Nexperia USA Inc. PMEG2010AEB-QF
- Part No.:
- PMEG2010AEB-QF
- Manufacturer:
- Nexperia USA Inc.
- Category:
- Single Diodes
- Package:
- SC-79, SOD-523
- Datasheet:
-
PMEG2010AEB-QF.pdf
- Description:
- PMEG2010AEB-Q/SOD523/SC-79
- Quantity:
- Payment:

- Shipping:

Inventory:7,548
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
PMEG2010AEB-QF from Nexperia is a 20 V, 1 A planar Schottky barrier rectifier with integrated guard ring for stress protection, housed in an ultra-small SOD523 (SC-79) surface-mount package. It delivers ultra-low forward voltage (510–620 mV at 1 A, 25 °C), supports automotive-grade reliability per AEC-Q101, and is optimized for low-voltage rectification and inverse-polarity protection in space-constrained DC/DC converters.
For engineers reviewing the PMEG2010AEB-QF datasheet, PMEG2010AEB-QF pinout, PMEG2010AEB-QF application, or PMEG2010AEB-QF equivalent, key selection criteria include its 20 V reverse voltage rating, 1 A continuous forward current capability at ≤55 °C solder point temperature, 19–25 pF diode capacitance at 1 V, and AEC-Q101 qualification for automotive power rail protection.
Technical Context
This Schottky rectifier uses a planar die structure with an integrated guard ring to suppress edge breakdown and improve robustness under transient stress. Its low VF enables high-efficiency operation in low-voltage (<5 V) power paths where conduction loss dominates thermal design.
The device operates within a junction temperature range of –65 °C to 150 °C and exhibits thermal resistance of 75 K/W from junction to cathode solder point-critical for thermal management in densely packed automotive modules where PCB copper area is limited.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Reverse Voltage (VR) | 20 V - Maximum blocking voltage before significant leakage or breakdown; defines safe operating range in 12 V automotive systems. |
| Forward Voltage (VF) | 510–620 mV @ 1 A, 25 °C - Directly reduces conduction loss in high-current, low-VOUT DC/DC stages; enables >95% efficiency at light-to-moderate loads. |
| Forward Current (IF) | 1 A continuous @ Tsp ≤ 55 °C - Specifies maximum steady-state current limited by solder point thermal rise, not ambient temperature. |
| Reverse Current (IR) | 0.32–1.5 mA @ 20 V, 25 °C - Low leakage preserves battery life in always-on automotive circuits such as infotainment standby rails. |
| Diode Capacitance (Cd) | 19–25 pF @ 1 V, 1 MHz - Enables fast switching in clamping and flyback snubber applications without excessive ringing or EMI. |
| Thermal Resistance (Rth(j-sp)) | 75 K/W - Junction-to-cathode-solder-point value used to calculate ΔTj under real PCB layout conditions with minimal copper. |
Pinout & Package
Encapsulated in the SOD523 (SC-79) ultra-small surface-mount plastic package (1.2 mm × 0.8 mm × 0.6 mm body), this two-terminal device features flat leads compatible with standard reflow soldering footprints.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | Cathode (K) | Connected to higher-potential node in reverse-biased protection; serves as primary thermal path to PCB via soldered tab (Rth(j-sp) = 75 K/W). |
| 2 | Anode (A) | Connected to lower-potential node during forward conduction; carries full load current with minimal IR drop due to low VF. |
Key Features
| Feature | Design Value |
|---|---|
| Guard ring integration | Suppresses edge electric field concentration, improving surge robustness and long-term reliability under repetitive transients. |
| AEC-Q101 qualification | Validated for automotive use including temperature cycling, HTRB, and ESD testing-enables deployment in engine control, body electronics, and ADAS power supplies. |
| Ultra-low VF at 1 A | Reduces power dissipation to ≤0.62 W at rated current, minimizing thermal derating needs in sealed enclosures. |
