Nexperia USA Inc. PMEG045V050EPEZ

Overview

PMEG045V050EPE from Nexperia is a 45 V, 5 A planar low forward voltage Schottky barrier rectifier in a CFP15B (SOT1289B) thermally enhanced SMD package, designed for high-efficiency DC-to-DC conversion and OR-ing applications. It delivers typ. 440 mV VF at 5 A and 25 °C, supports 160 A non-repetitive peak forward current, and features clip-bond technology for improved thermal performance in space-constrained power rails.

For engineers reviewing the PMEG045V050EPE datasheet, PMEG045V050EPE pinout, PMEG045V050EPE application, or PMEG045V050EPE equivalent, key selection criteria include ultra-low VF for minimal conduction loss, 45 V reverse voltage rating for 3.3 V–24 V bus protection, thermal resistance of 3 K/W to cathode solder point, and validated use in freewheeling and reverse polarity protection circuits.

Technical Context

This Schottky rectifier uses a planar metal–semiconductor junction architecture optimized for low forward voltage drop and fast switching with negligible reverse recovery charge (Qrr). Its dual-anode, single-cathode pinning enables parallel anode connection for reduced package inductance and higher current handling per footprint.

The CFP15B package integrates a copper clip-bond structure directly connecting the die anode to two external leads and the cathode to an exposed thermal pad-enabling Rth(j-sp) = 3 K/W and continuous 5 A average forward current at Tsp ≤ 172 °C under square-wave conditions.

Key Specifications

Pinout & Package

The PMEG045V050EPE is housed in a CFP15B (SOT1289B) surface-mount package: 5.8 × 4.3 × 0.95 mm body, 2.13 mm lead pitch, with exposed cathode thermal pad and clip-bonded dual anodes for low-inductance, high-current routing.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar Schottky rectifier applications.

Compared with SS34H and RB055LAM-40, PMEG045V050EPE uniquely combines 45 V rating, 5 A average current, ultra-low VF, and 3 K/W thermal resistance in a single compact CFP15B package-making it optimal for high-density, high-efficiency 24 V power distribution and OR-ing.

Availability

PMEG045V050EPE is available at Aetrix Electronics and suitable for high-efficiency DC-to-DC conversion, OR-ing power paths, reverse polarity protection, and freewheeling applications requiring stable component supply and long-term manufacturability.

Supply support for PMEG045V050EPE includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Nexperia is a global semiconductor expert focused on essential system functionality-delivering high-performance, reliable discrete, logic, and MOSFET components for automotive, industrial, and consumer markets.

The PMEG045V050EPE belongs to Nexperia's low-VF Schottky rectifier product line, engineered specifically for minimizing conduction loss and thermal resistance in high-current, space-constrained power conversion and protection circuits.

FAQ

What is the maximum junction temperature and how does it affect continuous current rating?

The absolute maximum junction temperature is 175 °C. At this limit, the device supports 5 A average forward current only when the solder point temperature (Tsp) is held ≤172 °C using adequate PCB copper area. Exceeding Tj = 175 °C causes irreversible degradation of the Schottky barrier and accelerated IR drift.

Can PMEG045V050EPE be used in place of a MOSFET-based ideal diode controller?

No-it is a passive Schottky rectifier, not a controlled ideal diode. While it provides OR-ing and reverse polarity protection without control circuitry, it lacks active voltage-drop regulation and cannot match the <20 mV forward drop of ideal diode ICs. Use only where 440 mV VF is acceptable.

Is the CFP15B package compatible with standard reflow profiles for lead-free soldering?

Yes-the CFP15B package is qualified for JEDEC J-STD-020D-compliant lead-free reflow. Recommended stencil thickness is 0.125 mm, and the footprint (Fig. 16) specifies 0.80 mm solder land width and 3.80 mm occupied area for the cathode pad to ensure void-free solder joints and optimal thermal transfer.

How does the dual-anode configuration impact PCB layout and thermal performance?

The dual-anode (Pins 1 & 2) configuration allows symmetrical current splitting and reduced current density per trace, lowering resistive heating. Routing both anodes to the same net with equal-length traces minimizes imbalance, while the shared cathode pad (Pin 3) concentrates heat into a single thermal path-enabling efficient conduction to inner-layer copper planes.