Nexperia USA Inc. PMEG030V050EPEZ

Overview

PMEG030V050EPEZ from Nexperia is a 30 V, 5 A planar Schottky barrier rectifier in CFP15B (SOT1289B) package, designed for low-voltage, high-efficiency DC-to-DC conversion and freewheeling applications. It delivers a typical forward voltage of 440 mV at 5 A and 25 °C, reverse leakage of 45 µA at 30 V, and features clip-bond technology for enhanced thermal performance and power capability.

For engineers reviewing the PMEG030V050EPEZ datasheet, PMEG030V050EPEZ pinout, PMEG030V050EPEZ application, or PMEG030V050EPEZ equivalent, key selection criteria include its ultra-low VF, 120 A non-repetitive peak forward current, 3 K/W junction-to-solder-point thermal resistance, and suitability for OR-ing and reverse polarity protection in space-constrained SMD designs.

Technical Context

This Schottky rectifier uses a planar silicon die with metal-semiconductor junction architecture optimized for minimal forward conduction loss and fast switching. Its clip-bond interconnect directly attaches the die to the cathode lead frame, reducing thermal resistance and enabling stable operation up to 175 °C junction temperature.

The device exhibits negligible reverse recovery (trr ≤ 16 ns step recovery), no minority-carrier storage, and low diode capacitance (470 pF at 1 V, 160 pF at 10 V), making it suitable for high-frequency switching topologies where switching loss and EMI must be minimized.

Key Specifications

Pinout & Package

Encapsulated in CFP15B (SOT1289B): ultra-thin, thermally enhanced SMD plastic package measuring 5.8 × 4.3 × 0.95 mm with 2.13 mm lead pitch and exposed cathode thermal pad.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar Schottky rectifier applications.

Compared with VS-50WQ03FN-M3/45 and NSR0530P2T5G, PMEG030V050EPEZ uniquely combines 5 A continuous rating, 0.95 mm profile, and 3 K/W thermal resistance-enabling high-power density in fully SMD, low-profile power stages where thermal and spatial constraints are critical.

Availability

PMEG030V050EPEZ is available at Aetrix Electronics and suitable for high-efficiency DC-DC converters, reverse polarity protection circuits, and OR-ing power distribution systems requiring stable component supply and consistent parametric performance across production lots.

Supply support for PMEG030V050EPEZ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Nexperia is a global semiconductor expert focused on high-volume, high-reliability discrete and logic devices, with leadership in advanced packaging and automotive-qualified components.

The PMEG030V050EPEZ belongs to Nexperia's low-VF Schottky rectifier product line, engineered specifically for minimizing conduction losses in compact, high-frequency power conversion and protection circuits.

FAQ

What is the maximum junction temperature and how does it affect continuous current rating?

The absolute maximum junction temperature is 175 °C. At this limit, the device supports 5 A average forward current only when the solder point temperature remains ≤171 °C under δ = 0.5 square-wave conditions. Exceeding Tj degrades VF stability and accelerates IR drift; derating is required above 100 °C ambient on standard FR4.

Can PMEG030V050EPEZ be used in place of a MOSFET-based ideal diode controller?

No-it is a passive Schottky rectifier, not a controlled ideal diode. It lacks active gate drive and cannot match the <20 mV forward drop of MOSFET solutions. However, it eliminates control complexity and cost in applications where 440 mV VF is acceptable, such as secondary-side rectification in non-isolated buck converters.

Is the dual-anode configuration (Pins 1 and 2) mandatory for operation?

Yes-Pins 1 and 2 are internally connected anodes and must be routed to the same net. Using only one anode violates the thermal and current-sharing design, risks localized overheating, and voids the 5 A rating. Both pins must be soldered to matching copper area per the SOT1289B footprint.

How does the 3 K/W Rth(j-sp) value translate to real-world PCB thermal design?

Rth(j-sp) = 3 K/W means that with 5 A conduction (2.2 W dissipation), the junction-to-solder-point temperature rise is ~6.6 °C. To hold Tj ≤175 °C, the solder point must stay ≤168.4 °C-achievable using ≥1 cm² cathode pad on 1 oz copper, per Nexperia's thermal test condition in Table 6.