| SOD523 footprint | Enables placement in <1.0 mm² board area-ideal for compact USB-C PD adapters, wearable sensors, and multi-rail PMIC output protection. |
Applications
| Automotive Power Rail Protection | USB-C Power Delivery Clamp |
|---|---|
Use Scenario: Reverse polarity protection on 12 V battery-fed ECUs in start-stop vehicles. IC Role / Device Role / Timing Role: Unidirectional current gate preventing damage during incorrect battery connection. Use Value: Withstands 6 A non-repetitive surge (IFSM) and maintains <1.5 mA leakage at 20 V, ensuring fail-safe behavior without fuse dependency. |
Use Scenario: Output clamping in 5 V/3 A USB-C sink circuit to limit overshoot during hot-plug events. IC Role / Device Role / Timing Role: Fast-turn-on shunt clamp absorbing transient energy before downstream LDOs or USB controllers. Use Value: 19–25 pF capacitance and sub-620 mV VF enable sub-10 ns response with minimal signal distortion on CC/VBUS lines. |
| Low-Power IoT Sensor Supply | High-Efficiency Buck Converter Output |
Use Scenario: Input rectification for coin-cell–powered BLE sensor nodes operating at 2.0–3.6 V. IC Role / Device Role / Timing Role: Low-loss AC-to-DC conversion for energy-harvesting harvesters or backup charging paths. Use Value: 0.32 mA max IR at 20 V preserves microamp-level sleep current budgets; 510 mV VF minimizes dropout in 3.0 V nominal supply rails. |
Use Scenario: Synchronous rectifier replacement in 3.3 V/1 A buck converter for industrial PLC I/O modules. IC Role / Device Role / Timing Role: Freewheeling diode conducting during high-side FET off-time to maintain continuous inductor current. Use Value: 75 K/W Rth(j-sp) allows direct thermal coupling to ground plane, sustaining 1 A without external heatsinking in 4-layer PCB designs. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar Schottky rectifier applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| RB521S-30T2R | 30 V VR, 200 mA IF, 370 mV VF @ 100 mA - lower current rating, higher voltage margin. | Not suitable for 1 A continuous loads; acceptable only in <200 mA bias or signal-level clamping. | Select only when system reverse voltage exceeds 20 V and average current remains below 200 mA. |
| NSR0230P2T5G | 30 V VR, 200 mA IF, 450 mV VF @ 100 mA - similar VF but half the current capacity and no AEC-Q101 rating. | Lacks automotive qualification; unsuitable for under-hood or safety-critical modules. | Acceptable for consumer-grade portable devices where AEC-Q101 is not mandated and thermal budget permits derating. |
Compared with RB521S-30T2R and NSR0230P2T5G, PMEG2010AEB-QF uniquely combines 1 A continuous current, AEC-Q101 compliance, and 20 V rating in SOD523-making it the only option for space-limited automotive 12 V rail protection requiring full-load capability without derating.
Availability
PMEG2010AEB-QF is available at Aetrix Electronics and suitable for automotive power rail protection, USB-C PD clamping, and high-efficiency buck converter outputs requiring stable component supply across production lifecycles.
Supply support for PMEG2010AEB-QF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Nexperia is a global semiconductor expert focused on high-volume, high-reliability discrete and logic devices, with leadership in automotive-qualified components and advanced packaging technologies.
The PMEG2010AEB-QF belongs to Nexperia's AEC-Q101-qualified Schottky rectifier product line, engineered specifically for low-VF, high-reliability protection in automotive and industrial power management systems where size, thermal performance, and stress resilience are critical.
FAQ
What is the maximum allowable solder point temperature for continuous operation?
The datasheet specifies IF = 1 A is rated at Tsp ≤ 55 °C-meaning the temperature measured at the cathode solder joint must not exceed 55 °C under steady-state conditions. This reflects thermal limits of the SOD523 package's internal bond wire and die attach, not ambient temperature. Exceeding this requires current derating per the thermal curves in section 8.
