Nexperia USA Inc. PMEG2005EH,115

Overview

PMEG2005EH from Nexperia is a 20 V, 0.5 A planar Schottky barrier rectifier in SOD123F package, featuring 355–390 mV forward voltage at 500 mA, integrated guard ring for stress protection, and optimized for low-voltage DC-to-DC conversion in space-constrained power rails.

For engineers reviewing the PMEG2005EH datasheet, PMEG2005EH pinout, PMEG2005EH application, or PMEG2005EH equivalent, key selection criteria include ultra-low VF performance, thermal resistance (Rth(j-sp) = 60 K/W), reverse leakage (<200 µA at 20 V), junction temperature rating (150 °C), and SOD123F footprint compatibility with high-density PCB layouts.

Technical Context

This MEGA Schottky diode uses a planar silicon structure with an integrated guard ring to suppress edge breakdown and improve reliability under transient stress. Its low VF stems from optimized metal-semiconductor interface and thin epitaxial layer design.

It operates within −65 °C to 150 °C ambient and junction temperature ranges, with pulsed forward current capability up to 10 A (8 ms square wave) and repetitive peak current of 7 A (1 ms, 25% duty cycle), enabling robust surge handling in compact power stages.

Key Specifications

Pinout & Package

Encapsulated in SOD123F surface-mount plastic package (2.6 mm × 1.6 mm × 1.1 mm body), with flat leads optimized for reflow soldering and thermal transfer to PCB copper.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar Schottky rectifier applications.

Compared with RB520S-30T1G and SS12, PMEG2005EH uniquely balances 0.5 A current capacity, ultra-low 355 mV VF, and minimal 2.6 mm × 1.6 mm footprint-making it optimal for high-efficiency, space-limited 5–12 V DC-DC stages where both thermal and board area are constrained.

Availability

PMEG2005EH is available at Aetrix Electronics and suitable for USB Power Delivery adapters, IoT sensor node power supplies, industrial PLC digital I/O protection circuits, and aftermarket automotive body control modules requiring stable component supply and consistent SOD123F sourcing.

Supply support for PMEG2005EH includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Nexperia is a global semiconductor expert delivering high-performance logic, analog, and discrete components, with leadership in advanced packaging and automotive-grade reliability.

PMEG2005EH belongs to the MEGA Schottky rectifier product line, engineered specifically for high-efficiency, low-voltage power conversion in consumer, industrial, and computing applications where minimal forward voltage drop and small form factor are critical.

FAQ

What is the maximum continuous forward current for PMEG2005EH?

The PMEG2005EH is rated for 0.5 A continuous forward current (IF) when the solder point temperature (Tsp) does not exceed 55 °C. This rating assumes mounting on an FR4 PCB with single-sided copper, tin-plated, using the standard footprint per Figure 5. Exceeding this temperature requires derating per thermal resistance data (Rth(j-sp) = 60 K/W).

Does PMEG2005EH have automotive qualification?

No. Per Nexperia's revision history (Table 8), PMEG2005EH was explicitly changed to non-automotive qualification in the October 2022 release. It is not tested or qualified to AEC-Q101 standards. For automotive applications, Nexperia offers the -Q qualified variants (e.g., PMEG2005EH,115-Q) with separate qualification documentation.

How is cathode identification marked on the SOD123F package?

The cathode (pin 1) is identified by a marking bar printed on the top surface of the SOD123F package. As confirmed in Table 2 and Figure 4, this bar aligns with the cathode terminal, and the unmarked end corresponds to the anode (pin 2). The device marking code "A3" appears adjacent to the bar.

What is the thermal resistance from junction to solder point (Rth(j-sp)) and how is it measured?

Rth(j-sp) is 60 K/W, measured with the device mounted on an FR4 PCB, single-sided copper, tin-plated, and with a 1 cm² mounting pad for the cathode. This value reflects heat transfer directly from the die to the PCB copper via the cathode lead, enabling accurate thermal modeling in real-world PCB layouts without heatsinks.