avoiding shared vias or noisy planes. This trace also feeds the internal VSNS/2 divider used for VTTREF and VTT scaling, making its placement critical for termination accuracy.

How does the PM6670AS achieve fast load transient response without external compensation?

The PM6670AS uses a constant-on-time (COT) control architecture with an embedded integrator that automatically compensates for DC voltage error caused by output capacitor ripple-especially critical with low-ESR ceramic capacitors. This eliminates the need for external Type-II/III compensation networks on the COMP pin, while delivering sub-10 μs transient recovery for DDR burst current steps up to 10 A.

Can the PM6670AS support both DDR2 and DDR3 on the same board?

Yes-the MODE and DDRSEL pins allow hardware-selectable configuration: tying MODE to AVCC and DDRSEL to SGND sets 1.8 V VDDQ/0.9 V VTT for DDR2; tying both to AVCC configures 1.5 V VDDQ/0.75 V VTT for DDR3. The shared VSNS/2 reference ensures consistent VTT-to-VDDQ ratio across both standards, enabling single-board dual-memory support with appropriate layout partitioning.

What happens to VTT during S3 (Suspend-to-RAM) state?

When the S3 pin is driven low, the VTT LDO enters high-impedance (Hi-Z) mode-disconnecting the VTT output from the termination bus while preserving DDR memory data in self-refresh. This reduces system standby power significantly. VTT remains Hi-Z until S3 returns high, at which point VTT resumes regulation with soft-start to prevent bus disturbance during resume.

PM6670AS Specifications

Product attributes
Attribute value
Manufacturer:
STMicroelectronics
Series:
-
Package/Case:
24-VFQFN Exposed Pad
Packaging:
Tube
Product Status:
Obsolete
Applications:
Memory, DDR2/DDR3 Regulator
Current - Supply:
800µA
Voltage - Supply:
4.5V ~ 28V
Operating Temperature:
-40°C ~ 85°C
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
24-VFQFPN (4x4)

PM6670AS FAQ

1.How can I place an order for PM6670AS through Aetrix?

Please submit a Request for Quotation (RFQ) for PM6670AS on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for PM6670AS reliable?

The price and inventory of PM6670AS are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for PM6670AS is usually 5 days.

3.What payment methods are accepted for PM6670AS?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for PM6670AS transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for PM6670AS?

PM6670AS orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your PM6670AS order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for PM6670AS?

For technical support, including PM6670AS datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your PM6670AS requirements.

6.How does Aetrix verify that PM6670AS is sourced from the original manufacturer or authorized distributors?

All PM6670AS products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that PM6670AS meets industry standards.

7.What is the process for return or replacement of PM6670AS?

All PM6670AS units undergo pre-shipment inspection (PSI). If there is an issue with PM6670AS, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The PM6670AS part is unused and in its original packaging.

Return procedure for PM6670AS:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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