Does the guard ring affect electrical parameters like VF or IR?
No-the guard ring is a structural feature in the silicon die periphery that modifies electric field distribution during reverse bias but does not alter forward conduction characteristics. VF and IR values remain consistent with non-guard-ring Schottky variants of identical process and geometry; its sole function is enhanced ruggedness against ESD and voltage transients.
Can PMEG2010AEB-QF be used in bidirectional current paths?
No-it is a unidirectional Schottky rectifier with fixed anode/cathode polarity. Forward conduction occurs only from anode to cathode; reverse bias blocks current up to 20 V. Bidirectional operation would require back-to-back configuration or a dedicated bidirectional TVS, neither of which is supported by this device's topology or ratings.
How does thermal resistance Rth(j-sp) differ from Rth(j-a) in layout design?
Rth(j-sp) = 75 K/W measures junction-to-cathode-solder-point resistance and is used when calculating temperature rise from PCB copper area directly under the cathode pad. Rth(j-a) = 400 K/W assumes natural convection only and is irrelevant for typical SMD layouts-designers must use Rth(j-sp) with verified copper area and layer stack-up to ensure Tj stays ≤150 °C at 1 A.
PMEG2010AEB-QF Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Nexperia USA Inc.
- Series:
- -
- Package/Case:
- SC-79, SOD-523
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Technology:
- Schottky
- Voltage - DC Reverse (Vr) (Max):
- 20 V
- Current - Average Rectified (Io):
- 1A
- Voltage - Forward (Vf) (Max) @ If:
- 620 mV @ 1 A
- Speed:
- Fast Recovery =< 500ns, > 200mA (Io)
- Reverse Recovery Time (trr):
- -
- Current - Reverse Leakage @ Vr:
- 1.5 mA @ 20 V
- Capacitance @ Vr, F:
- 19pF @ 1V, 1MHz
- Grade:
- Automotive
- Qualification:
- AEC-Q101
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- SOD-523
- Operating Temperature - Junction:
- 150°C
PMEG2010AEB-QF FAQ
1.How can I place an order for PMEG2010AEB-QF through Aetrix?
Please submit a Request for Quotation (RFQ) for PMEG2010AEB-QF on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for PMEG2010AEB-QF reliable?
The price and inventory of PMEG2010AEB-QF are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for PMEG2010AEB-QF is usually 5 days.
3.What payment methods are accepted for PMEG2010AEB-QF?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for PMEG2010AEB-QF transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for PMEG2010AEB-QF?
PMEG2010AEB-QF orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your PMEG2010AEB-QF order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for PMEG2010AEB-QF?
For technical support, including PMEG2010AEB-QF datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your PMEG2010AEB-QF requirements.
6.How does Aetrix verify that PMEG2010AEB-QF is sourced from the original manufacturer or authorized distributors?
All PMEG2010AEB-QF products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that PMEG2010AEB-QF meets industry standards.
7.What is the process for return or replacement of PMEG2010AEB-QF?
All PMEG2010AEB-QF units undergo pre-shipment inspection (PSI). If there is an issue with PMEG2010AEB-QF, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The PMEG2010AEB-QF part is unused and in its original packaging.
Return procedure for PMEG2010AEB-QF:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
PMEG2010AEB-QF Tags

-
1N4448X-TP
Micro Commercial Co

-
1N4148WX-TP
Micro Commercial Co

-
1N4148TR
onsemi

-
MMSD4148T1G
onsemi

-
MMBD914LT3G
onsemi

-
BAS16HT1G
onsemi

-
1N914BWT
onsemi

-
BAS21LT1G
onsemi

-
LL4148
onsemi

-
BAS16LT1G
onsemi

-
MMSD914T1G
onsemi

-
BAV21W-7-F
Diodes Incorporated
Tech Hub
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
