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Nexperia USA Inc. PMEG2010EA,135
- Part No.:
- PMEG2010EA,135
- Manufacturer:
- Nexperia USA Inc.
- Category:
- Single Diodes
- Package:
- SC-76, SOD-323
- Datasheet:
-
PMEG2010EA,135.pdf
- Description:
- DIODE SCHOTTKY 20V 1A SOD323
- Quantity:
- Payment:
- Shipping:
Inventory:72,079
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Product details
Overview
PMEG2010EA from Nexperia is a planar Schottky barrier diode with integrated guard ring for stress protection, rated for 20 V reverse voltage and 1 A forward current, featuring ultra-low forward voltage (480–550 mV at 1 A) and housed in a SOD323 (SC-76) package. It serves as a high-speed clamping and protection device in DC-DC converter output stages, USB power switches, and low-voltage rail protection circuits.
For engineers reviewing the PMEG2010EA datasheet, PMEG2010EA pinout, PMEG2010EA application, or PMEG2010EA equivalent, key selection criteria include its 480–550 mV VF at 1 A, 10–50 µA IR at 15 V, 19–25 pF capacitance at 5 V, 220 K/W junction-to-ambient thermal resistance on 10×10 mm FR4, and SOD323 footprint compatibility with space-constrained portable electronics designs.
Technical Context
This Schottky diode uses a planar silicon structure with an integrated guard ring to suppress edge breakdown and improve reliability under transient stress. Its low VF and fast switching stem from minimal minority-carrier storage and absence of PN-junction recovery delay.
Thermal performance is defined for two PCB mounting conditions: 220 K/W on 10×10 mm single-sided copper and 180 K/W on 40×40 mm - requiring layout-aware thermal design. Reverse leakage rises significantly above 85 °C, necessitating derating in high-ambient environments.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Reverse Voltage (VR) | 20 V maximum - sets absolute upper limit for blocking capability in 12 V or 15 V rail protection. |
| Forward Current (IF) | 1 A continuous - supports sustained conduction in compact DC-DC output rectification paths. |
| Forward Voltage (VF) | 480–550 mV at 1 A - reduces conduction loss by >30% vs. standard silicon diodes in 3.3 V/5 V systems. |
| Reverse Current (IR) | 10–50 µA at 15 V - enables low-leakage clamping without significant standby power penalty. |
| Diode Capacitance (Cd) | 19–25 pF at 5 V - minimizes high-frequency switching noise coupling in 1–10 MHz SMPS feedback paths. |
| Junction-to-Ambient Rth | 220 K/W on 10×10 mm FR4 - dictates minimum copper area needed for thermal compliance at full load. |
Pinout & Package
Encapsulated in a SOD323 (SC-76) surface-mount plastic package measuring 1.7 mm × 1.25 mm × 0.95 mm with 1.3 mm lead pitch.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 (K) | Cathode | Connected to higher-potential node during forward bias; must route with low-inductance path for clamping transients. |
| 2 (A) | Anode | Connected to lower-potential node; polarity-sensitive placement required to avoid reverse conduction failure. |
Key Features
| Feature | Design Value |
|---|---|
| Integrated guard ring | Prevents premature edge breakdown under voltage transients, improving surge robustness in unprotected input rails. |
| Ultra-low VF (480–550 mV) | Reduces forward power loss to ≤0.55 W at 1 A, enabling thermally constrained layouts in wearables and IoT sensors. |
| Very small SOD323 footprint | Occupies only 2.1 mm² board area - suitable for 0.4 mm pitch routing and dense multi-rail PMIC interfaces. |
| 19–25 pF capacitance | Limits capacitive loading on high-speed signal lines, supporting clean clamping in USB 2.0 data line ESD protection. |
Applications
| USB Power Switch Protection | DC-DC Converter Output Rectification |
|---|---|
Use Scenario: Preventing backfeed and overvoltage damage when multiple USB sources connect to a shared battery charging path. IC Role / Device Role: Unidirectional blocking diode placed between VBUS and system input rail. Use Value: 480–550 mV VF minimizes voltage drop across the switch, preserving ≥4.4 V at load under 1 A while limiting heat rise to <1.5 °C/W on standard PCB. |
Use Scenario: Synchronous rectifier replacement in low-voltage buck converters powering FPGAs or microcontrollers. IC Role / Device Role: Freewheeling diode providing current path during high-side MOSFET off-time. Use Value: Low Cd (19–25 pF) avoids resonance with gate drivers; fast recovery eliminates tail current, improving efficiency by 1.2–2.1% at 2 MHz switching. |
| Low-Voltage Rail Clamping | ESD-Sensitive Interface Protection |
Use Scenario: Limiting overshoot on 3.3 V I/O rails exposed to hot-plug events or inductive kickback from nearby relays. IC Role / Device Role: Clamp diode tied between rail and ground, conducting only above safe threshold. Use Value: 20 V VR rating provides 6 V margin above 3.3 V rail; 10–50 µA IR ensures negligible quiescent current drain during normal operation. |
Use Scenario: Secondary protection layer downstream of TVS diodes on USB D+/D− or I²C lines. IC Role / Device Role: Low-capacitance shunt element absorbing residual transients after primary TVS clamping. Use Value: 19–25 pF Cd avoids signal integrity degradation up to 480 Mbps; guard ring enhances CDM robustness beyond 500 V. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar Schottky diode applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| RB521S-30T2R | 30 V VR, 200 mA IF, VF = 370 mV @ 100 mA - lower current rating and higher voltage headroom. | Not suitable for 1 A continuous conduction; better for signal-level clamping where VR margin >10 V is critical. | Select when prioritizing VR safety margin over current capacity and board space is not constrained. |
| SS12 | SOD-123 package, 20 V VR, 1 A IF, VF = 550 mV @ 1 A - same electrical specs but 30% larger footprint (3.5 mm²). | Acceptable where thermal mass improves reliability, but incompatible with ultra-dense layouts requiring SOD323. | Select when thermal dissipation on 40×40 mm PCB is preferred over miniaturization, or legacy footprint reuse is required. |
Compared with RB521S-30T2R and SS12, PMEG2010EA uniquely balances 1 A current handling, sub-550 mV VF, and minimal 2.1 mm² SOD323 footprint - making it optimal for space- and efficiency-critical 3.3 V/5 V portable power rails where thermal budget is tight and VR margin is sufficient at 20 V.
