Nexperia USA Inc. PMEG2010BELD,315
- Part No.:
- PMEG2010BELD,315
- Manufacturer:
- Nexperia USA Inc.
- Category:
- Single Diodes
- Package:
- SOD-882
- Datasheet:
-
PMEG2010BELD,315.pdf
- Description:
- DIODE SCHOTTKY 20V 1A DFN1006-2
- Quantity:
- Payment:

- Shipping:

Inventory:20,610
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
PMEG2010BELD from Nexperia is a planar Schottky barrier rectifier with integrated guard ring for stress protection, designed for low-voltage DC-to-DC conversion and reverse polarity protection. It delivers 1 A average forward current at ≤490 mV forward voltage (IF = 1 A), supports 20 V reverse voltage, and operates in ultra-small DFN1006D-2 (SOD882D) package with solderable side pads.
For engineers reviewing the PMEG2010BELD datasheet, PMEG2010BELD pinout, PMEG2010BELD application, or PMEG2010BELD equivalent, key selection criteria include low VF performance under pulsed 1 A load, thermal resistance to solder point (25 K/W), ultra-thin 0.37 mm profile, and compatibility with reflow-only assembly on FR4 or ceramic PCBs.
Technical Context
This Schottky diode uses a planar die structure with an integrated guard ring to suppress edge breakdown and improve reliability under transient stress. Its low forward voltage stems from optimized metal-semiconductor interface design, enabling high efficiency in space-constrained power rails.
Thermal performance is defined relative to mounting configuration: Rth(j-sp) = 25 K/W (cathode solder point), with junction-to-ambient resistance varying from 110 K/W (ceramic PCB) to 340 K/W (FR4, standard footprint). Reverse recovery time is 1.6 ns - typical for Schottky devices - supporting ultra-high-speed switching without minority-carrier tail current.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VF @ 1 A | 428–490 mV - enables ≥92% efficiency in 3.3 V buck converters at full load |
| VR | 20 V - suitable for 12 V input rails with 50% safety margin against transients |
| IF(AV) | 1 A - rated for continuous operation at 130 °C solder point temperature |
| trr | 1.6 ns - eliminates switching losses in >1 MHz DC-DC topologies |
| Cd @ 1 V | 31–40 pF - minimizes capacitive loading on high-frequency gate drivers or signal paths |
| IR @ 20 V | 87–200 µA - low leakage preserves battery life in always-on low-power systems |
| Rth(j-sp) | 25 K/W - enables direct thermal coupling to PCB copper for passive cooling in compact layouts |
Pinout & Package
Encapsulated in leadless DFN1006D-2 (SOD882D) package: 1.0 mm × 0.6 mm × 0.37 mm body height, side-wettable flanks for automated optical inspection, cathode marked by bar on top surface.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | Cathode (K) | Output node for rectified current; connects to ground or return path; marked by cathode bar |
| 2 | Anode (A) | Input node for unregulated supply; accepts up to 20 V reverse bias during freewheeling |
Key Features
| Feature | Design Value |
|---|---|
| Guard ring integration | Suppresses edge breakdown under voltage transients, improving long-term reliability in noisy automotive/industrial environments |
| Solderable side pads | Enables AOI-compatible reflow inspection and robust mechanical anchoring on fine-pitch PCBs |
| Ultra-low profile (0.37 mm) | Permits use in <1 mm total stack-up applications such as slim mobile displays and wearables |
| Reflow-only assembly | Eliminates need for wave or hand-soldering; compatible with standard lead-free reflow profiles (J-STD-020) |
| Low thermal resistance to solder point | 25 K/W allows direct heat transfer from junction to PCB copper, reducing local hot spots in dense layouts |
Applications
| Mobile LED Backlighting | USB-C Power Path Protection |
|---|---|
Use Scenario: Driving white LEDs from 3.3 V or 5 V boost converter output in smartphones and tablets. IC Role / Device Role / Timing Role: Low-loss freewheeling diode in boost inductor path; handles 1 A peak current pulses at >1 MHz switching frequency. Use Value: 428 mV VF reduces power loss by 300 mW vs. standard Schottky alternatives, extending battery runtime by ~4% in active display mode. |
Use Scenario: Reverse polarity and backfeed protection between dual USB-C ports sharing a common VBUS rail. IC Role / Device Role / Timing Role: Unidirectional blocking element placed in series with each port's VBUS line. Use Value: 20 V VR rating covers USB PD 3.0 20 V profiles; 1.6 ns trr prevents cross-conduction during hot-plug transitions. |
| Point-of-Load DC-DC Converter | IoT Sensor Node Power Management |
Use Scenario: Output rectification in 12 V → 3.3 V synchronous buck converter for FPGA or SoC core rails. IC Role / Device Role / Timing Role: Freewheeling diode complementing high-side MOSFET; conducts during low-side switch off-time. Use Value: Sub-500 mV VF maintains >94% efficiency at 1 A load, reducing thermal load on 2-layer PCBs without heatsinks. |
Use Scenario: Battery backup path isolation in coin-cell powered environmental sensors with BLE radio. IC Role / Device Role / Timing Role: Ideal diode replacement preventing battery discharge through main 3.3 V regulator when external power is applied. Use Value: 87 µA max IR at 20 V ensures <1 µA standby current drain, extending 220 mAh CR2032 battery life beyond 10 years in sleep mode. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar Schottky rectifier applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| RB521S-30T2R | 30 V VR, 200 mA IF(AV), SOD-523 package (1.2 × 0.8 mm), VF = 370 mV @ 100 mA | Lower current rating and higher VF at 1 A makes it unsuitable for 1 A continuous loads; better for signal-level clamping | Select only if VR margin >10 V required and average current <200 mA |
