Nexperia USA Inc. PMEG100V100ELPDZ

Overview

PMEG100V100ELPDZ from Nexperia is a 100 V, 10 A low-leakage Schottky barrier rectifier in a CFP15 (SOT1289) ultra-thin SMD package, designed for high-efficiency DC-to-DC conversion and automotive LED lighting where low forward voltage (770–850 mV at 10 A, 25 °C) and minimal reverse leakage (0.2–0.8 µA at 100 V, 25 °C) are critical. It features clip-bonding for enhanced thermal performance, AEC-Q101 qualification, and operates up to 175 °C junction temperature.

For engineers reviewing the PMEG100V100ELPDZ datasheet, PMEG100V100ELPDZ pinout, PMEG100V100ELPDZ application, or PMEG100V100ELPDZ equivalent, this device is selected for low-voltage rectification, reverse polarity protection, and thermally constrained automotive power rails requiring stable leakage behavior across temperature.

Technical Context

This Schottky rectifier uses high-barrier technology to achieve sub-1 µA reverse leakage at 100 V and 25 °C-significantly lower than standard Schottkys-while maintaining VF ≤ 850 mV at rated 10 A DC. Its dual-anode, single-cathode configuration (Pins 1 & 2 = anode, Pin 3 = cathode) supports parallel current handling and optimized PCB thermal spreading via the exposed cathode tab.

The CFP15 package integrates clip-bonding and a thermally enhanced copper leadframe, enabling 3.75 W total power dissipation on ceramic PCB and Rth(j-sp) as low as 3 K/W to the cathode solder point-critical for sustained operation in ambient temperatures up to 150 °C with δ = 0.5 duty cycle.

Key Specifications

Pinout & Package

Encapsulated in the CFP15 (SOT1289) package: 5.8 × 4.3 × 0.78 mm, ultra-thin profile with exposed cathode thermal pad and flat leads for low-inductance, high-current SMD mounting.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar Schottky rectifier applications.

Compared with VS-10EWH06-M3 and MBR10100CT, PMEG100V100ELPDZ uniquely combines 100 V rating, sub-µA leakage, AEC-Q101 qualification, and ultra-thin SMD packaging-making it the sole option for thermally dense, automotive-compliant 100 V rectification where leakage and height are design-critical constraints.

Availability

PMEG100V100ELPDZ is available at Aetrix Electronics and suitable for automotive LED lighting, 48 V DC-DC converters, and reverse polarity protection circuits requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for PMEG100V100ELPDZ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Nexperia is a global semiconductor expert focused on high-volume, high-reliability discrete and logic devices, with leadership in automotive-qualified components and advanced packaging technologies.

This device belongs to Nexperia's MEGA Schottky rectifier product line, engineered specifically for high-efficiency, low-leakage power conversion in automotive and industrial applications demanding AEC-Q101 compliance and thermal robustness.

FAQ

What is the maximum allowable solder point temperature during reflow for PMEG100V100ELPDZ?

The CFP15 package supports standard lead-free reflow profiles with peak solder point temperature up to 260 °C for ≤30 seconds, per JEDEC J-STD-020. The cathode tab's low Rth(j-sp) of 3 K/W ensures minimal junction temperature rise during reflow, preserving device integrity without special thermal relief.

Can PMEG100V100ELPDZ replace a standard 100 V, 10 A through-hole rectifier in an existing design?

Yes, but with layout adaptation: its dual-anode/single-cathode pinout (1=A, 2=A, 3=K) requires two separate anode traces and a large cathode thermal pad. PCB footprint must follow Nexperia's SOT1289 reflow land pattern (7.5 × 4.96 mm), not TO-220 or D²PAK outlines.

How does the 0.2 µA leakage at 100 V impact system-level power budget in always-on automotive modules?

In a telematics module using 12 parallel PMEG100V100ELPDZ devices, total leakage remains under 2.4 µA - contributing just 28.8 nW at 12 V, which is negligible versus MCU sleep current (typically >1 µA). This enables direct integration into low-power wake-up circuits without auxiliary switching.

Is the 175 °C junction temperature rating achievable in real-world FR4 PCB layouts?

Yes, with proper thermal design: using the recommended 1 cm² cathode mounting pad on 2-oz copper, PMEG100V100ELPDZ sustains 10 A IF(AV) at Tamb = 150 °C (δ = 0.5). Derating is only required above that ambient; no heatsink is needed if the PCB layout matches Nexperia's SOT1289 footprint guidelines.