Nexperia USA Inc. PMEG2010AEJ,115
- Part No.:
- PMEG2010AEJ,115
- Manufacturer:
- Nexperia USA Inc.
- Category:
- Single Diodes
- Package:
- SC-90, SOD-323F
- Datasheet:
-
PMEG2010AEJ,115.pdf
- Description:
- DIODE SCHOTTKY 20V 1A SOD323F
- Quantity:
- Payment:

- Shipping:

Inventory:34,396
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
PMEG2010AEJ,115 from Nexperia is a planar Schottky barrier rectifier with integrated guard ring for stress protection, rated at 20 V reverse voltage and 1 A forward current, featuring a typical forward voltage of 480 mV at 1 A (pulsed), housed in an ultra-compact SOD323F (SC-90) surface-mount package. It serves as a low-loss unidirectional current switch in space-constrained DC/DC converters and polarity protection circuits.
For engineers reviewing the PMEG2010AEJ,115 datasheet, PMEG2010AEJ,115 pinout, PMEG2010AEJ,115 application, or PMEG2010AEJ,115 equivalent, key selection criteria include its 480–550 mV VF at 1 A, 20 V VR rating, 50 pF diode capacitance at 1 V, thermal resistance of 150 K/W to solder point, and SC-90 footprint compatibility with high-density PCB layouts.
Technical Context
This Schottky rectifier employs a planar die structure with an integrated guard ring to suppress edge breakdown and improve reliability under transient overvoltage stress. Its low forward voltage stems from optimized metal–semiconductor interface engineering, enabling minimal conduction loss in low-voltage, high-efficiency power paths.
The device operates within a junction temperature range of −65 °C to 150 °C and exhibits reverse leakage of only 15–70 µA at 20 V and 25 °C. Thermal performance is defined relative to two mounting conditions: 350 K/W (free air) and 150 K/W (junction-to-solder-point on FR4 with 1 cm² cathode pad).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Reverse Voltage (VR) | 20 V - Maximum blocking capability before avalanche onset; suitable for ≤12 V rail protection and 5 V/3.3 V DC/DC outputs. |
| Forward Current (IF) | 1 A continuous - Rated for sustained conduction at ambient ≤55 °C; supports compact buck converter output stages. |
| Forward Voltage (VF) | 480–550 mV @ 1 A - Low conduction loss enables >95% efficiency in low-VIN switching regulators. |
| Reverse Leakage (IR) | 15–70 µA @ 20 V - Minimal standby power loss in battery-powered polarity protection circuits. |
| Diode Capacitance (Cd) | 40–50 pF @ 1 V - Enables fast switching with low AC loss in high-frequency (>1 MHz) DC/DC topologies. |
| Junction-to-Solder-Point Rth | 150 K/W - Enables effective heat transfer to PCB copper when cathode pad is sized to 1 cm². |
Pinout & Package
Encapsulated in the SOD323F (SC-90) package - dimensions 1.7 mm × 1.25 mm × 0.7 mm - this 2-terminal surface-mount device uses a flat lead configuration optimized for automated placement and reflow soldering on high-density boards.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 (K) | Cathode | Negative terminal; connects to output/load side in rectification; primary thermal path to PCB via exposed cathode pad. |
| 2 (A) | Anode | Positive terminal; connects to input/source side; carries full forward current with minimal parasitic inductance. |
Key Features
| Feature | Design Value |
|---|---|
| Integrated guard ring | Suppresses edge-related breakdown, improving robustness against ESD and line transients without external clamping. |
| Ultra-low VF at 1 A | 480–550 mV enables <100 mW conduction loss at 1 A, critical for thermally constrained IoT node power supplies. |
| SOD323F footprint | 1.7 mm × 1.25 mm body size allows placement in <2 mm² board area - ideal for wearables and miniaturized adapters. |
| 150 °C max junction temp | Supports operation in sealed enclosures or near heat sources without derating below 55 °C ambient. |
Applications
| USB Power Delivery Protection | Low-Voltage DC/DC Converter Output |
|---|---|
|
Use Scenario: Preventing reverse current flow from downstream USB-C ports during hot-plug events or source arbitration. IC Role / Device Role / Timing Role: Unidirectional current valve placed between VBUS and load, activated only during forward conduction. Use Value: 480 mV VF minimizes voltage drop across protection path, preserving ≥4.8 V at 1 A under tight USB PD tolerance. |
Use Scenario: Rectifying synchronous buck converter output in portable medical sensors operating from single-cell Li-ion. IC Role / Device Role / Timing Role: Freewheeling diode replacing high-side MOSFET in asynchronous topology; conducts during low-side FET off-time. Use Value: 50 pF capacitance and 1 A rating support stable operation up to 2 MHz switching frequency with <50 mV ripple penalty. |
| Inverse Polarity Input Protection | Energy-Harvesting Power Path |
|
Use Scenario: Blocking reverse current when a 3.3 V system is powered by misoriented coin-cell or CR2032 battery. IC Role / Device Role / Timing Role: Series-connected blocking diode in main power rail; zero conduction when polarity is inverted. Use Value: 15–70 µA IR at 20 V ensures <0.2 µW standby loss - extends shelf life of battery-backed memory modules. |
Use Scenario: Managing bidirectional power flow between RF energy harvester and supercapacitor storage in wireless sensor nodes. IC Role / Device Role / Timing Role: Low-loss charge path diode that conducts harvested micropower into storage while isolating capacitor during idle periods. Use Value: 240–270 mV VF at 10 mA enables efficient charging even at sub-100 µW input levels, maximizing energy capture efficiency. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar Schottky rectifier applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| RB520S-30T1G | 30 V VR, 200 mA IF, VF = 370 mV @ 100 mA - lower current rating, higher voltage margin. | Preferred for ≤100 mA bias rails where 30 V headroom is needed; unsuitable for 1 A DC/DC outputs. | Select when VR margin >10 V is required and IF ≤ 200 mA; avoid for power-path rectification above 300 mA. |