| NSR20F20NXT5G | 20 V VR, 2 A IF(AV), SOD-123FL package (2.9 × 1.5 mm), VF = 450 mV @ 2 A, Rth(j-a) = 150 K/W | Larger footprint and 2× height (0.9 mm) limit use in ultra-thin designs; higher thermal resistance requires larger copper area | Choose when 2 A derated current or enhanced surge handling (IFSM = 30 A) is needed over size constraints |
Compared with RB521S-30T2R and NSR20F20NXT5G, PMEG2010BELD uniquely balances 1 A capability, sub-0.5 mm height, and 25 K/W junction-to-solder-point thermal resistance - making it optimal for space-limited, thermally constrained 1 A DC-DC outputs where board real estate and profile are primary constraints.
Availability
PMEG2010BELD is available at Aetrix Electronics and suitable for mobile LED backlighting, USB-C power path protection, and point-of-load DC-DC conversion requiring stable component supply across high-mix production runs.
Supply support for PMEG2010BELD includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Nexperia is a global semiconductor expert delivering high-performance, reliable discrete, logic, and MOSFET devices with focus on efficiency, miniaturization, and manufacturability.
This device belongs to Nexperia's low-VF Schottky rectifier product line, engineered specifically for high-efficiency, ultra-compact power conversion in portable and battery-powered electronics.
FAQ
Is PMEG2010BELD suitable for automotive applications?
No. Per Nexperia's revision history (v.3, Nov 2022), this part is explicitly non-automotive qualified. It lacks AEC-Q101 stress testing and automotive-grade process controls. For automotive use, select the -Q qualified variant (e.g., PMEG2010BELD-Q) or consult Nexperia's automotive portfolio.
What is the maximum allowable solder point temperature during reflow?
The absolute maximum solder point temperature is not specified, but the datasheet mandates reflow-only assembly with Tsp ≤ 130 °C for 1 A continuous operation. Peak reflow temperature must comply with J-STD-020 Class 1 (≤260 °C for ≤10 s), and post-reflow solder joint integrity is validated only under these conditions.
Can PMEG2010BELD replace a standard PN junction diode in a 5 V supply rail?
Yes - provided VR ≥ 5 V and IF(AV) ≤ 1 A. Its 20 V VR and 1 A rating exceed typical 5 V rail requirements, and its 428 mV VF reduces conduction loss by ~55% versus a 1N4007 (VF ≈ 950 mV @ 1 A), directly improving system efficiency and thermal performance.
Does the cathode marking bar indicate polarity during PCB layout?
Yes. The marking bar on the top surface aligns with Pin 1 (cathode), as confirmed in Table 2 (Pinning information) and Figure 17 (package outline). Correct orientation ensures forward conduction from anode (Pin 2) to cathode (Pin 1); reversed placement causes open-circuit behavior in rectification paths.
PMEG2010BELD,315 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Nexperia USA Inc.
- Series:
- -
- Package/Case:
- SOD-882
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Technology:
- Schottky
- Voltage - DC Reverse (Vr) (Max):
- 20 V
- Current - Average Rectified (Io):
- 1A
- Voltage - Forward (Vf) (Max) @ If:
- 490 mV @ 1 A
- Speed:
- Fast Recovery =< 500ns, > 200mA (Io)
- Reverse Recovery Time (trr):
- 1.6 ns
- Current - Reverse Leakage @ Vr:
- 200 µA @ 20 V
- Capacitance @ Vr, F:
- 40pF @ 1V, 1MHz
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- DFN1006-2
- Operating Temperature - Junction:
- 150°C (Max)
PMEG2010BELD,315 FAQ
1.How can I place an order for PMEG2010BELD,315 through Aetrix?
Please submit a Request for Quotation (RFQ) for PMEG2010BELD,315 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for PMEG2010BELD,315 reliable?
The price and inventory of PMEG2010BELD,315 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for PMEG2010BELD,315 is usually 5 days.
3.What payment methods are accepted for PMEG2010BELD,315?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for PMEG2010BELD,315 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for PMEG2010BELD,315?
PMEG2010BELD,315 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your PMEG2010BELD,315 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for PMEG2010BELD,315?
For technical support, including PMEG2010BELD,315 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your PMEG2010BELD,315 requirements.
6.How does Aetrix verify that PMEG2010BELD,315 is sourced from the original manufacturer or authorized distributors?
All PMEG2010BELD,315 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that PMEG2010BELD,315 meets industry standards.
7.What is the process for return or replacement of PMEG2010BELD,315?
All PMEG2010BELD,315 units undergo pre-shipment inspection (PSI). If there is an issue with PMEG2010BELD,315, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The PMEG2010BELD,315 part is unused and in its original packaging.
Return procedure for PMEG2010BELD,315:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
PMEG2010BELD,315 Tags

-
1N4448X-TP
Micro Commercial Co

-
1N4148WX-TP
Micro Commercial Co

-
1N4148TR
onsemi

-
MMSD4148T1G
onsemi

-
MMBD914LT3G
onsemi

-
BAS16HT1G
onsemi

-
1N914BWT
onsemi

-
BAS21LT1G
onsemi

-
LL4148
onsemi

-
BAS16LT1G
onsemi

-
MMSD914T1G
onsemi

-
BAV21W-7-F
Diodes Incorporated
Tech Hub
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…

