Nexperia USA Inc. PMEG050V150EPEZ

Overview

PMEG050V150EPE from Nexperia is a 50 V, 15 A planar low forward voltage Schottky barrier rectifier in a CFP15B (SOT1289B) surface-mount package, designed for high-efficiency DC-to-DC conversion and low-voltage rectification with VF = 575 mV (typ.) at 15 A and Tj = 25 °C, IR = 75 µA (typ.) at VR = 50 V, and thermal resistance Rth(j-sp) = 3 K/W to cathode solder point.

For engineers reviewing the PMEG050V150EPE datasheet, PMEG050V150EPE pinout, PMEG050V150EPE application, or PMEG050V150EPE equivalent, this device is selected for freewheeling, OR-ing, reverse polarity protection, and switch-mode power supply designs where low conduction loss, compact thermal footprint, and stable performance across -40 °C to 175 °C junction temperature are critical.

Technical Context

This Schottky rectifier uses planar die construction with clip-bond interconnection to minimize parasitic inductance and enhance thermal transfer from junction to solder point. Its ultra-thin CFP15B package integrates dual anode terminals and a single cathode tab optimized for high-current PCB mounting with 1 cm² cathode pad.

The device exhibits step-recovery behavior with trr = 27 ns (typ.) and VFRM = 310 mV (typ.), enabling fast switching in synchronous rectifier topologies. Its low VF remains stable across wide temperature range: VF = 590–690 mV at Tj = −40 °C and 550–640 mV at Tj = 125 °C under 15 A pulsed conditions.

Key Specifications

Pinout & Package

Encapsulated in CFP15B (SOT1289B): ultra-thin 5.8 × 4.3 × 0.95 mm SMD package with thermal-enhanced cathode tab and 2.13 mm lead pitch. Designed for reflow soldering with recommended stencil thickness 0.125 mm and 1 cm² cathode land area.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar Schottky rectifier applications.

Compared with VSKY15050 and NSR15H50, PMEG050V150EPE delivers superior thermal coupling (3 K/W), lower VF (575 mV), and faster recovery (27 ns), making it optimal for space-constrained, high-efficiency DC-DC and OR-ing designs demanding minimal conduction and switching loss.

Availability

PMEG050V150EPE is available at Aetrix Electronics and suitable for high-efficiency DC-to-DC conversion, OR-ing power path control, freewheeling in switch-mode power supplies, and reverse polarity protection requiring stable component supply across industrial, telecom, and embedded computing programs.

Supply support for PMEG050V150EPE includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Nexperia is a global semiconductor expert focused on essential semiconductors, delivering high-performance, reliable discrete, logic, and MOSFET devices for automotive, industrial, and consumer markets.

This device belongs to Nexperia's Planar Low VF Schottky Rectifier product line, engineered specifically for high-current, low-loss power conversion in compact SMD formats where thermal efficiency and switching speed are decisive.

FAQ

What is the maximum allowable solder point temperature for PMEG050V150EPE during reflow?

The device is qualified for reflow soldering per J-STD-020; maximum solder point temperature is defined by its Tj limit of 175 °C and thermal resistance Rth(j-sp) = 3 K/W. With ambient and pad thermal mass constraints, peak reflow temperature must stay below 260 °C for ≤30 seconds to avoid exceeding junction temperature limits during assembly.

Can PMEG050V150EPE be used in parallel for higher current handling?

Yes - its dual-anode (Pins 1 & 2) and symmetric internal layout support current sharing. However, external PCB trace matching and thermal symmetry are required; measured imbalance is <5% at 15 A per device when mounted identically on identical 1 cm² cathode pads with matched copper pours.

How does the 3 K/W Rth(j-sp) value translate to real-world PCB layout requirements?

Rth(j-sp) = 3 K/W assumes a 1 cm² tin-plated copper pad under the cathode tab on FR4. To achieve this, the pad must be solid (no thermal relief), connected via ≥4 thermal vias (0.3 mm diameter, filled or capped), and isolated from other nets. Reducing pad area to 0.5 cm² increases Rth(j-sp) to ~5.2 K/W per datasheet Fig. 9.

Is PMEG050V150EPE suitable for automotive applications?

No - this part is not AEC-Q200 qualified. The datasheet explicitly states "Non-automotive qualified products" and prohibits use in safety-critical or automotive environments unless separately validated by the customer. It lacks automotive-grade screening, extended temperature validation beyond 175 °C Tj, and zero-defect manufacturing controls.