Nexperia USA Inc. PMEG045V100EPE-QZ

Overview

PMEG045V100EPE-QZ from Nexperia is a 45 V, 10 A planar low forward voltage Schottky barrier rectifier in a CFP15B (SOT1289B) power SMD package, designed for high-efficiency DC-to-DC conversion and freewheeling in automotive-grade power supplies. It delivers VF = 450–490 mV at 10 A/25 °C, IR ≤ 600 µA at 45 V, and is qualified to AEC-Q101.

For engineers reviewing the PMEG045V100EPE-QZ datasheet, PMEG045V100EPE-QZ pinout, PMEG045V100EPE-QZ application, or PMEG045V100EPE-QZ equivalent, key selection criteria include low VF under high current, thermal performance on FR4 with cathode pad, reverse recovery time < 36 ns, and AEC-Q101 qualification for automotive power rail protection.

Technical Context

This Schottky rectifier uses clip-bond technology to minimize parasitic resistance and enhance thermal conduction from junction to solder point (Rth(j-sp) = 3 K/W). Its planar construction ensures stable reverse breakdown (V(BR)R ≥ 45 V) and low capacitance (Cd = 375 pF at 10 V), supporting high-frequency switching.

The device operates across –40 °C to +175 °C junction temperature, with average forward current derated to 10 A at Tsp ≤ 174 °C (δ = 0.5, 20 kHz square wave). Reverse recovery is step-type (trr = 36 ns) and ramp-type (trr = 19 ns), enabling use in synchronous rectification and OR-ing circuits where fast turn-off minimizes cross-conduction loss.

Key Specifications

Pinout & Package

Encapsulated in CFP15B (SOT1289B): ultra-thin 5.8 × 4.3 × 0.95 mm surface-mount package with thermal-enhanced clip-bond construction and 2.13 mm lead pitch.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar Schottky rectifier applications.

Compared with VS-10BQ040-M3/45 and NSR10F40NXT5G, PMEG045V100EPE-QZ uniquely combines 45 V rating, AEC-Q101 qualification, 300 A IFSM, and 3 K/W Rth(j-sp) - making it the only option suitable for automotive 36 V battery systems requiring robust surge handling and thermal reliability.

Availability

PMEG045V100EPE-QZ is available at Aetrix Electronics and suitable for automotive power management, ADAS domain controllers, and 48 V mild-hybrid systems requiring stable component supply and long-term lifecycle assurance.

Supply support for PMEG045V100EPE-QZ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Nexperia is a global semiconductor expert focused on essential efficiency technologies, delivering high-performance, reliable discrete and logic devices for automotive, industrial, and mobile markets.

PMEG045V100EPE-QZ belongs to Nexperia's AEC-Q101-qualified Schottky rectifier product line, engineered specifically for high-current, low-VF operation in automotive power conversion and protection circuits.

FAQ

What is the maximum junction temperature and how does it affect derating?

The absolute maximum junction temperature is 175 °C. At this limit, average forward current must be reduced to zero. For continuous operation, IF(AV) is rated at 10 A only when solder point temperature (Tsp) remains ≤174 °C under δ = 0.5, 20 kHz square-wave conditions. Derating curves in Figures 8–10 show linear reduction to 0 A at 200 °C ambient on FR4 with 1 cm² cathode pad.

Is PMEG045V100EPE-QZ suitable for synchronous rectification replacement?

No - it is a passive Schottky rectifier, not a synchronous MOSFET driver or controller. However, its 36 ns step-recovery time and low VF make it a direct replacement for legacy Schottkys in flyback/freewheeling roles where gate drive complexity must be avoided. It cannot replace active synchronous rectifiers that require control signals.

How does the dual-anode (pins 1 and 2) configuration improve performance?

Pins 1 and 2 are internally shorted anodes, providing parallel current paths that reduce effective series resistance and distribute thermal load across two leads. This lowers localized heating, improves current sharing in high-density layouts, and enhances reliability under pulsed loads - especially critical in automotive transients like load dump.

What PCB layout practices maximize thermal performance?

Use a minimum 1 cm² copper pad connected to pin 3 (cathode) with ≥2 thermal vias to inner ground planes. Maintain ≥0.8 mm solder mask opening around the cathode tab. Avoid placing components near the device's top surface to ensure free-air convection. Follow the reflow footprint in Figure 16, including 0.125 mm stencil thickness for optimal paste volume.