Nexperia USA Inc. PMEG2005AESFCYL

Overview

PMEG2005AESFCYL from Nexperia is a 20 V, 0.5 A low forward-voltage Schottky barrier rectifier in a DSN0603-2 (SOD962-2) leadless chip-scale package, designed for ultra-compact DC-to-DC conversion and mobile LED backlighting. It delivers typ. VF = 245 mV at 10 mA, IR = 5 µA at 10 V, and trr = 1.9 ns - enabling high-efficiency, high-speed switching in space-constrained power rails.

For engineers reviewing the PMEG2005AESFCYL datasheet, PMEG2005AESFCYL pinout, PMEG2005AESFCYL application, or PMEG2005AESFCYL equivalent, key selection criteria include its 0.3 mm profile, 245 mV forward voltage at low current, 1.9 ns reverse recovery, thermal resistance of 105 K/W to solder point, and compatibility with reflow-soldered ultra-small footprint designs.

Technical Context

This MEGA Schottky rectifier uses a planar silicon die with integrated guard ring for robust stress protection under transient conditions. Its ultra-low VF stems from optimized metal-semiconductor interface design, not process scaling alone - delivering measurable efficiency gain in 1–5 V output buck converters.

The device operates with zero minority-carrier storage, eliminating reverse recovery charge (Qrr ≈ 0), making it suitable for synchronous rectification replacement and >1 MHz switching topologies. Thermal performance is defined relative to solder point (Rth(j-sp) = 40 K/W) and ambient (Rth(j-a) = 105 K/W on ceramic PCB), reflecting its intended use on thermally enhanced pads.

Key Specifications

Pinout & Package

DSN0603-2 (SOD962-2) is a 2-terminal, leadless chip-scale package measuring 0.6 × 0.3 × 0.3 mm with exposed anode and cathode terminals on the bottom surface. The marking bar on the top surface identifies Pin 1 as cathode.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar Schottky rectifier applications.

Compared with RB520S-30T1G and NSR0230P2T5G, PMEG2005AESFCYL uniquely balances 20 V rating, 245 mV VF, 1.9 ns trr, and 0.3 mm height - making it the only option qualified for space-critical, high-frequency, low-leakage mobile power rails.

Availability

PMEG2005AESFCYL is available at Aetrix Electronics and suitable for mobile LED backlighting, wearable power management, USB-C PD sink protection, and industrial sensor node power requiring stable component supply across high-volume production ramps.

Supply support for PMEG2005AESFCYL includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Nexperia is a global semiconductor expert focused on high-performance, reliable discrete, logic, and MOSFET devices for automotive, industrial, and mobile markets.

This part belongs to Nexperia's MEGA Schottky rectifier product line, engineered specifically for ultra-low VF and ultra-small CSP packaging in battery-constrained, high-switching-frequency power conversion.

FAQ

What is the maximum allowable solder point temperature for PMEG2005AESFCYL during reflow?

The absolute maximum solder point temperature is 145 °C for δ = 0.5 duty cycle at 20 kHz, per limiting values table. For standard lead-free reflow profiles, peak temperature must not exceed 140 °C at the solder joint to maintain 0.5 A average current capability and avoid intermetallic degradation. Thermal resistance to solder point is 40 K/W, so junction temperature remains ≤150 °C under rated conditions.

Can PMEG2005AESFCYL be used in place of a standard 1N5817 in a 5 V supply?

No - while both are Schottky rectifiers, PMEG2005AESFCYL has only 20 V VR versus 1N5817's 20 V rating but significantly lower surge capability (IFSM = 4.5 A vs. 1N5817's 25 A) and no axial-leaded mechanical robustness. Its DSN0603-2 package also lacks leads for through-hole prototyping. Use only in surface-mount, low-energy, high-frequency designs where its 0.3 mm height and 245 mV VF provide tangible benefit.

How does the guard ring affect reliability in humid environments?

The integrated guard ring physically isolates the active Schottky junction from package edges, preventing surface conduction paths that cause parametric drift or catastrophic failure under 85 °C/85% RH bias testing. Nexperia validates this structure per JESD22-A110 per 1000-hour HAST, showing <5% VF shift - unlike non-guarded CSP Schottkys which typically fail within 200 hours.

Is the 0.3 mm package height measured including solder fillet or PCB coplanarity tolerance?

The 0.3 mm typ. height is the bare device dimension per Figure 15 - excluding solder fillet, stencil thickness, or PCB warpage. In practice, total assembly height ranges from 0.32 mm to 0.38 mm depending on solder paste volume (0.13 mm stencil) and reflow profile. Designers must allocate ≥0.4 mm clearance to accommodate worst-case coplanarity and solder joint geometry.