Nexperia USA Inc. PMEG045V150EPEZ

Overview

PMEG045V150EPEZ from Nexperia is a 45 V, 15 A planar low forward voltage Schottky barrier rectifier in a CFP15B (SOT1289B) surface-mount package. It delivers 510–570 mV forward voltage at 15 A and 25 °C, supports 300 A non-repetitive peak forward current, and features clip-bond technology for high power capability-used in high-efficiency DC-to-DC converters and OR-ing circuits.

For engineers reviewing the PMEG045V150EPEZ datasheet, PMEG045V150EPEZ pinout, PMEG045V150EPEZ application, or PMEG045V150EPEZ equivalent, key selection criteria include low VF performance at high current, thermal resistance to solder point (3 K/W), reverse recovery time (19 ns ramp), and compatibility with FR4 PCBs using standard or enhanced cathode pad layouts.

Technical Context

This Schottky rectifier uses a planar silicon die with metal-semiconductor junction architecture optimized for minimal forward conduction loss and fast unidirectional switching. Its low VF stems from a tailored barrier height and low-series-resistance metallization, enabling efficient operation in high-frequency SMPS topologies.

The CFP15B package integrates dual anode terminals and a large-area cathode tab to minimize thermal resistance (R_th(j-sp) = 3 K/W) and support high average current (15 A at T_sp ≤ 174 °C). The device exhibits negligible reverse recovery charge (Q_rr) and step-recovery t_rr of 36 ns-critical for minimizing switching losses in synchronous rectification and freewheeling paths.

Key Specifications

Pinout & Package

Encapsulated in CFP15B (SOT1289B): ultra-thin 5.8 × 4.3 × 0.95 mm surface-mount package with thermal-enhanced clip-bond construction and 2.13 mm lead pitch.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar Schottky rectifier applications.

Compared with VS-15SQ045ST and MBR1545CT, PMEG045V150EPEZ offers superior thermal performance via its clip-bond CFP15B package (R_th(j-sp) = 3 K/W), lower VF at high current, and dual-anode layout that simplifies high-current PCB routing-making it optimal for space-constrained, high-efficiency SMD power supplies.

Availability

PMEG045V150EPEZ is available at Aetrix Electronics and suitable for high-efficiency DC/DC conversion, OR-ing circuits, and reverse polarity protection requiring stable component supply across industrial, telecom, and embedded power applications.

Supply support for PMEG045V150EPEZ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Nexperia is a global semiconductor expert focused on high-volume, high-reliability essential semiconductors-including logic, discrete, and MOSFETs-with manufacturing rooted in process optimization and automotive-grade quality systems.

This device belongs to Nexperia's Planar Low VF Schottky Rectifier product line, engineered specifically for high-current, high-frequency power conversion where minimal conduction loss and thermal robustness are critical design constraints.

FAQ

What is the maximum allowable solder point temperature for PMEG045V150EPEZ during reflow?

The datasheet specifies a maximum solder point temperature (T_sp) of 174 °C for 15 A average forward current operation under δ = 0.5, 20 kHz conditions. Exceeding this value risks degradation of the clip-bond interface and long-term reliability loss. Reflow profiles must ensure peak T_sp remains ≤174 °C, verified via thermocouple on the cathode tab-not ambient or board surface.

Can PMEG045V150EPEZ be used in automotive applications?

No-PMEG045V150EPEZ is not AEC-Q200 qualified and lacks automotive-specific testing or qualification. Nexperia explicitly states in its legal disclaimers that non-automotive qualified products are unsuitable for safety-critical or life-support systems. For automotive use, select Nexperia's AEC-Q200-qualified Schottky rectifiers such as PMEG045V150EHX.

How does the dual-anode configuration affect PCB layout?

Pins 1 and 2 are internally shorted anodes, allowing parallel trace routing to reduce inductance and current density per trace. Layout best practice is to route equal-length, symmetric copper paths from both pins to the input node, minimizing loop area and ensuring balanced current sharing-especially critical in high-di/dt freewheeling applications where imbalance could cause localized heating.

Is the 300 A IFSM rating usable in continuous operation?

No-the 300 A non-repetitive peak forward current (I_FSM) applies only to single 8.3 ms half-sine pulses at T_j(init) = 25 °C. Continuous operation is limited to 15 A average forward current under defined thermal conditions (δ = 0.5, T_sp ≤ 174 °C). Repeated I_FSM events will cause cumulative junction temperature rise and irreversible bond degradation.