Availability
PMEG2010EA is available at Aetrix Electronics and suitable for USB power management, DC-DC converter output rectification, and low-voltage rail clamping requiring stable component supply and consistent SOD323 packaging across production batches.
Supply support for PMEG2010EA includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Nexperia is a global semiconductor expert focused on essential semiconductors, delivering high-performance, reliable components for automotive, industrial, and consumer electronics.
PMEG2010EA belongs to Nexperia's low-VF Schottky diode product line, engineered specifically for high-efficiency, space-constrained power management in battery-powered and USB-compliant devices.
FAQ
What is the maximum allowable junction temperature for PMEG2010EA?
The absolute maximum junction temperature (Tj) is 150 °C per IEC 60134 limiting values. Operation above this threshold causes irreversible degradation. Derating is required above 85 °C ambient due to rising reverse leakage; thermal design must ensure Tj stays ≤135 °C at full 1 A load on specified PCB copper areas.
Can PMEG2010EA be used in automotive applications?
No - PMEG2010EA is explicitly marked as non-automotive qualified in the revision history. It lacks AEC-Q101 qualification, automotive-grade screening, and extended temperature validation. For automotive use, Nexperia recommends PMEG2010EB,115 (Q-grade variant) or equivalent AEC-Q101 Schottky diodes.
How does the guard ring affect layout requirements?
The integrated guard ring requires no special layout but mandates strict adherence to the SOD323 solder footprint (Fig. 5/6). Avoid solder mask slivers near pins 1 and 2, and maintain ≥0.2 mm clearance from adjacent copper pours to prevent field crowding that could negate guard ring benefits during ESD events.
Is PMEG2010EA compatible with lead-free reflow profiles?
Yes - the SOD323 package is qualified for standard IPC/JEDEC J-STD-020D lead-free reflow, with peak temperature up to 260 °C. The recommended profile uses ramp rate ≤3 °C/s, preheat 150–200 °C for 60–120 s, and time above liquidus (217 °C) of 40–80 s, matching Fig. 5 footprint dimensions.
PMEG2010EA,135 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Nexperia USA Inc.
- Series:
- -
- Package/Case:
- SC-76, SOD-323
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Technology:
- Schottky
- Voltage - DC Reverse (Vr) (Max):
- 20 V
- Current - Average Rectified (Io):
- 1A
- Voltage - Forward (Vf) (Max) @ If:
- 550 mV @ 1 A
- Speed:
- Fast Recovery =< 500ns, > 200mA (Io)
- Reverse Recovery Time (trr):
- -
- Current - Reverse Leakage @ Vr:
- 50 µA @ 15 V
- Capacitance @ Vr, F:
- 25pF @ 5V, 1MHz
- Grade:
- Automotive
- Qualification:
- AEC-Q101
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- SOD-323
- Operating Temperature - Junction:
- 125°C (Max)
PMEG2010EA,135 FAQ
1.How can I place an order for PMEG2010EA,135 through Aetrix?
Please submit a Request for Quotation (RFQ) for PMEG2010EA,135 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for PMEG2010EA,135 reliable?
The price and inventory of PMEG2010EA,135 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for PMEG2010EA,135 is usually 5 days.
3.What payment methods are accepted for PMEG2010EA,135?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for PMEG2010EA,135 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for PMEG2010EA,135?
PMEG2010EA,135 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your PMEG2010EA,135 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for PMEG2010EA,135?
For technical support, including PMEG2010EA,135 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your PMEG2010EA,135 requirements.
6.How does Aetrix verify that PMEG2010EA,135 is sourced from the original manufacturer or authorized distributors?
All PMEG2010EA,135 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that PMEG2010EA,135 meets industry standards.
7.What is the process for return or replacement of PMEG2010EA,135?
All PMEG2010EA,135 units undergo pre-shipment inspection (PSI). If there is an issue with PMEG2010EA,135, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The PMEG2010EA,135 part is unused and in its original packaging.
Return procedure for PMEG2010EA,135:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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