| SS12 | 20 V VR, 1 A IF, VF = 550 mV @ 1 A - same rating but DO-214AC package (3.5 mm × 1.5 mm), 3× larger footprint. | Used where thermal mass or hand-solderability outweighs size constraints; incompatible with fine-pitch SMT lines. | Choose only if board assembly lacks SC-90 placement capability or requires higher thermal mass for intermittent 1.5 A surges. |
Compared with RB520S-30T1G and SS12, PMEG2010AEJ,115 uniquely balances 1 A current, 20 V rating, sub-550 mV VF, and 1.7 mm × 1.25 mm footprint - making it optimal for miniaturized, high-efficiency 3.3 V/5 V power rails where board space and thermal resistance are critical.
Availability
PMEG2010AEJ,115 is available at Aetrix Electronics and suitable for USB power delivery protection, low-voltage DC/DC converter outputs, and inverse polarity input protection requiring stable component supply and consistent parametric performance across production lots.
Supply support for PMEG2010AEJ,115 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Nexperia is a global semiconductor expert focused on high-volume, high-reliability essential semiconductors, delivering discrete, logic, and MOSFET solutions for automotive, industrial, and consumer markets.
PMEG2010AEJ,115 belongs to Nexperia's Schottky rectifier product line, engineered specifically for ultra-compact, high-efficiency power management in space- and thermal-constrained portable electronics.
FAQ
What is the maximum allowable junction temperature for PMEG2010AEJ,115?
The absolute maximum junction temperature is 150 °C, as defined in IEC60134 limiting values. Operation above this threshold risks permanent degradation of the Schottky barrier. Derating is required above 55 °C ambient to maintain 1 A continuous current, per thermal resistance data specifying 150 K/W to solder point on a 1 cm² cathode pad.
Can PMEG2010AEJ,115 be used in automotive applications?
No - the datasheet revision history explicitly states this part is non-automotive qualified. It lacks AEC-Q101 qualification and has not undergone automotive-grade stress testing. For automotive use, Nexperia offers Q-qualified variants such as PMEG2010AEJ-Q, which must be selected separately.
How does the integrated guard ring improve reliability?
The guard ring reduces electric field crowding at the silicon periphery, suppressing premature edge breakdown during voltage transients or ESD events. This increases the device's surge robustness without requiring external TVS components, particularly beneficial in USB and battery-input protection circuits subject to plug/unplug spikes.
What is the recommended reflow soldering footprint for SOD323F?
The official Nexperia footprint specifies 0.5 mm × 0.6 mm solder lands for each terminal, with 0.6 mm solder resist openings and 0.5 mm solder paste apertures. The total occupied area matches the 1.7 mm × 1.25 mm body outline, ensuring mechanical stability and thermal transfer while avoiding solder bridging during reflow.
PMEG2010AEJ,115 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Nexperia USA Inc.
- Series:
- -
- Package/Case:
- SC-90, SOD-323F
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Technology:
- Schottky
- Voltage - DC Reverse (Vr) (Max):
- 20 V
- Current - Average Rectified (Io):
- 1A
- Voltage - Forward (Vf) (Max) @ If:
- 550 mV @ 1 A
- Speed:
- Fast Recovery =< 500ns, > 200mA (Io)
- Reverse Recovery Time (trr):
- -
- Current - Reverse Leakage @ Vr:
- 70 µA @ 20 V
- Capacitance @ Vr, F:
- 50pF @ 1V, 1MHz
- Grade:
- Automotive
- Qualification:
- AEC-Q101
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- SOD-323F
- Operating Temperature - Junction:
- 150°C (Max)
PMEG2010AEJ,115 FAQ
1.How can I place an order for PMEG2010AEJ,115 through Aetrix?
Please submit a Request for Quotation (RFQ) for PMEG2010AEJ,115 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for PMEG2010AEJ,115 reliable?
The price and inventory of PMEG2010AEJ,115 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for PMEG2010AEJ,115 is usually 5 days.
3.What payment methods are accepted for PMEG2010AEJ,115?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for PMEG2010AEJ,115 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for PMEG2010AEJ,115?
PMEG2010AEJ,115 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your PMEG2010AEJ,115 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for PMEG2010AEJ,115?
For technical support, including PMEG2010AEJ,115 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your PMEG2010AEJ,115 requirements.
6.How does Aetrix verify that PMEG2010AEJ,115 is sourced from the original manufacturer or authorized distributors?
All PMEG2010AEJ,115 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that PMEG2010AEJ,115 meets industry standards.
7.What is the process for return or replacement of PMEG2010AEJ,115?
All PMEG2010AEJ,115 units undergo pre-shipment inspection (PSI). If there is an issue with PMEG2010AEJ,115, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The PMEG2010AEJ,115 part is unused and in its original packaging.
Return procedure for PMEG2010AEJ,115:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
PMEG2010AEJ,115 Tags

-
1N4448X-TP
Micro Commercial Co

-
1N4148WX-TP
Micro Commercial Co

-
1N4148TR
onsemi

-
MMSD4148T1G
onsemi

-
MMBD914LT3G
onsemi

-
BAS16HT1G
onsemi

-
1N914BWT
onsemi

-
BAS21LT1G
onsemi

-
LL4148
onsemi

-
BAS16LT1G
onsemi

-
MMSD914T1G
onsemi

-
BAV21W-7-F
Diodes Incorporated
Tech Hub
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…

